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51.发明授权Sensitivity increase from alkynylamineazole, sensitizing dye, and chalcogenazolium salt added before heat cycle 失效在热循环前添加的炔基胺，敏化染料和硫属元素鎓盐的敏感性增加
公开(公告)号：US5411854A
公开(公告)日：1995-05-02
申请号：US174998
申请日：1993-12-29
摘要： The invention is accomplished by providing a combined process of chemical and spectral sensitization comprising providing a silver halide emulsion, adding a sulfur or gold chemical sensitizer, adding a finish modifier ##STR1## wherein X is --O--, --S--, --Se--, ##STR2## Y.sup.1 and Y.sup.2 individually represent hydrogen or an aromatic nucleus or together represent the atoms completing a fused aromatic nucleus; R is hydrogen or lower alkyl of from 1 to 5 carbon atoms; and R.sub.1 is a hydrogen or methyl, provided that Y.sup.1 and Y.sup.2 individually represent hydrogen or an aromatic nucleus when R.sub.1 is hydrogen, adding dye, andadding a hydrolyzable quaternized chalcogenazolium salt of a middle chalcogen,heating to a temperature sufficient to cause sensitization of said silver halide to take place, and cooling to recover the sensitized emulsion.
摘要翻译： 本发明通过提供化学和光谱增感的组合方法来实现，包括提供卤化银乳剂，加入硫或金化学增感剂，加入其中X是-O - ， - S-，-Se- ，＆lt; IMAGE＆gt; Y1和Y2分别表示氢或芳香核，或一起代表完成稠合芳香核的原子; R是氢或1至5个碳原子的低级烷基; 并且R1是氢或甲基，条件是当R1是氢时，Y1和Y2分别代表氢或芳香核，加入染料，加入中等硫属元素的可水解的季铵硫霉素鎓盐，加热至足以引起所述 卤化银发生，冷却回收敏化乳液。
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公开(公告)号：US5248587A
公开(公告)日：1993-09-28
申请号：US601649
申请日：1990-10-23
申请人： Thomas B. Brust
发明人： Thomas B. Brust
CPC分类号： G03C1/0051 , G03C1/015 , G03C2001/0055 , G03C2001/0153 , G03C2001/0156 , G03C2001/0357 , G03C2200/38 , G03C2200/43 , G03C2200/60
摘要： The invention provides an improved method of forming monodispersed tabular silver halide grains. These and other objects of the invention are generally performed by providing a method of forming silver halide grains comprising forming an initial population of small twin plane silver halide grains in an aqueous medium, and allowing ripening at a temperature greater than or equal to the temperature of forming said initial population, and then growing the ripened grains. This process is carried out, such that during between about 10 percent and about 100 percent of growth, the temperature of said aqueous medium is at least 2.degree. C. below the ripening temperature, but above the temperature of renucleation, and the pBr is between about 1.0 and 3.5 during growth.
摘要翻译： 本发明提供了形成单分散片状卤化银颗粒的改进方法。 本发明的这些和其它目的通常通过提供一种形成卤化银颗粒的方法来进行，所述方法包括在水性介质中形成初始群体的小双平面卤化银颗粒，并且允许在大于或等于 形成初始种群，然后种植成熟的谷物。 进行该方法使得在约10％至约100％的生长期间，所述水性介质的温度低于熟化温度至少2℃，但高于再核化温度，并且pBr介于 在生长期间约1.0和3.5。
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53.发明申请公开(公告)号：US20160048078A1
公开(公告)日：2016-02-18
申请号：US14457396
申请日：2014-08-12
CPC分类号： G03F7/16 , G03F7/0045 , G03F7/0046 , G03F7/038 , G03F7/0382 , G03F7/0388 , G03F7/26
摘要： An electrically-conductive pattern is prepared using a reactive composition having: (1) a reactive polymer; (2) a compound that provides a cleaving acid upon exposure to radiation; and (3) a crosslinking agent that reacts in the presence of the cleaving acid, to provide crosslinking in the reactive polymer. A polymeric layer of the reactive composition is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising sulfonic acid or sulfonate groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions, which pattern is reduced to provide a pattern of corresponding electroless seed metal particles. Electrolessly plating is then carried out in the exposed regions. The unique reactive comprises (a) recurring units represented Structure (A) as described in the disclosure, and can also include other recurring units that are crosslinkable or provide other properties.
摘要翻译： 使用具有以下物质的反应性组合物制备导电图案：（1）反应性聚合物; （2）暴露于辐射时提供裂解酸的化合物; 和（3）在裂解酸存在下反应以在反应性聚合物中提供交联的交联剂。 将反应性组合物的聚合物层图案地暴露以提供包含非暴露区域的聚合物层和包含包含磺酸或磺酸盐基团的聚合物的暴露区域。 暴露的区域与无电子种子金属离子接触以形成无电晶种金属离子的图案，该图案被还原以提供相应的无电子种子金属颗粒的图案。 然后在暴露的区域进行无电镀。 独特的反应性包括（a）如本公开所述的结构（A）所示的重复单元，并且还可以包括可交联或提供其它性质的其它重复单元。
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公开(公告)号：US20160018737A1
公开(公告)日：2016-01-21
申请号：US14331519
申请日：2014-07-15
申请人： Thomas B. Brust , Grace Ann Bennett
发明人： Thomas B. Brust , Grace Ann Bennett
CPC分类号： G03F7/40 , G03F7/031 , G03F7/038 , G03F7/0388
摘要： A conductive pattern can be formed using a polymeric layer that contains a reactive composition that comprises a reactive polymer that is metal ion-complexing, water-soluble, and crosslinkable. This reactive polymer comprises photosensitive non-aromatic heterocyclic groups each of these groups comprising a carbon-carbon double bond in conjugation with an electron withdrawing group, as well as metal ion-complexing and water solubilizing groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced. The resulting electroless seed metal nuclei are electrolessly plated with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
摘要翻译： 可以使用包含反应性组合物的聚合物层形成导电图案，所述反应性组合物包含金属离子络合，水溶性和可交联的反应性聚合物。 该反应性聚合物包含光敏非芳族杂环基团，这些基团包括与吸电子基团共轭的碳 - 碳双键，以及金属离子络合和水溶性基团。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被除去，但是聚合物层的暴露区域与无电子种子金属离子接触，然后将其还原。 所得无电子种子金属核用无电镀的合适金属镀以形成所需的导电图案。 在该过程中可以制备各种物品，并且产品可以并入各种电子设备中。
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公开(公告)号：US20150293451A1
公开(公告)日：2015-10-15
申请号：US14249390
申请日：2014-04-10
CPC分类号： G03F7/038 , G03F7/0384 , G03F7/11 , G03F7/16 , G03F7/2002 , G03F7/40 , G03F7/405
摘要： A conductive pattern can be formed using a polymeric layer that contains a reactive composition that comprises a reactive polymer that is metal ion-complexing, water-soluble, and crosslinkable. This reactive polymer comprises pendant thiosulfate groups as well as metal ion-complexing and water solubilizing groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced. The resulting electroless seed metal nuclei are electrolessly plated with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
摘要翻译： 可以使用包含反应性组合物的聚合物层形成导电图案，所述反应性组合物包含金属离子络合，水溶性和可交联的反应性聚合物。 该反应性聚合物包括硫代硫酸根基团以及金属离子络合和水溶性基团。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被去除，但是聚合物层的暴露区域与无电晶种金属离子接触，然后将其还原。 所得无电子种子金属核用无电镀的合适金属镀以形成所需的导电图案。 在该过程中可以制备各种物品，并且产品可以并入各种电子设备中。
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公开(公告)号：US09128378B2
公开(公告)日：2015-09-08
申请号：US14071765
申请日：2013-11-05
CPC分类号： C23C18/1603 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/208 , C23C18/30 , C23C18/38 , C23C18/40 , G03F7/0045 , G03F7/0392 , G03F7/265 , G03F7/38 , Y10T428/24802
摘要： A pattern is formed in a polymeric layer comprising a reactive composition that comprises: (a) a polymer comprising pendant -arylene-X—C(═O)—O— t-alkyl groups that comprise a blocking group that is cleavable to provide pendant -arylene-XH groups, (b) a compound that provides a cleaving acid upon exposure to radiation having a λmax of 150 nm and to 450 nm, which cleaving acid has a pKa of 2 or less as measured in water, and (c) optionally, a photosensitizer. The polymeric layer is imagewise exposed to suitable radiation to provide non-exposed regions and exposed regions comprising a de-blocked and crosslinked polymer with pendant -arylene-XH groups. The exposed regions are contacted with electroless seed metal ions in the de-blocked and crosslinked polymer. After reduction, the corresponding electroless seed metal nuclei are electrolessly plated using a suitable metal that is the same as or different from the corresponding electroless seed metal nuclei.
摘要翻译： 在包含反应性组合物的聚合物层中形成图案，所述聚合物层包含：（a）包含侧链 - 亚芳基-X-C（= O）-O- t-烷基的聚合物，其包含可切割以提供侧基的封闭基团 - 亚芳基-XH基团，（b）在暴露于λmax为150nm至450nm的辐射下提供裂解酸的化合物，该切割酸在水中测得的pKa为2或更小，和（c） 任选地，光敏剂。 将聚合物层成像暴露于合适的辐射以提供非暴露区域和包含具有侧链 - 亚芳基-XH基团的去封闭和交联的聚合物的暴露区域。 暴露的区域与去封闭和交联的聚合物中的无电子种子金属离子接触。 还原后，使用与相应的无电子种子金属核相同或不同的合适金属对相应的无电子晶种金属核进行无电镀。
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公开(公告)号：US09081282B1
公开(公告)日：2015-07-14
申请号：US14187423
申请日：2014-02-24
CPC分类号： G03F7/0388 , G03F7/00 , G03F7/40 , G03F7/405
摘要： A conductive pattern can be formed using a polymeric layer that contains a reactive composition that comprises a reactive polymer that is metal ion-complexing, water-soluble, and crosslinkable. This reactive polymer comprises pendant groups comprising crosslinkable —C(═O)—CR═CR1—Y— groups wherein R and R1 are defined in the disclosure, as well as metal ion-complexing and water solubilizing groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced. The resulting electroless seed metal nuclei are electrolessly plated with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
摘要翻译： 可以使用包含反应性组合物的聚合物层形成导电图案，所述反应性组合物包含金属离子络合，水溶性和可交联的反应性聚合物。 该反应性聚合物包括包含可交联的-C（= O）-CR = CR 1 -Y-基团的侧基，其中R和R 1在本公开内定义，以及金属离子络合和水溶性基团。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被去除，但是聚合物层的暴露区域与无电晶种金属离子接触，然后将其还原。 所得无电子种子金属核用无电镀的合适金属镀以形成所需的导电图案。 在该过程中可以制备各种物品，并且产品可以并入各种电子设备中。
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公开(公告)号：US09069248B1
公开(公告)日：2015-06-30
申请号：US14277334
申请日：2014-05-14
CPC分类号： G03F7/0388 , G03F7/405
摘要： A conductive pattern can be formed using a polymeric layer that contains a reactive composition that comprises a reactive polymer that is metal ion-complexing, water-soluble, and crosslinkable. This reactive polymer comprises photosensitive non-aromatic unsaturated carbocyclic groups as well as metal ion-complexing and water solubilizing groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced. The resulting electroless seed metal nuclei are electrolessly plated with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
摘要翻译： 可以使用包含反应性组合物的聚合物层形成导电图案，所述反应性组合物包含金属离子络合，水溶性和可交联的反应性聚合物。 该反应性聚合物包括光敏非芳族不饱和碳环基团以及金属离子络合和水溶性基团。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被去除，但是聚合物层的暴露区域与无电晶种金属离子接触，然后将其还原。 所得无电子种子金属核用无电镀的合适金属镀以形成所需的导电图案。 在该过程中可以制备各种物品，并且产品可以并入各种电子设备中。
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公开(公告)号：US20150125674A1
公开(公告)日：2015-05-07
申请号：US14071879
申请日：2013-11-05
CPC分类号： G03F7/40 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/208 , C23C18/30 , C23C18/38 , G03F7/039 , G03F7/16 , G03F7/20 , H05K3/185 , H05K2201/0166 , H05K2201/0236 , H05K2203/0759 , Y10T428/24917
摘要： A conductive pattern is prepared in a polymeric layer that has (a) a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation having a λmax of at least 150 nm and up to and including 450 nm, and (c) a crosslinking agent. The polymeric layer is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. The pattern of electroless seed metal ions is then reduced to provide a pattern of corresponding electroless seed metal nuclei. The corresponding electroless seed metal nuclei are then electrolessly plated with a conductive metal.
摘要翻译： 在聚合物层中制备导电图案，该聚合物层具有（a）包含叔烷基酯基侧基的反应性聚合物，（b）在暴露于λmax为至少150nm并且包括 450nm，（c）交联剂。 图案化地暴露聚合物层以提供包含非暴露区域的聚合物层和包含包含羧酸基团的聚合物的暴露区域。 暴露的区域与无电子种子金属离子接触以形成无电子种子金属离子的图案。 然后减少无电子种子金属离子的图案以提供相应的无电子种子金属核的图案。 然后将相应的无电子种子金属核用导电金属无电镀。
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公开(公告)号：US08940821B2
公开(公告)日：2015-01-27
申请号：US12234753
申请日：2008-09-22
申请人： Thomas B. Brust , Paul D. Yacobucci , Yongcai Wang , Catherine A. Falkner , Thanhchau T. Nguyen
发明人： Thomas B. Brust , Paul D. Yacobucci , Yongcai Wang , Catherine A. Falkner , Thanhchau T. Nguyen
IPC分类号： B05D5/06 , C08G18/48 , C08G18/08 , C08G18/50 , C09D11/322 , C09D11/40 , C09D175/08
CPC分类号： C08G18/4854 , C08G18/0823 , C08G18/482 , C08G18/5024 , C09D11/322 , C09D11/40 , C09D175/08
摘要： An inkjet ink composition comprising water, and at least one water-dispersible polyurethane/urea polymer having at least a first soft segment formed from a polyol prepolymer and at least a second soft segment formed from a polyamine prepolymer, wherein the polyol prepolymer forms urethane bonds in the polyurethane/urea and the polyamine prepolymer forms urea bonds in the polyurethane/urea, and further wherein at least about 4% by weight of the combined soft segments is formed by polyamine prepolymers that form urea bonds in the polyurethane/urea polymer.
摘要翻译： 一种包含水的喷墨油墨组合物和至少一种具有至少由多元醇预聚物形成的第一软链段和至少由多胺预聚物形成的第二软链段的水分散性聚氨酯/脲聚合物，其中所述多元醇预聚物形成氨基甲酸酯键 在聚氨酯/尿素和多胺预聚物中在聚氨酯/尿素中形成脲键，并且其中至少约4重量％的组合软链段由在聚氨酯/脲聚合物中形成尿素键的聚胺预聚物形成。
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