SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

    公开(公告)号:US20220223739A1

    公开(公告)日:2022-07-14

    申请号:US17712224

    申请日:2022-04-04

    Abstract: A novel semiconductor device is provided. A component extending in a first direction, and a first conductor and a second conductor extending in a second direction are provided. The component includes a third conductor, a first insulator, a first semiconductor, and a second insulator. In a first intersection portion of the component and the first conductor, the first insulator, the first semiconductor, the second insulator, a second semiconductor, and a third insulator are provided concentrically. In a second intersection portion of the component and the second conductor, the first insulator, the first semiconductor, the second insulator, a fourth conductor, and a fourth insulator are provided concentrically around the third conductor.

    SEMICONDUCTOR DEVICE
    53.
    发明申请

    公开(公告)号:US20250151295A1

    公开(公告)日:2025-05-08

    申请号:US18838307

    申请日:2023-02-06

    Abstract: A semiconductor device that can be miniaturized or highly integrated is provided. The semiconductor device includes a first memory cell, a second memory cell over the first memory cell, a first conductor, and a second conductor over the first conductor. The first memory cell and the second memory cell each include a transistor and a capacitor. One of a source and a drain of the transistor is electrically connected to a lower electrode of the capacitor. The first conductor includes a portion in contact with the other of the source and the drain of the transistor included in the first memory cell. A top surface of the first conductor includes a portion in contact with a bottom surface of the second conductor. The second conductor includes a portion in contact with the other of the source and the drain of the transistor included in the second memory cell.

    MEMORY DEVICE HAVING ERROR DETECTION FUNCTION, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

    公开(公告)号:US20250142803A1

    公开(公告)日:2025-05-01

    申请号:US19006634

    申请日:2024-12-31

    Abstract: A memory device having an error detection function and being capable of storing a large amount of data per unit area is provided. A driver circuit of the memory device is formed using a transistor formed on a semiconductor substrate, and a memory cell of the memory device is formed using a thin film transistor. A plurality of layers each of which includes a memory cell using the thin film transistor can be stacked over the semiconductor substrate, so that the amount of data that can be stored per unit area can be increased. Part of a peripheral circuit including the memory device can be formed using a thin film transistor, and thus, an error detection circuit is formed using the thin film transistor and stacked over the semiconductor substrate.

    STORAGE DEVICE
    55.
    发明申请

    公开(公告)号:US20250107062A1

    公开(公告)日:2025-03-27

    申请号:US18832672

    申请日:2023-01-23

    Abstract: A semiconductor device that can be miniaturized or highly integrated is provided. The semiconductor device includes a first insulator, a second insulator over the first insulator, and a memory cell including a transistor and a capacitor. The transistor includes an oxide over the first insulator, a first conductor and a second conductor over the oxide, a third insulator over the oxide, and a third conductor over the third insulator. The third insulator and the third conductor are located in a first opening of the second insulator. The capacitor includes a fourth conductor in contact with a top surface of the second conductor, a fourth insulator over the fourth conductor, and a fifth conductor over the fourth insulator. The fourth conductor, the fourth insulator, and the fifth conductor are located in a second opening of the second insulator. A third opening is formed in the first insulator, the second insulator, and the first conductor. A sixth conductor is located in the third opening. The sixth conductor includes a region in contact with part of a top surface of the first conductor and part of a side surface of the first conductor in each of a plurality of layers.

    MEMORY DEVICE
    56.
    发明申请

    公开(公告)号:US20250072009A1

    公开(公告)日:2025-02-27

    申请号:US18947085

    申请日:2024-11-14

    Abstract: A highly reliable memory device is provided. On a side surface of a first conductor extending in a first direction, a first insulator, a first semiconductor, a second insulator, a second semiconductor, and a third insulator are provided in this order when seen from the first conductor side. A first region overlapping with a second conductor with the first insulator, the first semiconductor, the second insulator, the second semiconductor, and the third insulator therebetween, and a second region overlapping with a third conductor with the first insulator, the first semiconductor, the second insulator, the second semiconductor, and the third insulator therebetween are provided in the first conductor. In the second region, a fourth conductor is provided between the first insulator and the first semiconductor.

    SEMICONDUCTOR DEVICE, MEMORY DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20240395940A1

    公开(公告)日:2024-11-28

    申请号:US18664493

    申请日:2024-05-15

    Abstract: A transistor with high electrical characteristics is provided. A transistor with a high on-state current is provided. A transistor with small parasitic capacitance is provided. A transistor, a semiconductor device, or a memory device which can be miniaturized or highly integrated is provided. The transistor includes a first conductive layer, a second conductive layer, a semiconductor layer, a gate insulating layer over the semiconductor layer, and a gate electrode over the gate insulating layer. A first insulating layer is between the first conductive layer and the second conductive layer. The second conductive layer is over the first insulating layer. The first insulating layer and the second conductive layer include an opening portion reaching the first conductive layer. The semiconductor layer is in contact with a sidewall of the opening portion. The semiconductor layer includes a first oxide layer and a second oxide layer. The first oxide layer includes a first region and a second region. The second oxide layer is between the first region and the second region.

    SEMICONDUCTOR DEVICE
    58.
    发明申请

    公开(公告)号:US20240379866A1

    公开(公告)日:2024-11-14

    申请号:US18691097

    申请日:2022-09-08

    Abstract: A semiconductor device that can be miniaturized or highly integrated is provided. The semiconductor device includes a transistor. The transistor includes an oxide, a first conductor and a second conductor that are over the oxide, a first insulator over the first conductor and the second conductor, a second insulator in an opening included in the first insulator, a third insulator over the second insulator, a fourth insulator over the third insulator, and a third conductor over the fourth insulator. The opening includes a region overlapping with the oxide. The third conductor includes a region overlapping with the oxide with the second insulator, the third insulator, and the fourth insulator therebetween. The second insulator is in contact with a top surface of the oxide and a sidewall of the opening. The thickness of the second insulator is smaller than that of the third insulator. The fourth insulator is less permeable to oxygen than the third insulator is. The third conductor has a width greater than or equal to 3 nm and less than or equal to 15 nm in a cross-sectional view of the transistor in the channel length direction.

    SEMICONDUCTOR DEVICE
    59.
    发明公开

    公开(公告)号:US20240313121A1

    公开(公告)日:2024-09-19

    申请号:US18575942

    申请日:2022-07-08

    CPC classification number: H01L29/7869

    Abstract: A semiconductor device with a small variation in transistor electrical characteristics is provided. The semiconductor device includes an oxide; a first conductor, a second conductor, and a first insulator over the oxide; a second insulator over the first conductor and the second conductor; a third insulator over the first insulator; a third conductor over the third insulator; and a fourth insulator over the second insulator and the third conductor. The fourth insulator is in contact with a top surface of the second insulator and a top surface of the third conductor. The first insulator includes regions that are in contact with a top surface of the oxide, a side surface of the first conductor, a side surface of the second conductor, and a side surface of the second insulator. The oxide includes indium, gallium, aluminum, and zinc. Each of the first insulator and the fourth insulator includes aluminum and oxygen. The fourth insulator has an amorphous structure. The oxide has a concentration gradient in which an aluminum concentration increases toward the top surface of the oxide from the bottom surface of the oxide.

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