-
公开(公告)号:US07274296B2
公开(公告)日:2007-09-25
申请号:US11062483
申请日:2005-02-23
申请人: Shunji Baba , Naoki Ishikawa , Hidehiko Kira , Hiroshi Kobayashi , Shigeru Hashimoto , Yoshiyasu Sugimura
发明人: Shunji Baba , Naoki Ishikawa , Hidehiko Kira , Hiroshi Kobayashi , Shigeru Hashimoto , Yoshiyasu Sugimura
IPC分类号: G08B13/14
CPC分类号: H01L23/573 , G06K19/073 , G06K19/0739 , H01L23/49855 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要: The present invention provides an RFID tag that is very effective in preventing fraudulent uses. The RFID tag includes a base, an antenna pattern provided on the base, a breakdown pattern provided on the base, a circuit chip connected to both the antenna pattern and the breakdown pattern, and a cover that is bonded to the base in a strippable condition so as to cover the antenna pattern, the breakdown pattern and the circuit chip and is caused to come off together with all or a part of the breakdown pattern during stripping from the base. The breakdown pattern is transparent, or the cover conceals a remaining part of the breakdown pattern, or the breakdown pattern has a specific part that produces predetermined electrical properties and the cover conceals the specific part.
摘要翻译: 本发明提供一种非常有效防止欺诈用途的RFID标签。 RFID标签包括基座,设置在基座上的天线图案,设置在基座上的击穿图案,连接到天线图案和击穿图案的电路芯片,以及以可剥离状态接合到基座的盖子 以覆盖天线图案,击穿图案和电路芯片,并且在从基座剥离时与所有或部分击穿图案一起脱落。 击穿图案是透明的,或者盖子隐藏击穿图案的剩余部分,或者击穿图案具有产生预定电气特性的特定部件,并且盖子隐藏特定部件。
-
公开(公告)号:US20070139203A1
公开(公告)日:2007-06-21
申请号:US11378623
申请日:2006-03-20
CPC分类号: G06K19/07749 , G06K19/077 , G06K19/07728 , H01Q1/2208 , H01Q9/16 , Y10T156/10 , Y10T156/1754
摘要: The present invention relates to an RFID tag performing exchange of information with an external device without contact, and is to improve the resistance to bending while avoiding an increase in the thickness of the RFID tag. A circuit chip is bonded to a base portion of a base with a thermosetting adhesive. The base is folded, and an ultraviolet curing adhesive is applied on the circuit chip. The fold-back portions of the base are folded back onto the circuit chip, to which portions ultraviolet light is irradiated, as a result, both of the surfaces of the circuit chip are bonded to the base with the adhesives.
摘要翻译: RFID标签技术领域本发明涉及RFID标签,其与外部设备进行信息交换而不接触,并且提高耐弯曲性,同时避免RFID标签的厚度增加。 电路芯片用热固性粘合剂粘合到基底的基部。 折叠底座,并在电路芯片上施加紫外线固化粘合剂。 将基座的折回部分折回到电路芯片上,照射部分紫外线,结果,电路芯片的两个表面都用粘合剂粘合到基底上。
-
公开(公告)号:US20070069036A1
公开(公告)日:2007-03-29
申请号:US11295555
申请日:2005-12-07
申请人: Shunji Baba
发明人: Shunji Baba
IPC分类号: G06K19/06
CPC分类号: G06K19/07749 , G06K19/07728 , H01L2224/16
摘要: The present invention provides a RFID tag that includes a base, an antenna for communication wired to the base, a circuit chip electrically connected to the antenna for radio communication via the antenna, a first reinforcing member and a second reinforcing member. The first reinforcing member covers and fills the whole of the circuit chip and part of the antenna. The second reinforcing member is positioned underside of the first reinforcing member across the base and has an edge that is displaced from the edge of the first reinforcing member at least in the point where the edge of the first reinforcing member meets the antenna.
摘要翻译: 本发明提供一种RFID标签,其包括基座,用于与基座通信的通信用天线,电连接到天线的电路芯片,经天线进行无线通信,第一加强构件和第二加强构件。 第一加强构件覆盖并填充整个电路芯片和天线的一部分。 所述第二加强构件位于所述第一加强构件的下侧,穿过所述基座并且具有至少在所述第一加强构件的边缘与所述天线相遇的点处从所述第一加强构件的边缘移位的边缘。
-
公开(公告)号:US20060232418A1
公开(公告)日:2006-10-19
申请号:US11231933
申请日:2005-09-22
申请人: Shunji Baba , Toru Maniwa , Takashi Yamagajo , Manabu Kai , Shigeru Hashimoto , Yoshiyasu Sugimura
发明人: Shunji Baba , Toru Maniwa , Takashi Yamagajo , Manabu Kai , Shigeru Hashimoto , Yoshiyasu Sugimura
IPC分类号: G08B13/14
CPC分类号: G06K19/07758 , G06K19/07749 , G06K19/07771 , G06K19/07779
摘要: An RFID tag is constructed by pasting a first component and second component together. The first component includes a tabular first base made of dielectric and a metal layer covering one of the front and back of the first base. The second component includes a sheet-like second base, a metal pattern provided on the second base and electrically connected to the metal layer of the first component to constitute a communication antenna, a circuit chip connected to the metal pattern which carries out a radio communication through the communication antenna, and an adhesive material layer which bonds the second base to the other of the front and back of the first base. The metal layer of the first component and the metal pattern of the second component are electrically connected by the conductive component.
摘要翻译: 通过将第一部件和第二部件粘贴在一起构成RFID标签。 第一部件包括由电介质制成的片状第一基底和覆盖第一基底的前后之一的金属层。 第二部件包括片状第二基座,设置在第二基座上并电连接到第一部件的金属层以构成通信天线的金属图案,连接到执行无线电通信的金属图案的电路芯片 通过通信天线,以及将第二基座连接到第一基座的前后的另一个的粘合材料层。 第一部件的金属层和第二部件的金属图案通过导电部件电连接。
-
公开(公告)号:US06770319B2
公开(公告)日:2004-08-03
申请号:US09811605
申请日:2001-03-20
申请人: Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
发明人: Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
IPC分类号: B05D512
CPC分类号: B05C11/1034 , B05C5/0212 , H01L21/563 , H01L24/743 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00014 , H05K1/0269 , H05K3/0091 , H05K3/284 , H05K2203/0126 , H05K2203/163 , H01L2924/00 , H01L2224/05599
摘要: A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.
摘要翻译: 将树脂涂布到布线板的预定区域的树脂涂布方法包括以下步骤:对从树脂施加装置挤出的树脂的外观进行成像; 并且基于在成像步骤中获得的树脂的外观自动调节从树脂施加装置挤出的树脂的量。
-
公开(公告)号:US06506849B1
公开(公告)日:2003-01-14
申请号:US09647609
申请日:2001-01-05
申请人: Masahiro Hojo , Yukitoshi Ajiro , Kentaro Fujino , Shunji Baba
发明人: Masahiro Hojo , Yukitoshi Ajiro , Kentaro Fujino , Shunji Baba
IPC分类号: C08F13620
CPC分类号: C08K5/17 , B60C1/00 , B60C1/0016 , C08K5/24 , C08L9/06 , C08L21/00 , C08L79/02 , C08L2666/14
摘要: There are provided a rubber composition having a high modulus of elasticity and a good workability, and a pneumatic tire. A rubber composition comprising at least one of natural rubber and synthetic diene rubbers as a rubber ingredient, at least one maleimide compound, and at least one nitrogen-containing compound selected from the group consisting of polyaniline, hydrazide, and amine compound is used in a tread.
摘要翻译: 提供具有高弹性模量和良好可加工性的橡胶组合物和充气轮胎。一种橡胶组合物,其包含天然橡胶和合成二烯橡胶中的至少一种作为橡胶成分,至少一种马来酰亚胺化合物,并且至少 在胎面中使用一种选自聚苯胺,酰肼和胺化合物的含氮化合物。
-
公开(公告)号:US06437450B1
公开(公告)日:2002-08-20
申请号:US09614726
申请日:2000-07-12
申请人: Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
发明人: Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
IPC分类号: H01R2348
CPC分类号: H01L21/563 , H01L21/67092 , H01L21/67144 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75743 , H01L2224/81191 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2224/83859 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/83885 , H01L2224/83951 , H01L2224/85444 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/05599
摘要: A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.
-
公开(公告)号:US08462052B2
公开(公告)日:2013-06-11
申请号:US13206901
申请日:2011-08-10
申请人: Takashi Yamagajo , Toru Maniwa , Manabu Kai , Yasuyuki Oishi , Yoshiyasu Sugimura , Shunji Baba
发明人: Takashi Yamagajo , Toru Maniwa , Manabu Kai , Yasuyuki Oishi , Yoshiyasu Sugimura , Shunji Baba
CPC分类号: H01Q1/2208 , G06K19/07749 , G06K19/07786 , H01Q9/0457 , H01Q21/29 , Y10T29/49016
摘要: An RFID tag having a tag antenna and an LSI chip, comprising: a power-supply pattern on which the LSI chip is mounted; a patch antenna that functions as the tag antenna; and a high-frequency connection section that makes a high-frequency connection between the power-supply pattern and the patch antenna. The high-frequency connection section is formed, for example, by forming a slot in the patch antenna, layering one end of a small dipole antenna that functions as the power-supply pattern over the slot so that it crosses over the slot, and supplying power from the small dipole antenna to the patch antenna.
摘要翻译: 一种具有标签天线和LSI芯片的RFID标签,包括:安装有LSI芯片的电源图案; 贴片天线,用作标签天线; 以及在电源图案和贴片天线之间进行高频连接的高频连接部。 高频连接部例如通过在贴片天线中形成狭缝而形成,将小偶极天线的一端层叠成在插槽上方作为电源图案,使其与插槽交叉,并且供给 功率从小偶极天线到贴片天线。
-
公开(公告)号:US08242916B2
公开(公告)日:2012-08-14
申请号:US12694755
申请日:2010-01-27
申请人: Shunji Baba , Shigeru Hashimoto , Tsuyoshi Niwata
发明人: Shunji Baba , Shigeru Hashimoto , Tsuyoshi Niwata
CPC分类号: G06K19/07749 , G06K19/07372 , G06K19/07798 , G09F3/0323 , G09F3/0335 , Y10T24/1324 , Y10T24/3413 , Y10T70/411
摘要: An RFID tag has an IC chip and an antenna connected to the IC chip, the RFID tag including: a spacer that has elasticity; a first locking section that is formed around the IC chip; a second locking section that is arranged in a position apart from the first locking section across the spacer, is displaced toward the first locking section and locked on the first locking section by pressing force with which the spacer is pressed, and applies reactive force against the pressing force around the IC chip via the first locking section when the pressing force is removed; and a destruction section that destroys the IC chip or the antenna with the reactive force from the second locking section.
摘要翻译: RFID标签具有连接到IC芯片的IC芯片和天线,RFID标签包括:具有弹性的间隔件; 形成在IC芯片周围的第一锁定部; 布置在与第一锁定部分隔开间隔件的位置的位置的第二锁定部分朝向第一锁定部分移动,并且通过按压间隔件的按压力而被锁定在第一锁定部分上,并且对其施加反作用力 当按压力被去除时,通过第一锁定部分围绕IC芯片施加压力; 以及破坏部,其以来自第二锁定部的反作用力破坏IC芯片或天线。
-
公开(公告)号:US08022878B2
公开(公告)日:2011-09-20
申请号:US11882232
申请日:2007-07-31
申请人: Takashi Yamagajo , Toru Maniwa , Manabu Kai , Yasuyuki Oishi , Yoshiyasu Sugimura , Shunji Baba
发明人: Takashi Yamagajo , Toru Maniwa , Manabu Kai , Yasuyuki Oishi , Yoshiyasu Sugimura , Shunji Baba
CPC分类号: H01Q1/2208 , G06K19/07749 , G06K19/07786 , H01Q9/0457 , H01Q21/29 , Y10T29/49016
摘要: An RFID tag having a tag antenna and an LSI chip, comprising: a power-supply pattern on which the LSI chip is mounted; a patch antenna that functions as the tag antenna; and a high-frequency connection section that makes a high-frequency connection between the power-supply pattern and the patch antenna. The high-frequency connection section is formed, for example, by forming a slot in the patch antenna, layering one end of a small dipole antenna that functions as the power-supply pattern over the slot so that it crosses over the slot, and supplying power from the small dipole antenna to the patch antenna.
摘要翻译: 一种具有标签天线和LSI芯片的RFID标签,包括:安装有LSI芯片的电源图案; 贴片天线,用作标签天线; 以及在电源图案和贴片天线之间进行高频连接的高频连接部。 高频连接部例如通过在贴片天线中形成狭缝而形成,将小偶极天线的一端层叠成在插槽上方作为电源图案,使其与插槽交叉,并且供给 功率从小偶极天线到贴片天线。
-
-
-
-
-
-
-
-
-