Abstract:
An IC die transmits command signals, address signals and data signals to a flash memory device at respective times via a time-multiplexed external signaling line, the data signals representing data to be stored within an array of non-volatile storage elements of the flash memory device. The IC die additionally transmits a control signal to the flash memory device via one or more external control signal lines, the control signal directing the flash memory device to switchably couple an on-die termination element to the time-multiplexed signaling line.
Abstract:
In a non-volatile memory device having an array of non-volatile storage elements, command, address and data signals are received at respective times via a time-multiplexed external signaling line, the data signals representing data to be stored within the array of non-volatile storage elements. A control signal is received via a signaling path external to the non-volatile memory device, and an on-die termination element is switchably coupled to the time-multiplexed signaling line at least in part in response to a transition of the control signal from a first logic state to a second logic state.
Abstract:
An integrated circuit device transmits to a dynamic random access memory (DRAM) one or more commands that specify programming of a digital control value within the DRAM, the digital control value indicating a termination impedance that the DRAM is to couple to a data interface of the DRAM in response to receiving a write command and during reception of write data corresponding to the write command, and that the DRAM is to decouple from the data interface after reception of the write data corresponding to the write command. Thereafter, the integrated circuit device transmits to the DRAM a write command indicating that write data is to be sampled by a data interface of the DRAM during a first time interval and that cause the DRAM to couple the termination impedance to the data interface during the first time interval and decouple the termination impedance from the data interface after the first time interval.
Abstract:
A dynamic random access memory (DRAM) array is configured for selective repair and error correction of a subset of the array. Error-correcting code (ECC) is provided to a selected subset of the array to protect a row or partial row of memory cells where one or more weak memory cells are detected. By adding a sense amplifier stripe to the edge of the memory array, the adjacent edge segment of the array is employed to store ECC information associated with the protected subsets of the array. Bit replacement is also applied to defective memory cells. By implementing ECC selectively rather than to the entire array, integrity of the memory array is maintained at minimal cost to the array in terms of area and energy consumption.
Abstract:
A dynamic random access memory (DRAM) array is configured for selective repair and error correction of a subset of the array. Error-correcting code (ECC) is provided to a selected subset of the array to protect a row or partial row of memory cells where one or more weak memory cells are detected. By adding a sense amplifier stripe to the edge of the memory array, the adjacent edge segment of the array is employed to store ECC information associated with the protected subsets of the array. Bit replacement is also applied to defective memory cells. By implementing ECC selectively rather than to the entire array, integrity of the memory array is maintained at minimal cost to the array in terms of area and energy consumption.
Abstract:
A memory controller includes an interface to receive a data strobe signal and corresponding read data. The data strobe signal and the read data correspond to a read command issued by the memory controller, and the read data is received in accordance with the data strobe signal and an enable signal. A circuit in the memory controller is to dynamically adjust a timing offset between the enable signal and the data strobe signal, and control logic is to issue a supplemental read command in accordance with a determination that a time interval since a last read command issued by the memory controller exceeds a predetermined value.
Abstract:
A memory controller having a time-staggered request signal output. A first timing signal is generated while a second timing signal is generated having a first phase difference relative to the first timing signal. An address value is transmitted in response to the first timing signal and a control value is transmitted in response to the second timing signal, the address value and control value constituting portions of a first memory access request.
Abstract:
A memory controller having a time-staggered request signal output. A first timing signal is generated while a second timing signal is generated having a first phase difference relative to the first timing signal. An address value is transmitted in response to the first timing signal and a control value is transmitted in response to the second timing signal, the address value and control value constituting portions of a first memory access request.
Abstract:
Row activation operations within a memory component are carried out with respect to subrows instead of complete storage rows to reduce power consumption. Further, instead of activating subrows in response to row commands, subrow activation operations are deferred until receipt of column commands that specify the column operation to be performed and the subrow to be activated.
Abstract:
Row activation operations within a memory component are carried out with respect to subrows instead of complete storage rows to reduce power consumption. Further, instead of activating subrows in response to row commands, subrow activation operations are deferred until receipt of column commands that specify the column operation to be performed and the subrow to be activated.