公开(公告)号：US20210167263A1

公开(公告)日：2021-06-03

申请号：US17103719

申请日：2020-11-24

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Yuichi YAMADA ,  Shinsaku IKUTA ,  Takeshi TAMURA

IPC: H01L33/60 ,  F21V3/06 ,  H01L33/54

Abstract: A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.

公开(公告)号：US20210140607A1

公开(公告)日：2021-05-13

申请号：US17150474

申请日：2021-01-15

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Yuichi YAMADA

IPC: F21V7/00 ,  H01L33/62 ,  H01L33/54 ,  H01L33/50

Abstract: A light-emitting device includes: a base member that includes conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.

公开(公告)号：US20210104502A1

公开(公告)日：2021-04-08

申请号：US17125408

申请日：2020-12-17

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  F21V7/05 ,  F21V7/22 ,  H01L33/60

Abstract: A light-emitting device includes a base member, conductor wiring on an upper surface of the base member, a reflective member covering the upper surfaces of the base member and the conductor wiring and having apertures to expose part of the upper surface of the base member and part of the upper surface of the conductor wiring, a plurality of light sources bonded to the part of the upper surface of the conductor wiring located in the apertures with bonding members, and a reflector that is disposed on the reflective member and includes a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the first surrounding portions, which respectively surround the light sources in a plan view. Each surrounding portion has inclined lateral surfaces that widen in an upward direction. An aperture in each second surrounding portion is smaller than an aperture in each first surrounding portion in the plan view.

公开(公告)号：US20200309344A1

公开(公告)日：2020-10-01

申请号：US16903774

申请日：2020-06-17

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA

IPC: F21V7/00 ,  H01L33/56 ,  H01L33/50 ,  H01L33/46 ,  H01L33/00 ,  H01L25/075

Abstract: A light-emitting device includes a base member, a plurality of light sources on or above an upper surface of the base member, and a reflector that comprises a plurality of surrounding portions. Each of the plurality of surrounding portions surrounds a respective one of the plurality of light sources in a plan view. Each of the plurality of surrounding portions has inclined lateral surfaces widened upward. Intervals between adjacent ones of the plurality of light sources are constant in the plan view. Upper peripheries of the inclined lateral surfaces of each of the plurality of surrounding portions define an opening having a substantially rectangular shape. The plurality of surrounding portions include a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the plurality of first surrounding portions. An area of the opening of each of the plurality of second surrounding portions is smaller than an area of the opening of each of the plurality of first surrounding portions.

公开(公告)号：US20200096175A1

公开(公告)日：2020-03-26

申请号：US16696494

申请日：2019-11-26

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Takeshi TAMURA ,  Hiroshi FUJIMORI

IPC: F21V7/22 ,  F21V13/08 ,  F21V7/00 ,  F21V9/30 ,  G02F1/1335

Abstract: A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; a light diffusion plate; a half mirror positioned between the light diffusion plate and the plurality of light sources; and a plurality of diffuse reflectors positioned between the mounting board and the light diffusion plate, and above at least part of each emission face of the plurality of light sources. The diffuse reflectors comprise a resin, and particles dispersed in the resin. Each of the diffuse reflectors is positioned in an area that, in the top view, is larger than and includes the emission face of each light source. A density of the particles in said area, in the top view, is higher in a first portion located immediately above the emission face of each light source than in a second portion located around a periphery of the first portion.

公开(公告)号：US20190326472A1

公开(公告)日：2019-10-24

申请号：US16458664

申请日：2019-07-01

Applicant: Nichia Corporation

Inventor： Isamu NIKI ,  Motokazu YAMADA ,  Masahiko SANO ,  Shuji SHIOJI

IPC: H01L33/16 ,  H01L21/02 ,  H01L33/00 ,  H01L33/20 ,  H01L33/32 ,  H01L33/26 ,  H01L33/22

Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.

公开(公告)号：US20190211996A1

公开(公告)日：2019-07-11

申请号：US16352388

申请日：2019-03-13

Applicant: NICHIA CORPORATION

Inventor： Takeshi TAMURA ,  Hiroshi FUJIMORI ,  Motokazu YAMADA

IPC: F21V13/08 ,  G02F1/1335 ,  F21V3/02 ,  F21V7/00 ,  H01L25/075 ,  F21V9/08

CPC classification number: F21V13/08 ,  F21V3/02 ,  F21V7/0083 ,  F21V9/08 ,  F21Y2115/10 ,  G02F1/133602 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133608 ,  G02F1/133611 ,  G02F2001/133607 ,  H01L25/0753 ,  H01L33/60

Abstract: A light emitting device includes a mounting board on which a plurality of light sources are disposed; a partitioning member surrounding the light sources and including a plurality of walls that include top parts and form a plurality of areas; a diffuser sheet provided above the partitioning member and supported directly or indirectly by at least one of the top parts; a plurality of first reflectors provided directly above the light sources and positioned on one of an upper surface and a lower surface of the diffuser sheet; a second reflector provided directly above the top parts and positioned on one of the upper surface and the lower surface of the diffuser sheet; and a wavelength conversion sheet positioned above the diffuser sheet. The first reflectors contain a light absorbing material that absorbs at least part of a wavelength of light from the light sources.

公开(公告)号：US20180366617A1

公开(公告)日：2018-12-20

申请号：US16111239

申请日：2018-08-24

Applicant: NICHIA CORPORATION

Inventor： Yuichi YAMADA ,  Motokazu YAMADA

IPC: H01L33/46

CPC classification number: H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204

Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A light-transmissive covering member is provided on the sapphire substrate to sandwich the sapphire substrate between the semiconductor layer and the reflecting film. A light emitted from the semiconductor layer is configured to be extracted from the sapphire substrate between the semiconductor layer and the reflecting film. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member.

公开(公告)号：US20180215113A1

公开(公告)日：2018-08-02

申请号：US15925848

申请日：2018-03-20

Applicant: NICHIA CORPORATION

Inventor： Motokazu YAMADA ,  Masakazu KOTANI ,  Tetsuji SEINO ,  Shinsaku IKUTA

IPC: B29D11/00 ,  H01L33/00 ,  B29K83/00 ,  B29L31/34 ,  B29K105/04

CPC classification number: B29D11/00865 ,  B29D11/0074 ,  B29D11/00807 ,  B29K2083/00 ,  B29K2105/04 ,  B29K2995/0018 ,  B29L2031/3481 ,  H01L33/00 ,  H01L33/505 ,  H01L33/54 ,  H01L2933/005

Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis.

公开(公告)号：US20180180263A1

公开(公告)日：2018-06-28

申请号：US15901765

申请日：2018-02-21

Applicant: NICHIA CORPORATION

Inventor： Yasuo FUJIKAWA ,  Takuya WASA ,  Tomohiro IKEDA ,  Yohei INAYOSHI ,  Motokazu YAMADA

IPC: F21V19/00 ,  G02F1/1335 ,  H01L25/075 ,  F21Y103/10 ,  F21Y105/16 ,  F21Y113/00 ,  F21Y115/10 ,  H05K1/18

CPC classification number: F21V19/005 ,  F21Y2103/10 ,  F21Y2105/16 ,  F21Y2113/00 ,  F21Y2115/10 ,  G02F1/1336 ,  G02F1/133603 ,  G02F1/133605 ,  H01L25/0753 ,  H05K1/189 ,  H05K2201/10106

Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.