利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

90 条记录 (耗时 0.029 秒)

    Method of manufacturing package substrate for optical element
    51.
    发明授权
    Method of manufacturing package substrate for optical element 有权
    制造光学元件封装基板的方法

    公开(公告)号：US08603842B2

    公开(公告)日：2013-12-10

    申请号：US13418241

    申请日：2012-03-12

    申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    IPC分类号： H01L33/62

    CPC分类号： H01L33/54 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

    摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。

    Arrowhead having expanding blades controlled by gear mechanism
    52.
    发明授权
    Arrowhead having expanding blades controlled by gear mechanism 有权
    具有由齿轮机构控制的扩张叶片的箭头

    公开(公告)号：US08529385B1

    公开(公告)日：2013-09-10

    申请号：US13479073

    申请日：2012-05-23

    申请人： Young Ki Lee

    发明人： Young Ki Lee

    IPC分类号： F42B6/08

    CPC分类号： F42B6/08

    摘要： Disclosed is an arrowhead in which a plurality of expandable blades can be quickly and reliably retracted or expanded without using an additional means to bundle the expanding blades, thereby enhancing the penetrating capability or killing capability of an arrow. Particularly, a portion of a shaft forming the arrowhead is provided with a rack gear portion formed thereon and a lower end of each of the expanding blades is provided with a pinion gear portion, such that the rack gear portion and the pinion gear portion engage with each other and such a rack-pinion action controls the operation of retracting or expanding the expanding blades.

    摘要翻译： 公开了一种箭头，其中可以快速且可靠地缩回或扩展多个可扩展叶片，而不需要使用附加装置来捆扎扩张刀片，从而增强箭头的穿透能力或杀伤能力。 特别地，形成箭头的轴的一部分设置有形成在其上的齿条部分，并且每个扩展叶片的下端设置有小齿轮部分，使得齿条部分和小齿轮部分与 彼此并且这种齿条 - 小齿轮动作控制缩回或扩大扩张刀片的操作。

    Light emitting diode package having anodized insulation layer and fabrication method therefor
    54.
    发明授权
    Light emitting diode package having anodized insulation layer and fabrication method therefor 有权
    具有阳极氧化绝缘层的发光二极管封装及其制造方法

    公开(公告)号：US08304279B2

    公开(公告)日：2012-11-06

    申请号：US13220258

    申请日：2011-08-29

    申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    IPC分类号： H01L21/00

    CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

    摘要翻译： 一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。 封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

    Light emitting device package and method of manufacturing the same
    55.
    发明授权
    Light emitting device package and method of manufacturing the same 有权
    发光器件封装及其制造方法

    公开(公告)号：US08299692B2

    公开(公告)日：2012-10-30

    申请号：US12213241

    申请日：2008-06-17

    申请人： Young Ki Lee ,  Seog Moon Choi ,  Hyung Jin Jeon ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seog Moon Choi ,  Hyung Jin Jeon ,  Sang Hyun Shin

    IPC分类号： H01J1/62 ,  H01J9/02 ,  H01L31/00

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48227

    摘要： The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

    摘要翻译： 本发明涉及一种发光器件封装及其制造方法。 提供了一种包括金属芯的发光器件封装; 形成在金属芯上的绝缘层; 形成在所述绝缘层上的金属层; 通过去除金属层和绝缘层的部分以暴露金属芯的顶表面而形成的第一腔; 以及直接安装在第一腔中的金属芯的顶表面上的发光器件，并且还提供了制造发光器件封装的方法。

    INSULATION STRUCTURE FOR HIGH TEMPERATURE CONDITIONS AND MANUFACTURING METHOD THEREOF
    57.
    发明申请
    INSULATION STRUCTURE FOR HIGH TEMPERATURE CONDITIONS AND MANUFACTURING METHOD THEREOF 审中-公开
    高温条件绝缘结构及其制造方法

    公开(公告)号：US20110260198A1

    公开(公告)日：2011-10-27

    申请号：US13177276

    申请日：2011-07-06

    申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    IPC分类号： H01L33/60

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K3/28 ,  H05K2203/0315 ,  H05K2203/0542

    摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device.A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

    摘要翻译： 一种用于高温条件的绝缘结构及其制造方法。 在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。 通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

    PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME
    58.
    发明申请
    PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    用于光学元件的封装基板及其制造方法

    公开(公告)号：US20110140144A1

    公开(公告)日：2011-06-16

    申请号：US12721539

    申请日：2010-03-10

    申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

    IPC分类号： H01L33/00 ,  H01L31/00

    CPC分类号： H01L33/54 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

    摘要翻译： 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。

    PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME
    59.
    发明申请
    PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    用于光学元件的封装基板及其制造方法

    公开(公告)号：US20110101392A1

    公开(公告)日：2011-05-05

    申请号：US12642326

    申请日：2009-12-18

    申请人： Sung Keun Park ,  Seog Moon Choi ,  Young Ki Lee ,  Chang Hyun Lim

    发明人： Sung Keun Park ,  Seog Moon Choi ,  Young Ki Lee ,  Chang Hyun Lim

    IPC分类号： H01L33/00 ,  H01L21/56

    CPC分类号： H01L33/50 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： Disclosed is a package substrate for an optical element, which includes a metal core having a hole formed therein, an insulating layer formed on the surface of the metal core, a first metal layer formed to a predetermined thickness on the surface of the insulating layer so as to include therein the metal core insulated by the insulating layer, an optical element mounted on the first metal layer, and a fluorescent resin material applied on the optical element in order to protect the optical element, thereby simplifying a package substrate process and improving light uniformity, light reflectivity and heat dissipating properties compared to a conventional configuration. A method of manufacturing the package substrate is also provided.

    摘要翻译： 公开了一种用于光学元件的封装基板，其包括其中形成有孔的金属芯，形成在金属芯的表面上的绝缘层，在绝缘层的表面上形成为预定厚度的第一金属层， 在其中包括由绝缘层绝缘的金属芯，安装在第一金属层上的光学元件和施加在光学元件上的荧光树脂材料，以保护光学元件，从而简化了封装衬底处理和改善光 均匀性，光反射率和散热特性。 还提供了制造封装基板的方法。

    Processing method of data stream using border monitoring query
    60.
    发明授权
    Processing method of data stream using border monitoring query 有权
    使用边界监控查询的数据流处理方法

    公开(公告)号：US07895188B2

    公开(公告)日：2011-02-22

    申请号：US11741923

    申请日：2007-04-30

    申请人： Jin Won Lee ,  Young Ki Lee ,  Seung Woo Kang ,  Sang Jeong Lee ,  Hyun Ju Jin ,  Byung Jip Kim ,  June Hwa Song

    发明人： Jin Won Lee ,  Young Ki Lee ,  Seung Woo Kang ,  Sang Jeong Lee ,  Hyun Ju Jin ,  Byung Jip Kim ,  June Hwa Song

    IPC分类号： G06F7/00 ,  G06F17/30

    CPC分类号： G06F17/30675

    摘要： The present invention relates to a processing method of data stream using Border Monitoring Query, and more particularly a monitoring method and a system for data streams which are a large volume of data and continuously generated such as financial ticker, GPS data or a ubiquitous sensor network (USN).The objectives of the present invention are to process a large number of BMQs over data streams in high-performance and scalable manner. For this purpose, the invention presents BMQ-Index, a scalable and high performance data stream monitoring framework. The main idea of BMQ-Index is shared and incremental processing. For shared processing, BMQ-Index adopts a query indexing approach, thereby achieving a high level of scalability. Once BMQ-Index is built on registered queries, only relevant queries are quickly searched for upon an incoming data. For incremental processing, BMQ-Index employs an incremental access method, i.e., an index structure to store delta query information and an incremental search algorithm. Thus, successive BMQ evaluations are greatly accelerated.

    摘要翻译： 本发明涉及使用边界监视查询的数据流的处理方法，更具体地说，涉及一种数据流的监视方法和系统，该数据流是大量的数据并连续生成的，例如金融报价单，GPS数据或普遍存在的传感器网络 （USN）。 本发明的目标是以高性能和可扩展的方式处理数据流上的大量BMQ。 为此，本发明提出了可扩展和高性能的数据流监测框架BMQ-Index。 BMQ-Index的主要思想是共享和增量处理。 对于共享处理，BMQ-Index采用查询索引方式，从而实现了高度的可扩展性。 一旦BMQ-Index建立在注册查询上，只有在输入数据时快速搜索相关查询。 对于增量处理，BMQ-Index使用增量访问方法，即用于存储增量查询信息和增量搜索算法的索引结构。 因此，连续的BMQ评估大大加快。