公开(公告)号：US09928991B2

公开(公告)日：2018-03-27

申请号：US15581164

申请日：2017-04-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Eric J. Campbell ,  Sarah K. Czaplewski

IPC: H01J37/28 ,  G01B15/00 ,  G01N23/22

CPC classification number: H01J37/28 ,  G01B15/02 ,  G01B15/04 ,  G01N23/22 ,  G01N23/2252 ,  G01N2223/079 ,  G01N2223/304 ,  G01N2223/418 ,  G01N2223/633 ,  H01J37/222 ,  H01J2237/221 ,  H01J2237/24578 ,  H01J2237/24585 ,  H01J2237/248 ,  H01J2237/2807 ,  H01J2237/2815

Abstract: A method for generating cross-sectional profiles using a scanning electron microscope (SEM) includes scanning a sample with an electron beam to gather an energy-dispersive X-ray spectroscopy (EDS) spectrum for an energy level to determine element composition across an area of interest. A mesh is generated to locate positions where a depth profile will be taken. EDS spectra are gathered for energy levels at mesh locations. A number of layers of the sample are determined by distinguishing differences in chemical composition between depths as beam energies are stepped through. A depth profile is generated for the area of interest by compiling the number of layers and the element composition across the mesh.

公开(公告)号：US09928990B2

公开(公告)日：2018-03-27

申请号：US15427764

申请日：2017-02-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Eric J. Campbell ,  Sarah K. Czaplewski

IPC: H01J37/28 ,  H01J37/22

CPC classification number: H01J37/28 ,  G01B15/02 ,  G01B15/04 ,  G01N23/22 ,  G01N23/2252 ,  G01N2223/079 ,  G01N2223/304 ,  G01N2223/418 ,  G01N2223/633 ,  H01J37/222 ,  H01J2237/221 ,  H01J2237/24578 ,  H01J2237/24585 ,  H01J2237/248 ,  H01J2237/2807 ,  H01J2237/2815

Abstract: A method for generating cross-sectional profiles using a scanning electron microscope (SEM) includes scanning a sample with an electron beam to gather an energy-dispersive X-ray spectroscopy (EDS) spectrum for an energy level to determine element composition across an area of interest. A mesh is generated to locate positions where a depth profile will be taken. EDS spectra are gathered for energy levels at mesh locations. A number of layers of the sample are determined by distinguishing differences in chemical composition between depths as beam energies are stepped through. A depth profile is generated for the area of interest by compiling the number of layers and the element composition across the mesh.

公开(公告)号：US20180019097A1

公开(公告)日：2018-01-18

申请号：US15544788

申请日：2015-12-21

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Minoru HARADA ,  Yuji TAKAGI ,  Takehiro HIRAI

IPC: H01J37/22 ,  G06T5/50 ,  G01B15/04 ,  G06T7/00

CPC classification number: H01J37/22 ,  G01B15/04 ,  G01B2210/48 ,  G01N23/22 ,  G06T5/50 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: An inspection method uses a charged particle microscope to observe a sample and view a defect site or a circuit pattern. A plurality of images is detected by a plurality of detectors and a mixed image is generated by automatically adjusting and mixing weighting factors required when the plurality of images are synthesized with each other. The sample is irradiated and scanned with a charged particle beam so that the plurality of detectors arranged at different positions from the sample detects a secondary electron or a reflected electron generated from the sample. The mixed image is generated by mixing the plurality of images of the sample with each other for each of the plurality of detectors, which are obtained by causing each of the plurality of detectors arranged at the different positions to detect the secondary electron or the reflected electron. The generated mixed image is displayed on a screen.

公开(公告)号：US09852881B2

公开(公告)日：2017-12-26

申请号：US15039527

申请日：2014-11-19

Applicant: Hitachi High-Technologies Corporation

Inventor： Chie Shishido ,  Takuma Yamamoto ,  Shinya Yamada ,  Maki Tanaka

IPC: H01J37/29 ,  H01J37/26 ,  G01B15/00 ,  G01B21/00 ,  H01J37/244 ,  H01J37/28 ,  G01B15/04 ,  H01L21/66

CPC classification number: H01J37/29 ,  G01B15/00 ,  G01B15/04 ,  G01B2210/56 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/24475 ,  H01J2237/2448 ,  H01J2237/24495 ,  H01J2237/2806 ,  H01J2237/281 ,  H01J2237/2815 ,  H01L22/12

Abstract: In order to allow detecting backscattered electrons (BSEs) generated from the bottom of a hole for determining whether a hole with a super high aspect ratio is opened or for inspecting and measuring the ratio of the top diameter to the bottom diameter of a hole, which are typified in 3D-NAND processes of opening a hole, a primary electron beam accelerated at a high accelerating voltage is applied to a sample. Backscattered electrons (BSEs) at a low angle (e.g. a zenith angle of five degrees or more) are detected. Thus, the bottom of a hole is observed using “penetrating BSEs” having been emitted from the bottom of the hole and penetrated the side wall. Using the characteristics in which a penetrating distance is relatively prolonged through a deep hole and the amount of penetrating BSEs is decreased to cause a dark image, a calibration curve expressing the relationship between a hole depth and the brightness is given to measure the hole depth.

公开(公告)号：US09830524B2

公开(公告)日：2017-11-28

申请号：US14239803

申请日：2012-05-24

Applicant: Tomoko Sekiguchi ,  Takeyoshi Ohashi ,  Junichi Tanaka ,  Zhaohui Cheng ,  Ruriko Tsuneta ,  Hiroki Kawada ,  Seiko Hitomi

Inventor： Tomoko Sekiguchi ,  Takeyoshi Ohashi ,  Junichi Tanaka ,  Zhaohui Cheng ,  Ruriko Tsuneta ,  Hiroki Kawada ,  Seiko Hitomi

IPC: G01N23/22 ,  G06K9/46 ,  H01J37/317 ,  G01B15/04 ,  B82Y10/00 ,  B82Y40/00 ,  G06T7/00 ,  H01L21/66

CPC classification number: G06K9/4604 ,  B82Y10/00 ,  B82Y40/00 ,  G01B15/04 ,  G01N23/22 ,  G06T7/0004 ,  H01J37/3174 ,  H01J2237/221 ,  H01J2237/226 ,  H01J2237/2816 ,  H01J2237/31754 ,  H01J2237/31796 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In the present invention, at the time of measuring, using a CD-SEM, a length of a resist that shrinks when irradiated with an electron beam, in order to highly accurately estimate a shape and dimensions of the resist before shrink, a shrink database with respect to various patterns is previously prepared, said shrink database containing cross-sectional shape data obtained prior to electron beam irradiation, a cross-sectional shape data group and a CD-SEM image data group, which are obtained under various electron beam irradiation conditions, and models based on such data and data groups, and a CD-SEM image of a resist pattern to be measured is obtained (S102), then, the CD-SEM image and data in the shrink database are compared with each other (S103), and the shape and dimensions of the pattern before the shrink are estimated and outputted (S104).

公开(公告)号：US20170241919A1

公开(公告)日：2017-08-24

申请号：US15507999

申请日：2014-09-02

Applicant: NOBUKATSU MACHII ,  FURNINORL HAYANO ,  AKITOSHI KAWAI

Inventor： NOBUKATSU MACHII ,  FURNINORL HAYANO ,  AKITOSHI KAWAI

IPC: G01N23/04 ,  G01B15/04

CPC classification number: G01N23/04 ,  G01B15/04 ,  G01N23/046 ,  G01N2223/304 ,  G01N2223/306 ,  G01N2223/646

Abstract: A measurement processing device used for an x-ray inspection apparatus that detects an x-ray passing through a specimen with a detection unit to sequentially inspect a plurality of specimens on the basis of an acquired transmission image, includes a setting unit that sets a region to be inspected on a portion of the specimen; a determination unit that determines the non-defectiveness of the region to be inspected by using a transmission image of the x-ray that passed through the region to be inspected; a correction unit that performs a correction on the region to be inspected on the basis of a determination result by the determination unit; and a display control unit that displays the corrected region to be inspected corrected by the correction unit.

公开(公告)号：US20170199137A1

公开(公告)日：2017-07-13

申请号：US15059478

申请日：2016-03-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Eric J. Campbell ,  Sarah K. Czaplewski

IPC: G01N23/225 ,  G01B15/04 ,  G01B15/00

CPC classification number: H01J37/28 ,  G01B15/02 ,  G01B15/04 ,  G01N23/22 ,  G01N23/2252 ,  G01N2223/079 ,  G01N2223/304 ,  G01N2223/418 ,  G01N2223/633 ,  H01J37/222 ,  H01J2237/221 ,  H01J2237/24578 ,  H01J2237/24585 ,  H01J2237/248 ,  H01J2237/2807 ,  H01J2237/2815

Abstract: A method for generating cross-sectional profiles using a scanning electron microscope (SEM) includes scanning a sample with an electron beam to gather an energy-dispersive X-ray spectroscopy (EDS) spectrum for an energy level to determine element composition across an area of interest. A mesh is generated to locate positions where a depth profile will be taken. EDS spectra are gathered for energy levels at mesh locations. A number of layers of the sample are determined by distinguishing differences in chemical composition between depths as beam energies are stepped through. A depth profile is generated for the area of interest by compiling the number of layers and the element composition across the mesh.

公开(公告)号：US09702835B1

公开(公告)日：2017-07-11

申请号：US15059478

申请日：2016-03-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Eric J. Campbell ,  Sarah K. Czaplewski

IPC: G01N23/225 ,  G01B15/00 ,  G01B15/04

CPC classification number: H01J37/28 ,  G01B15/02 ,  G01B15/04 ,  G01N23/22 ,  G01N23/2252 ,  G01N2223/079 ,  G01N2223/304 ,  G01N2223/418 ,  G01N2223/633 ,  H01J37/222 ,  H01J2237/221 ,  H01J2237/24578 ,  H01J2237/24585 ,  H01J2237/248 ,  H01J2237/2807 ,  H01J2237/2815

Abstract: A method for generating cross-sectional profiles using a scanning electron microscope (SEM) includes scanning a sample with an electron beam to gather an energy-dispersive X-ray spectroscopy (EDS) spectrum for an energy level to determine element composition across an area of interest. A mesh is generated to locate positions where a depth profile will be taken. EDS spectra are gathered for energy levels at mesh locations. A number of layers of the sample are determined by distinguishing differences in chemical composition between depths as beam energies are stepped through. A depth profile is generated for the area of interest by compiling the number of layers and the element composition across the mesh.

公开(公告)号：US09658063B2

公开(公告)日：2017-05-23

申请号：US14897609

申请日：2014-05-27

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Atsuko Yamaguchi ,  Hiroki Kawada

IPC: G01B15/04 ,  H01J37/22

CPC classification number: G01B15/04 ,  G01B2210/56 ,  H01J37/222 ,  H01J2237/22 ,  H01J2237/24592 ,  H01J2237/28 ,  H01J2237/2809 ,  H01J2237/2817

Abstract: The present invention pertains to a method and device for quantitatively evaluating the degree and characteristics of wiggling, which is a phenomenon that occurs in electronic device fabrication processes and consists of the deformation in the same shape of the left and right edges of fine line patterns, and takes advantage of the fact that this wiggling is included in measured values for line edge variation but not line width variation by acquiring the differences between these values. Further, the present invention is configured so as to calculate line center positions and use the distribution of the deviation from the average line center position as an indicator. Additionally, the present invention is configured to quantify wiggling characteristics by outputting a coefficient of wiggling correlation between lines or a wiggling component synchronized between lines as an indicator.

公开(公告)号：US09625257B2

公开(公告)日：2017-04-18

申请号：US14323522

申请日：2014-07-03

Applicant: Ralf Christoph ,  Wolfgang Rauh

Inventor： Ralf Christoph ,  Wolfgang Rauh

IPC: G01N23/00 ,  G01B15/00 ,  A61B6/00 ,  G01B15/04 ,  G01N23/04 ,  G01T7/00 ,  G01T7/10 ,  G01N23/083

CPC classification number: G01B15/00 ,  A61B6/4417 ,  A61B6/583 ,  A61B6/584 ,  G01B15/04 ,  G01N23/046 ,  G01N23/083 ,  G01N2223/1006 ,  G01N2223/3306 ,  G01N2223/419 ,  G01T7/005 ,  G01T7/10

Abstract: The invention relates to a coordinate measuring apparatus for measuring an object, having an x-ray sensory mechanism as a first sensory mechanism that is provided with an x-ray source and at least one x-ray sensor which detects the x-rays, and a second sensory mechanism such as a tactile and/or an optical sensory mechanism that can be placed in the x, y, and/or z direction of the coordinate measuring apparatus in relation to the object. In order to be able to easily measure also large-size test objects, the x-ray sensory mechanism can be positioned in the coordinate measuring apparatus according to the second sensory mechanism.