摘要:
A system and method for generating random noise for use in testing electronic devices comprises a first random pattern generator circuit for generating first sets of random bit pattern signals; one or more delay devices each receiving a trigger input signal and a random bit pattern signal set for generating in response a respective delay output signal, each delay output signal being delayed in time with respect to a respective trigger signal, a delay time being determined by the bit pattern set received; and, an oscillator circuit device associated with a respective one or more delay devices for receiving a respective delay output signal therefrom and generating a respective oscillating signal, each oscillator signal generated being used to generate artificial random noise for emulating a real noise environment in an electronic device. A second random pattern generator circuit may be provided for generating second sets of random bit pattern signals for receipt by each of the associated oscillator circuit devices in order to frequency adjust in a random manner, each of the oscillator signals.
摘要:
A system on a chip (SOC voltage generator) system is provided for supplying at least one voltage level to a plurality of units on a chip having an SOC design. The system includes a plurality of local DC voltage generators distributed throughout the chip, each local DC voltage generator independently supplying voltage to at least one unit of the plurality of units, each local DC voltage generator including a regulator system outputting one pump control signal; and a pump system receiving the one pump control signal and outputting at least one voltage level in accordance with the one pump control signal. Furthermore a method for supplying voltage to a plurality of units on a chip having an SOC design is provided. The method includes the steps of distributing a plurality of local DC voltage generators throughout the chip; and supplying at least one voltage level to the plurality of units via the plurality of local DC voltage generators.
摘要:
Hierarchical built-in self-test methods and arrangement for verifying system functionality. As a result, an effective built-in self-test methodology is provided for conducting complete system-on-chip testing, to ensure both the circuit reliability and performance of system-on-chip design. As an added advantage, development costs are reduced for system-on-chip applications.
摘要:
A method and structure for a photodiode array comprising a plurality of photodiode cores, light sensing sidewalls along an exterior of the cores, logic circuitry above the cores, trenches separating the cores, and a transparent material in the trenches is disclosed. With the invention, the sidewalls are perpendicular to the surface of the photodiode that receives incident light. The light sensing sidewalls comprise a junction region that causes electron transfer when struck with light. The sidewalls comprise four vertical sidewalls around each island core. The logic circuitry blocks light from the core so light is primarily only sensed by the sidewalls.
摘要:
A multi-port memory array is associated with wordlines and bit-lines to perform data read/write operation and has multi-port memory cells each of which includes multiple ports through which the wordlines and bit-lines are provided, multiple transistor devices each of which corresponds to each of the multiple ports and is coupled to a wordline and a bit-line through a corresponding port, each transistor device being gated by a wordline and having a conduction path of which a first end is connected to a bit-line, and a charge storage device commonly connected to a second end of a conduction path of each of the transistor devices, where the charge storage device is charged when any of the plurality of transistor devices is activated. A system for addressing the multi-port memory array includes a conflict detector for detecting a conflict between two or more of the row address signals to generate a conflict control signal corresponding to the conflict detected, a priority logic circuit for performing a logic operation with respect to the request command signals based on a predetermined priority logic to generate prioritized signals, and a selection unit for selecting one of a request command signal and a prioritized signal corresponding to the request command signal in response to the conflict control signal, where a signal selected by the selection unit selects a corresponding one of the row address signals.
摘要:
A semiconductor memory system fabricated on one substrate is presented including an SRAM device, a DRAM device and a Flash memory device. In one embodiment the SRAM device is a high-resistive load SRAM device. In another embodiment the DRAM device is a deep trench DRAM device. A method is also presented for fabricating the memory system on one substrate having the SRAM device, the DRAM device and the Flash memory device.
摘要:
An integrated redundancy eDRAM architecture system for an embedded DRAM macro system having a wide data bandwidth and wide internal bus width is disclosed which provides column and row redundancy for defective columns and rows of the eDRAM macro system. Internally generated column and row addresses of defective columns and rows of each micro-cell block are stored in a memory device, such as a fuse bank, during an eDRAM macro test mode in order for the information to be quickly retrieved during each cycle of eDRAM operation to provide an SRAM-like operation. A column steering circuit steers column redundant elements to replace defective column elements. Redundancy information is either supplied from a SRAM fuse data storage device or from a TAG memory device depending on whether a read or write operation, respectively, is being performed. The integrated redundancy eDRAM architecture system enables data to be sent and received to and from the eDRAM macro system without adding any extra delay to the data flow, thereby protecting data flow pattern integrity.
摘要:
A voltage control system and methodology for maintaining internally generated voltage levels in a semiconductor chip. The method comprises the steps of intermittently sampling an internal voltage supply level during a low power or “sleep” mode of operation; comparing the internal voltage supply level against a predetermined voltage reference level; and, activating a voltage supply generator for increasing the internal voltage supply level when the internal voltage supply level falls below the predetermined voltage reference level. The voltage supply generator is subsequently deactivated when the voltage supply level is restored to the predetermined voltage reference level. The sampling cycle may be appropriately tailored according to chip condition, chip temperature, and chip size. In one embodiment, the voltage control system and methodology is implemented in DRAM circuits during a refresh operation. The voltage levels that are suitable for sampling including DRAM band-gap reference voltage, boost wordline line voltage, wordline low voltage, bitline high voltage and bitline equalization voltages.
摘要:
A method of forming a semiconductor device, includes forming at least one conductive island having a predetermined sidewall angle in a conductive substrate, forming a dielectric material over the at least one island, forming a conductive material over the dielectric material, and forming a contact to the conductive material and the at least one island.
摘要:
A chip packaging system and method for providing enhanced thermal cooling including a first embodiment wherein a diamond thin film is used to replace at least the surface layer of the existing packaging material in order to form a highly heat conductive path to an associated heat sink. An alternative embodiment provides diamond thin film layers disposed on adjacent surfaces of the chip and the chip package. Yet another alternative embodiment includes diamond thin film layers on adjacent chip surfaces in a chip-to-chip packaging structure. A final illustrated embodiment provides for the use of an increased number of solder balls disposed in at least one diamond thin film layer on at least one of a chip and a chip package joined with standard C4 technology.