Vertical PMOS field effect transistor and manufacturing method thereof
    52.
    发明授权
    Vertical PMOS field effect transistor and manufacturing method thereof 有权
    垂直PMOS场效应晶体管及其制造方法

    公开(公告)号:US08802528B2

    公开(公告)日:2014-08-12

    申请号:US12725627

    申请日:2010-03-17

    IPC分类号: H01L21/336 H01L29/165

    摘要: A PMOS field effect transistor includes a substrate, a first nitride layer, a mesa structure, two gate oxide films, a gate stack layer and a second nitride layer. The substrate has a oxide layer and a first doping area. The first nitride layer is located on the oxide layer. The mesa structure includes a first strained Si—Ge layer, an epitaxial Si layer and a second strained Si—Ge layer. The first strained Si—Ge layer is located on the oxide layer and the first nitride layer. The epitaxial Si layer is located on the first strained Si—Ge layer. The second strained Si—Ge layer is located on the epitaxial Si layer. In the surface layer of the second strained Si—Ge layer, there is a second doping area. The two gate oxide films are located at two sides of the mesa structure.

    摘要翻译: PMOS场效应晶体管包括衬底,第一氮化物层,台面结构,两个栅极氧化物膜,栅极堆叠层和第二氮化物层。 衬底具有氧化物层和第一掺杂区域。 第一氮化物层位于氧化物层上。 台面结构包括第一应变Si-Ge层,外延Si层和第二应变Si-Ge层。 第一应变Si-Ge层位于氧化物层和第一氮化物层上。 外延Si层位于第一应变Si-Ge层上。 第二应变Si-Ge层位于外延Si层上。 在第二应变Si-Ge层的表面层中,存在第二掺杂区域。 两个栅氧化膜位于台面结构的两侧。

    Method of patterning metal alloy material layer having hafnium and molybdenum
    53.
    发明授权
    Method of patterning metal alloy material layer having hafnium and molybdenum 有权
    具有铪和钼的金属合金材料层的图形化方法

    公开(公告)号:US08691705B2

    公开(公告)日:2014-04-08

    申请号:US13118604

    申请日:2011-05-31

    IPC分类号: H01L21/302 H01L21/461

    CPC分类号: C23F1/26 H01L21/32134

    摘要: A method of patterning a metal alloy material layer having hafnium and molybdenum. The method includes forming a patterned mask layer on a metal alloy material layer having hafnium and molybdenum on a substrate. The patterned mask layer is used as a mask and an etching process is performed using an etchant on the metal alloy material layer having hafnium and molybdenum so as to form a metal alloy layer having hafnium and molybdenum. The etchant includes at least nitric acid, hydrofluoric acid and sulfuric acid. The patterned mask layer is removed.

    摘要翻译: 图案化具有铪和钼的金属合金材料层的方法。 该方法包括在基板上的具有铪和钼的金属合金材料层上形成图案化掩模层。 图案化掩模层用作掩模,并且使用具有铪和钼的金属合金材料层上的蚀刻剂进行蚀刻处理,以形成具有铪和钼的金属合金层。 蚀刻剂至少包括硝酸,氢氟酸和硫酸。 去除图案化的掩模层。

    Method for fabricating fine patterns of semiconductor device utilizing self-aligned double patterning
    55.
    发明授权
    Method for fabricating fine patterns of semiconductor device utilizing self-aligned double patterning 有权
    利用自对准双重图案化制造半导体器件精细图案的方法

    公开(公告)号:US08343871B2

    公开(公告)日:2013-01-01

    申请号:US12717923

    申请日:2010-03-04

    IPC分类号: H01L21/302

    CPC分类号: H01L21/31144 H01L21/0337

    摘要: A method for making a semiconductor device includes forming a first mask pattern on a device layer, forming a second mask pattern on the first mask pattern, etching the device layer not covered by the first and second mask patterns to thereby form a first trench, trimming the first mask pattern to form an intermediate mask pattern, depositing a material layer to fill the first trench, polishing the material layer to expose a top surface of the intermediate mask pattern, removing the intermediate mask pattern to form an opening, etching the device layer through the opening to thereby form a second trench.

    摘要翻译: 一种制造半导体器件的方法包括在器件层上形成第一掩模图案,在第一掩模图案上形成第二掩模图案,蚀刻未被第一和第二掩模图案覆盖的器件层,从而形成第一沟槽,修整 第一掩模图案以形成中间掩模图案,沉积材料层以填充第一沟槽,抛光材料层以暴露中间掩模图案的顶表面,去除中间掩模图案以形成开口,蚀刻器件层 通过开口形成第二沟槽。

    Recessed-gate transistor device having a dielectric layer with multi thicknesses and method of making the same
    56.
    发明授权
    Recessed-gate transistor device having a dielectric layer with multi thicknesses and method of making the same 有权
    具有多层厚度的电介质层的嵌入式晶体管器件及其制造方法

    公开(公告)号:US08343829B2

    公开(公告)日:2013-01-01

    申请号:US13171405

    申请日:2011-06-28

    IPC分类号: H01L21/8242 H01L21/336

    摘要: A recessed-gate transistor device includes a gate electrode embedded in a gate trench formed in a semiconductor substrate, wherein the gate trench includes a vertical sidewall and a U-shaped bottom. A source region is provided at one side of the gate trench within the semiconductor substrate. A drain region is provided at the other side thereof. An asymmetric gate dielectric layer is formed between the gate electrode and the semiconductor substrate. The asymmetric gate dielectric layer has a first thickness between the gate electrode and the drain region and a second thickness between the gate electrode and the source region, wherein the first thickness is thicker than the second thickness.

    摘要翻译: 凹入栅极晶体管器件包括嵌入在半导体衬底中形成的栅极沟槽中的栅电极,其中栅极沟槽包括垂直侧壁和U形底部。 源区域设置在半导体衬底内的栅极沟槽的一侧。 漏极区域设置在其另一侧。 在栅电极和半导体衬底之间形成非对称栅介质层。 不对称栅极介电层在栅电极和漏极区之间具有第一厚度,并且在栅极和源极区之间具有第二厚度,其中第一厚度比第二厚度厚。

    METHOD FOR FABRICATING FINE PATTERNS OF SEMICONDUCTOR DEVICE UTILIZING SELF-ALIGNED DOUBLE PATTERNING
    58.
    发明申请
    METHOD FOR FABRICATING FINE PATTERNS OF SEMICONDUCTOR DEVICE UTILIZING SELF-ALIGNED DOUBLE PATTERNING 有权
    用于制作自对准双图案的半导体器件的精细图案的方法

    公开(公告)号:US20110159691A1

    公开(公告)日:2011-06-30

    申请号:US12717923

    申请日:2010-03-04

    IPC分类号: H01L21/308 C23F1/00

    CPC分类号: H01L21/31144 H01L21/0337

    摘要: A method for making a semiconductor device includes forming a first mask pattern on a device layer, forming a second mask pattern on the first mask pattern, etching the device layer not covered by the first and second mask patterns to thereby form a first trench, trimming the first mask pattern to form an intermediate mask pattern, depositing a material layer to fill the first trench, polishing the material layer to expose a top surface of the intermediate mask pattern, removing the intermediate mask pattern to form an opening, etching the device layer through the opening to thereby form a second trench.

    摘要翻译: 一种制造半导体器件的方法包括在器件层上形成第一掩模图案,在第一掩模图案上形成第二掩模图案,蚀刻未被第一和第二掩模图案覆盖的器件层,从而形成第一沟槽,修整 第一掩模图案以形成中间掩模图案,沉积材料层以填充第一沟槽,抛光材料层以暴露中间掩模图案的顶表面,去除中间掩模图案以形成开口,蚀刻器件层 通过开口形成第二沟槽。

    Flash memory structure and method of making the same
    60.
    发明申请
    Flash memory structure and method of making the same 审中-公开
    闪存结构和制作方法相同

    公开(公告)号:US20080315284A1

    公开(公告)日:2008-12-25

    申请号:US11953886

    申请日:2007-12-11

    IPC分类号: H01L29/00 H01L21/336

    摘要: A flash memory cell includes a substrate, a T-shaped control gate disposed above the substrate, a floating gate embedded in a lower recess of the T-shaped control gate, a dielectric layer between the T-shaped control gate and the floating gate; a cap layer above the T-shaped control gate, a control gate oxide between the T-shaped control gate and the substrate, a floating gate oxide between the floating gate and the substrate, a liner covering the cap layer and the floating gate, and a source/drain region adjacent to the floating gate. The floating gate has a vertical wall surface that is coplanar with one side of the dielectric layer.

    摘要翻译: 闪存单元包括衬底,设置在衬底上方的T形控制栅极,嵌入在T形控制栅极的下凹槽中的浮置栅极,在T形控制栅极和浮置栅极之间的介电层; T形控制栅极上方的覆盖层,T形控制栅极和衬底之间的控制栅极氧化物,浮置栅极和衬底之间的浮置栅极氧化物,覆盖覆盖层和浮动栅极的衬底,以及 与浮动栅极相邻的源极/漏极区域。 浮动栅极具有与电介质层的一侧共面的垂直壁表面。