摘要:
In a method for verifying a printed circuit board (PCB) layout using a computing device, a PCB simulation file is obtained from a storage device of the computing device, and a PCB image is displayed on a display device according to the PCB simulation file. The PCB image includes multiple signal lines and switching voltage regulator nodes (SVRN). A SVRN to be checked is selected from the PCB image, and all signal lines around the SVRN are searched. The method calculates a layout distance between the selected SVRN and each of the searched signal lines, and generates a graphical window interface to position a signal line whose layout distance is equal to or less than the minimum distance. The method further modifies the layout of the positioned signal line to satisfy a layout design specification by increasing the layout distance to the minimum distance.
摘要:
A signal integrity test system and method uses an oscilloscope to test a signal on each test point of a transmission line, obtains test parameter values of the signal on each test point, and compares the test parameter values with preset standard values. If any test parameter value does not match a corresponding preset standard value, a time-domain reflectometer is used to test an impedance value of the test point. If the impedance value matches a standard impedance value of the transmission line, the system and method determines the signal on the test point satisfies integrity requirements.
摘要:
A motherboard interconnection device includes a top layer, a bottom layer, a first and a third electronic elements positioned on the top layer, and a second and a fourth electronic elements positioned on the bottom layer. A first end of the first electronic element on the top layer is connected to the first end of the second electronic element on the bottom layer with a first via hole, and the first end of the third electronic element on the top layer is connected to the first end of the fourth electronic element on the bottom layer with a second via hole. The second ends of the two electronic elements on the top layer are connected to a first part, and the second ends of the two electronic elements on the bottom layer are connected to a second part.
摘要:
A clamping apparatus includes a motor, a first cone gear secured to a shaft of the motor, and two clamping bodies attached to opposite sides of the motor. Each of the clamping bodies includes a second cone gear meshing with the first, a threaded post fixed to the second cone gear, a carriage threadedly connected with the threaded post, and a clamp arm fixed to the carriage. The motor rotates the first cone gear, and in turn the second cone gears and the corresponding threaded posts. With the rotation of the threaded posts, the carriages move towards or away from each other, whereby the clamp arms cooperatively acquire an object between the clamp arms, or release the object therefrom.
摘要:
A printed circuit board includes a signal plane and a reference plane. The signal plane includes a pad, a passive element mounted on the pad, and a signal transmission line electrically connected to the passive element via the pad. The reference plane provides a return path for a signal transmitted through the passive element and the signal transmission line. A void is defined in the reference plane corresponding to the passive element, to increase a length of the return path. A length of a first axis, perpendicular to the signal transmission line, of the void satisfies a following equation: W 1 ≈ 8 Wpad + 10 T 0.8 Wtrace + T , wherein Wpad is a width of the pad, Wtrace is a width of the transmission line, T is the height of the pad.
摘要:
An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer, a distance between the first signal layer and the second signal layer is greater than a distance between the first reference layer and the first signal layer, a second differential pair is arranged in the second signal layer and the third signal layer in broad-coupled structure. The PCB has a high density layout of transmission lines.
摘要:
An exemplary FPCB includes a signal layer having a differential pair consisting of two transmission lines arranged therein, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. Two sheets made of conductive materials are respectively arranged at opposite sides of the differential pair, and both connected to ground. The sheets are apart from and parallel to the transmission lines. The ground layer has a void defined therein, and the void is located under the two transmission lines.
摘要:
An exemplary motherboard includes a driving module, a first slot module arranged for mounting a first type of memory and connected to the driving module via a first channel, a second slot module arranged for mounting a second type of memory and connected to the driving module via a second channel, and a voltage regulator electronically connected to the first slot module and the second slot module. The first memory and the second memory are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of the memory mounted on the motherboard accordingly.
摘要:
An exemplary FPCB includes a differential pair consisting of a first transmission line and a second transmission line, a signal layer with the first transmission line arranged therein, a ground layer having a void which includes the area beneath the first transmission line, and a dielectric layer lying between the signal layer and the ground layer. The second transmission line is arranged in the ground layer offset from the first transmission line in the horizontal direction. The FPCB can transmit high speed signals.
摘要:
A motherboard includes a first slot arranged for mounting a first type of memory, a second slot arranged for mounting a second type of memory, and a voltage regulating circuit electronically connected to the first slot and the second slot. The first memory and the second memory are alternatively mounted on the motherboard, the voltage regulating circuit detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of the memory mounted on the motherboard accordingly.