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公开(公告)号：US20240243051A1
公开(公告)日：2024-07-18
申请号：US18621138
申请日：2024-03-29
发明人： Wen-Shiang Liao
IPC分类号： H01L23/498 , H01L23/31 , H01L23/58 , H01Q1/22 , H01Q9/04
CPC分类号： H01L23/49822 , H01L23/3107 , H01L23/585 , H01Q1/2283 , H01Q9/0414
摘要： A package structure including a first radio frequency die, a second radio frequency die, an insulating encapsulant, a redistribution circuit structure, a first oscillation cavity and a second oscillation cavity is provided. A first frequency range of the first radio frequency die is different from a second frequency range of the second radio frequency die. The insulating encapsulant laterally encapsulates the first radio frequency die and the second radio frequency die. The redistribution circuit structure is disposed on the first radio frequency die, the second die and the insulating encapsulant. The first oscillation cavity is electrically connected to the first radio frequency die, and the second oscillation cavity is electrically connected to the second radio frequency die.
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公开(公告)号：US20240201439A1
公开(公告)日：2024-06-20
申请号：US18166460
申请日：2023-02-08
发明人： Feng-Wei KUO , Wen-Shiang Liao
IPC分类号： G02B6/124 , G02B6/136 , H01L23/00 , H01L25/00 , H01L25/065
CPC分类号： G02B6/1245 , G02B6/136 , H01L24/16 , H01L24/73 , H01L25/0657 , H01L25/50 , G02B2006/12104 , H01L2224/16146 , H01L2224/16225 , H01L2224/73204 , H01L2225/06517 , H01L2225/06568
摘要： A semiconductor package and a manufacturing method thereof are provided. A die stack in the semiconductor package includes a photonic die and an electronic die stacked on the photonic die by a face-to-face manner. A convex lens is disposed at a back surface of the electronic die, and is formed in an oval shape, such that optical beams can be collimated to have circular beam shape, as passing through the convex lens. In some embodiments, the semiconductor package includes more of the die stacks, and includes an interposer lying below the die stacks. In these embodiments, tilted reflectors are formed in the photonic dies and the interposer, to set up vertical optical paths between the interposer and the photonic dies, and lateral optical paths in the interposer. In this way, optical communication between the photonic dies can be established.
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公开(公告)号：US20230408769A1
公开(公告)日：2023-12-21
申请号：US17752640
申请日：2022-05-24
发明人： Feng-Wei Kuo , Wen-Shiang Liao
IPC分类号： G02B6/34
CPC分类号： G02B6/34
摘要： A semiconductor device includes a silicon substrate having a first region and a second region. The semiconductor device includes a silicon lens formed in the first region and along a surface of the silicon substrate on a first side of the silicon substrate. The semiconductor device includes a photonic die disposed in the first region and on a second side of the silicon substrate, the second side being opposite to the first side. The semiconductor device includes a waveguide disposed on the second side of the silicon substrate and having a grating coupler.
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公开(公告)号：US11749625B2
公开(公告)日：2023-09-05
申请号：US17118017
申请日：2020-12-10
发明人： Feng-Wei Kuo , Wen-Shiang Liao
IPC分类号： H01L23/66 , H01L23/538 , H01L23/00 , H01L21/48 , H01L21/56 , H01L21/683 , H01Q9/04 , H01Q1/52 , H01L23/31
CPC分类号： H01L23/66 , H01L21/4853 , H01L21/4857 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/20 , H01Q1/52 , H01Q9/0407 , H01L2221/68372 , H01L2223/6677 , H01L2224/214
摘要： A semiconductor structure includes a first redistribution structure, wherein the first redistribution structure includes first conductive pattern. The semiconductor structure further includes a die over the first redistribution structure. The semiconductor structure further includes a molding over the first redistribution structure, wherein the molding surrounds the die, and the molding has a first dielectric constant. The semiconductor structure further includes a dielectric member extending through the molding, wherein the dielectric member has a second dielectric constant different from the first dielectric constant. The semiconductor structure further includes a second redistribution structure over the die, the dielectric member and the molding, wherein the second redistribution layer includes an antenna over the dielectric member, and the antenna is electrically connected to the die.
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公开(公告)号：US20230261037A1
公开(公告)日：2023-08-17
申请号：US18306222
申请日：2023-04-24
发明人： Wen-Shiang Liao , Chih-Hang Tung
IPC分类号： H01L23/31 , H01L23/498 , H01F27/24 , H01F27/28 , H01L23/00 , H01L21/48 , H01L21/56 , H01L21/683 , H01F41/04
CPC分类号： H01L28/10 , H01L23/3128 , H01L23/49838 , H01F27/24 , H01F27/2804 , H01L23/49827 , H01L24/19 , H01L21/486 , H01L21/565 , H01L21/568 , H01L21/561 , H01L21/4857 , H01L21/6835 , H01L24/97 , H01F41/041 , H01L24/20 , H01L2924/19042 , H01L2224/95001 , H01F2027/2809 , H01L2224/211 , H01L2224/221 , H01L2924/1427
摘要： A package includes a first redistribution structure, a second redistribution structure, an inductor, a permalloy core, and a die. The second redistribution structure is over the first redistribution structure. The inductor includes a first portion, a second portion, and a third portion. The first portion is embedded in the first redistribution structure, the third portion is embedded in the second redistribution structure, and the second portion connects the first and third portions of the inductor. The permalloy core is located between the first and third portions of the inductor. The die is disposed adjacent to the second portion of the inductor.
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公开(公告)号：US11719885B2
公开(公告)日：2023-08-08
申请号：US17069879
申请日：2020-10-14
CPC分类号： G02B6/29325 , G02B6/0083
摘要： Disclosed are apparatuses for optical coupling and a system for communication. In one embodiment, an apparatus for optical coupling including a substrate and a grating coupler is disclosed. The grating coupler is disposed on the substrate and includes a plurality of coupling gratings arranged along a first direction, wherein effective refractive indices of the plurality of coupling gratings gradually decrease along the first direction.
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公开(公告)号：US11500155B1
公开(公告)日：2022-11-15
申请号：US17383451
申请日：2021-07-23
发明人： Feng-Wei Kuo , Wen-Shiang Liao
摘要： An optical coupler includes a substrate, a mirror layer, a plurality of coupling gratings, a plurality of waveguides, and an oxide layer. The substrate includes a first surface, a second surface opposite to the first surface, and a concave portion exposed from the first surface. The mirror layer is disposed in the concave portion. The coupling gratings are disposed above the mirror layer. The waveguides are laterally aligned with the coupling gratings. The concave portion faces both the coupling gratings and the waveguides. The oxide layer is bonded on the first surface. The coupling gratings and the waveguides are disposed on the oxide layer.
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公开(公告)号：US11450595B2
公开(公告)日：2022-09-20
申请号：US16727930
申请日：2019-12-27
发明人： Ying-Chih Hsu , Wen-Shiang Liao
IPC分类号： H01L23/498 , H01L23/64 , H01L21/48 , H01L25/065 , H01L23/00 , H01F27/28 , H01F41/04 , H01L49/02
摘要： A semiconductor device includes a semiconductor substrate, an interconnect structure, and a permalloy device. The interconnect structure is disposed over the semiconductor substrate. The interconnect structure includes a conductive coil. The conductive coil includes horizontally-extending metal lines, and vertically-extending vias electrically connecting the metal lines. The permalloy device is disposed in the interconnector structure and wound around by the conductive coil and insulated by the conductive coil, wherein the permalloy device and the conductive coil in combination define an inductor, and the permalloy device serves as a magnetic core of the inductor.
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公开(公告)号：US11442296B2
公开(公告)日：2022-09-13
申请号：US16933865
申请日：2020-07-20
发明人： Huan-Neng Chen , Feng-Wei Kuo , Min-Hsiang Hsu , Lan-Chou Cho , Chewn-Pu Jou , Wen-Shiang Liao
摘要： An optical attenuating structure is provided. The optical attenuating structure includes a substrate, a waveguide, doping regions, an optical attenuating member, and a dielectric layer. The waveguide is extended over the substrate. The doping regions are disposed over the substrate, and include a first doping region, a second doping region opposite to the first doping region and separated from the first doping region by the waveguide, a first electrode extended over the substrate and in the first doping region, and a second electrode extended over the substrate and in the second doping region. The first optical attenuating member is coupled with the waveguide and disposed between the waveguide and the first electrode. The dielectric layer is disposed over the substrate and covers the waveguide, the doping regions and the first optical attenuating member.
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60.发明申请公开(公告)号：US20150216047A1
公开(公告)日：2015-07-30
申请号：US14679557
申请日：2015-04-06
发明人： Wen-Shiang Liao
IPC分类号： H05K1/03 , H05K1/11 , H01L23/00 , H01L21/48 , H01L23/498
CPC分类号： H05K1/0306 , C03C17/00 , C03C2217/425 , C03C2218/365 , G02F1/00 , G02F1/133345 , H01L21/02592 , H01L21/4828 , H01L21/486 , H01L23/49827 , H01L23/49838 , H01L23/49872 , H01L23/49894 , H01L23/562 , H01L27/156 , H01L2224/13 , H01L2924/12044 , H05K1/115 , H01L2924/00
摘要： Glass treatment methods, wafer, panels, and semiconductor devices are disclosed. In some embodiments, a method of forming a wafer or panel includes forming an opening through a glass substrate, forming a composite film on the glass substrate and on sidewalls of the opening, and filling the opening.
摘要翻译： 公开了玻璃处理方法，晶片，面板和半导体器件。 在一些实施例中，形成晶片或面板的方法包括通过玻璃基板形成开口，在玻璃基板上和开口的侧壁上形成复合膜并填充开口。
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