公开(公告)号：US08278767B2

公开(公告)日：2012-10-02

申请号：US13000390

申请日：2009-08-04

Applicant: Ewald K. M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

Inventor： Ewald K. M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/645 ,  H01L2924/0002 ,  H05B33/0803 ,  H01L2924/00

Abstract: An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top.

Abstract translation: 光电子部件包括具有安装侧并具有至少一个功能元件的载体，至少一个具有顶部和相对底部的无基底光电半导体芯片，并且通过顶部和底部导电，其中底部面向 安装侧，半导体芯片安装在安装侧，并且至少一个结构化电接触膜位于顶部。

公开(公告)号：US20120190140A1

公开(公告)日：2012-07-26

申请号：US13440472

申请日：2012-04-05

Applicant: Jörg Erich SORG ,  Stefan Gruber ,  Siegfried Herrmann ,  Berthold Hahn

Inventor： Jörg Erich SORG ,  Stefan Gruber ,  Siegfried Herrmann ,  Berthold Hahn

IPC: H01L33/48

CPC classification number: H01L25/0753 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0079 ,  H01L33/508 ,  H01L33/62 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/48091 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side and which are fixed by their rear side—opposite the front side—on a first main face of a common carrier body, wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.

Abstract translation: 一种发光二极管装置，包括多个半导体芯片，所述多个半导体芯片被设置用于从其前侧发射电磁辐射并且通过它们的正面侧的后侧固定在公共载体主体的第一主面上，其中， 半导体芯片由相应的无基板的半导体层堆叠构成，并且在没有辅助载体的情况下固定到公共载体主体，以及制造这种发光二极管装置的方法。

公开(公告)号：US08154040B2

公开(公告)日：2012-04-10

申请号：US12442411

申请日：2007-09-25

Applicant: Jörg Erich Sorg ,  Stefan Gruber ,  Siegfried Herrmann ,  Berthold Hahn

Inventor： Jörg Erich Sorg ,  Stefan Gruber ,  Siegfried Herrmann ,  Berthold Hahn

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0079 ,  H01L33/508 ,  H01L33/62 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/48091 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side (101) and which are fixed by their rear side (102)—opposite the front side—on a first main face (201) of a common carrier body (2), wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack (1) and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.

Abstract translation: 一种发光二极管装置，包括多个半导体芯片，所述多个半导体芯片被设置用于从其前侧（101）发射电磁辐射，并且由它们的后侧（102）固定在第一主面（201）的正面 ），其中所述半导体芯片由相应的无基板半导体层堆叠（1）组成，并且在没有辅助载体的情况下固定到所述公共载体主体，以及用于制造这种发光二极管 安排。

公开(公告)号：US20110278621A1

公开(公告)日：2011-11-17

申请号：US13129018

申请日：2009-11-05

Applicant: Siegfried Herrmann ,  Sebastian Taeger

Inventor： Siegfried Herrmann ,  Sebastian Taeger

IPC: H01L33/44 ,  H01L33/50

CPC classification number: H01L33/44 ,  C08G61/02 ,  H01L24/24 ,  H01L24/82 ,  H01L33/62 ,  H01L2224/24051 ,  H01L2924/01327 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A radiation-emitting component includes a carrier, a semi-conductor chip arranged on the carrier, wherein the semi-conductor chip includes an active layer to generate electromagnetic radiation and a radiation exit surface, a first and a second contact structure for the electrical contacting of the semi-conductor chip, a first and a second contact layer, wherein the semi-conductor chip is electrically conductively connected to the first contact structure via the first, contact layer and to the second contact structure via the second contact layer, a passivation layer arranged on the semi-conductor chip.

Abstract translation: 辐射发射部件包括载体，布置在载体上的半导体芯片，其中半导体芯片包括产生电磁辐射的有源层和辐射出射表面，用于电接触的第一和第二接触结构 半导体芯片的第一和第二接触层，其中半导体芯片经由第一接触层和第二接触结构经由第二接触层导电连接到第一接触结构，钝化层 层布置在半导体芯片上。

公开(公告)号：US20110176116A1

公开(公告)日：2011-07-21

申请号：US13062792

申请日：2009-09-09

Applicant: Stefan Grötsch ,  Ewald Karl Michael Günther ,  Alexander Wilm ,  Siegfried Herrmann

Inventor： Stefan Grötsch ,  Ewald Karl Michael Günther ,  Alexander Wilm ,  Siegfried Herrmann

IPC: G03B21/14

CPC classification number: G03B21/2033

Abstract: An LED projector includes a plurality of light sources; and an image generator which includes an arrangement of pixels, each pixel including at least one light source; wherein the LEDs are stacked epi-LEDs which include layers arranged above one another for different colors, or each pixel includes an emission surface and at least two LEDs are arranged adjacent one another in the emission surface.

Abstract translation: LED投影仪包括多个光源; 以及图像生成器，其包括像素的排列，每个像素包括至少一个光源; 其中所述LED是层叠的epi-LED，其包括不同颜色彼此排列的层，或者每个像素包括发射表面，并且至少两个LED在发射表面中彼此相邻地布置。

公开(公告)号：US20100276706A1

公开(公告)日：2010-11-04

申请号：US12667199

申请日：2008-06-19

Applicant: Siegfried Herrmann

Inventor： Siegfried Herrmann

IPC: H01L33/48 ,  H01L21/50

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/385 ,  H01L2221/68363 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012

Abstract: A method for producing a plurality of optoelectronic devices is specified, comprising the following steps: providing a connection carrier assemblage having a plurality of device regions, wherein at least one electrical connection region is provided in each of the device regions, providing a semiconductor body carrier, on which a plurality of separate semiconductor bodies connected to the semiconductor body carrier are arranged, wherein the semiconductor bodies each have a semiconductor layer sequence having an active region, arranging the connection carrier assemblage and the semiconductor body carrier relative to one another in such a way that the semiconductor bodies face the device regions, mechanically connecting a plurality of semiconductor bodies to the connection carrier assemblage in a mounting region of a device region assigned to the respective semiconductor body, electrically conductively connecting the respective semiconductor body to the connection region of the device region assigned to the semiconductor body, and separating from the semiconductor body carrier the semiconductor bodies that are to be connected or are connected to the connection carrier assemblage, and dividing the connection carrier assemblage into a plurality of separate optoelectronic devices each having a connection carrier, which has the device region, and a semiconductor body arranged on the connection carrier and electrically conductively connected to the connection region.

Abstract translation: 规定了多个光电器件的制造方法，包括以下步骤：提供具有多个器件区域的连接载体组合，其中在每个器件区域中设置至少一个电连接区域，提供半导体本体载体 其上配置有连接到半导体主体载体的多个分离的半导体本体，其中半导体主体各自具有具有有源区的半导体层序列，将连接载体组合和半导体本体载体相对于彼此布置 半导体主体面对设备区域的方式，将多个半导体主体机械地连接到分配给各个半导体主体的设备区域的安装区域中的连接载体组合件，将各个半导体主体连接到 设备寄存器 离子，并且与半导体本体载体分离将被连接或连接到连接载体组件的半导体本体，并将连接载体组合分成多个分离的光电子器件，每个光电子器件具有连接载体， 其具有器件区域，以及布置在连接载体上并导电连接到连接区域的半导体本体。

公开(公告)号：US20080179622A1

公开(公告)日：2008-07-31

申请号：US12017539

申请日：2008-01-22

Applicant: Siegfried Herrmann

Inventor： Siegfried Herrmann

IPC: H01L33/00

CPC classification number: H01L33/648 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor component comprising an optically active layer and characterized by at least one cooling element and at least one coupling element. Also disclosed is an arrangement comprising a multiplicity of optically active layers and a method for producing a semiconductor component.

Abstract translation: 一种包括光学活性层并且由至少一个冷却元件和至少一个耦合元件表征的半导体元件。 还公开了包括多个光学活性层的布置和用于制造半导体部件的方法。