摘要:
Disclosed are a fast, highly-integrated and highly-reliable magnetoresistive random access memory (MRAM) and a semiconductor device which uses the MRAM. The semiconductor device performs the read-out operation of the MRAM using memory cells for storing information by using a change in magnetoresistance of a magnetic tunnel junction (MTJ) element with a high S/N ratio. Each memory cell includes an MTJ element and a bipolar transistor. The read-out operation is carried out by selecting a word line, amplifying a current flowing in the MTJ element of a target memory cell by the bipolar transistor and outputting the-amplified current to an associated read data line.
摘要:
There are provided a reference voltage generating method used for reading out operation of a memory cell having amplification ability, and a dummy cell. The memory cell is comprised of a read NMOS transistor, a write transistor, and a coupled-capacitance. The dummy cell is made such that two memory cells are connected in series. The dummy cell is arranged at the most far end of each of the data lines against the sense amplifier. A reference voltage is generated by making a difference in an amount of current flowing in each of the read NMOS transistors of the memory cell and the dummy cell. As a result, DRAM showing a higher speed, a higher integration and a lower electrical power as compared with those of the prior art device can be realized.
摘要:
An SDRAM has its operation mode selected to be the SDR mode in response to the first state of the external terminal (OPT), thereby releasing data, which has been read out of a memory mat, in response to a clock signal produced by a clock regenerating circuit having a function of comparing the phases of the input and output of the circuit, or selected to be the DDR mode in response to the second state of the external terminal (OPT), thereby releasing data, which has been read out of the memory mat, in response to a clock signal produced by a clock signal generation circuit in synchronism with an external clock signal.
摘要:
A phase control circuit comprises a plurality of fixed delay circuits (200-0 through 200-5) which assign different predetermined delay times to a first clock signal (BDA1) respectively, a detection circuit (201) which receives clock signals outputted from the plurality of fixed delay circuits and a second clock signal (PCLK) different in phase from the first clock signal therein and generates detected signals (202) represented in a plurality of bits each corresponding to the difference in phase between the first clock signal and the second clock signal, and a variable delay circuit (200-6) which gives a delay in the phase difference corresponding to each of the detected signals to a third clock signal (BDA2).
摘要:
A frequency determination circuit generating a clock signal phase-locking with an external clock signal at a coarse precision and a fine adjust circuit generating an internal synchronizing signal phase-locking with the external clock signal at a fine precision are provided. The fine adjust circuit has a function of adjusting the phase of the frequency determination circuit when phase synchronization is to be carried out exceeding the adjust range thereof. The frequency determination circuit and the fine adjust circuit receive a clock power supply voltage. A clock reproduction circuit is provided which generates an internal clock signal phase-locking with an external clock signal or a reference clock signal stably even when the operating environment changes.
摘要:
The purpose of the present invention is to improve a rewriting transmission rate and reliability of a phase change memory. To attain the purpose, a plurality of phase change memory cells (SMC or USMC) which are provided in series between a word line (2) and a bit line (3) and have a selection element and a storage element that are parallel connected with each other are entirely set, and after that, a part of the cells corresponding to a data pattern is reset. Alternatively, the reverse of the operation is carried out.
摘要:
A highly-reliable, highly-integrated large-capacity phase-change memory is achieved. For this purpose, for example, memory tiles MT0, MT1 are provided respectively at points of intersection of global bit line GBL0 and global word lines GWL00B, GWL01B. Word lines WL000 of MT0, MT1 are commonly connected to an output from a word-line driving circuit WD0 which is controlled by GWL00B, and word lines WL001 of MT0, MT1 are commonly connected to an output from a word-line driving circuit WD1 controlled by GWL01B. For example, when WD0 is activated in accordance with a rewrite operation, an output from WD0 is connected to GBL0 via any one of four memory cells MC00, MC01 connected to WL000 of MT0, MT1.
摘要:
A high-speed large-capacity phase-change memory is achieved. A semiconductor device according to the present invention includes: a plurality of memory planes MP; a plurality of storage information register groups SDRBK paired with the plurality of memory planes; and a chip control circuit CPCTL. The plurality of memory planes include a plurality of memory cells. Also, the plurality of storage information register groups temporarily retain information to be stored in the plurality of memory planes. Further, the chip control circuit includes a register which temporarily stores a value indicating volume of the storage information, and a first storage information volume is smaller than a second storage information volume. When the first storage information volume is written, the plurality of memory planes and the plurality of storage information register groups are activated during a first period. When the second storage information volume is written, the plurality of memory planes and the plurality of storage information register groups are activated during a second period. By such a structure, the first period is shorter than the second period.
摘要:
To realize a fast and highly reliable phase-change memory system of low power consumption, a semiconductor device includes: a memory device which includes a first memory array having a first area including a plurality of first memory cells and a second area including a plurality of second memory cells; a controller coupled to the memory device to issue a command to the memory device; and a condition table for storing a plurality of trial writing conditions. The controller performs trial writing in the plurality of second memory cells a plurality of times based on the plurality of trial writing conditions stored in the condition table, and determines writing conditions in the plurality of first memory cells based on a result of the trial writing. The memory device performs writing in the plurality of first memory cells based on the writing conditions instructed from the controller.
摘要:
A semiconductor device has multiple memory cell groups arranged at intersections between multiple word lines and multiple bit lines intersecting the word lines. The memory cell groups each have first and second memory cells connected in series. Each of the first and the second memory cells has a select transistor and a resistive storage device connected in parallel. The gate electrode of the select transistor in the first memory cell is connected with a first gate line, and the gate electrode of the select transistor in the second memory cell is connected to a second gate line. A first circuit block for driving the word lines (word driver group WDBK) is arranged between a second circuit block for driving the first and second gate lines (phase-change-type chain cell control circuit PCCCTL) and multiple memory cell groups (memory cell array MA).