摘要:
Certain example embodiments relate to a burner for use in combustion deposition depositing a coating on a substrate. First and second spaced-apart combustion gas manifolds are configured to respectively produce first and second flames (which may effectively combine to form a single flame front beyond the outer face of the burner in certain example embodiments). The first and second combustion gas manifolds form a precursor reaction zone therebetween. An adjustable precursor delivery manifold located between the first and second combustion gas manifolds is configured to receive a precursor used in forming the coating. The precursor delivery manifold is positioned so as to substantially directly provide the precursor to a desired or predetermined portion of the precursor reaction zone. The precursor delivery manifold includes first and second cooled walls arranged to reduce the occurrence of precursor pre-reactions upstream of the precursor reaction zone. The burners of certain example embodiments may be used to combustion deposition deposit metal oxide coatings onto glass substrates.
摘要:
The present invention relates to an enhanced cyclic deposition process suitable for deposition of barrier layers, adhesion layers, seed layers, low dielectric constant (low-k) films, high dielectric constant (high-k) films, and other conductive, semi-conductive, and non-conductive films. The deposition enhancement is derived from ions generated in a plasma. The techniques described reduce the time required for plasma stabilization, thereby reducing deposition time and improving efficiency.
摘要:
An apparatus for processing a substrate includes: a process chamber providing a reaction space by a combination of a lid and a body; a susceptor in the reaction space and having a substrate thereon; a plurality of plasma source electrodes over the reaction space; a plurality of first lower protruding portions under the lid; and a plurality of first gas injecting means corresponding to the plurality of plasma source electrodes and a plurality of second gas injecting means alternately disposed with the plurality of first gas injecting means.
摘要:
Method and apparatus for depositing film on flexible (plastic/metal) foil and/or temperature sensitive substrates (101) by combustion chemical vapor deposition (C-CVD). A substrate (101) is held in place to provide physical and conductive thermal contact between the substrate (101) and a substrate holder (102). The substrate holder (102) is cooled using a cooling fluid and the substrate (101) and burner are moved relative to each other as C-CVD takes place. Heating of the substrate (101) during C-CVD is controlled and deterioration by heating is avoided. The foil or substrate (101) is suitable, in particular, for use in flat and flexible displays.
摘要:
A multi-layer thin film stack, particularly suitable as a component of a solar cell, is deposited on a transparent dielectric substrate. The multi-layer film stack comprises a transparent electrically conductive metal oxide layer deposited over the dielectric substrate, the conductive metal oxide layer having a refractive index less than 2.0, a light transmittance optimizing interlayer having a refractive index between 2.3 and 3.5, deposited over the electrically conductive metal oxide layer, and a silicon layer having a refractive index of at least 4.5 deposited over the light transmittance optimizing interlayer. The film stack can be deposited by any suitable method, but deposition of each of these layers by atmospheric chemical vapor deposition is preferred.
摘要:
An insulating film deposition chamber 40 has a plasma generator 14 having a plasma generation chamber 21 separated from the film deposition chamber 13 in which the substrate is arranged. A material gas is directly supplied to the film deposition chamber, and radicals are introduced into the film deposition chamber from the plasma generator, and a thin film is deposited on the substrate. Further, a cleaning gas feeder is added to the plasma generator. A cleaning gas is introduced through the cleaning gas feeder to produce plasma at the plasma generator to generate radicals, and the radicals are introduced into the film deposition chamber and irradiate the substrate to clean it.
摘要:
The present invention is a microwave plasma processing apparatus comprising: a chamber in which an object to be processed is housed; a process gas supply unit that supplies a process gas into the chamber; a microwave generating source that generates a microwave for forming a plasma due to the process gas in the chamber; a waveguide unit that guides the microwave generated by the microwave generating source toward the chamber; a planar antenna made of a conductive material provided with a plurality of microwave radiating holes for radiating the microwave guided by the waveguide unit toward the chamber; a microwave transmitting plate made of a dielectric material, the microwave transmitting plate serving as a top wall of the chamber and transmitting the microwave that has passed through the microwave radiating holes of the planar antenna; and a slow-wave plate disposed on an opposite side of the planar antenna relative to the microwave transmitting plate, the slow-wave plate having a function of shortening a wavelength of the microwave that reaches the planar antenna. The planar antenna and the microwave transmitting plate are in contact with each other, with substantially no air therebetween, the slow-wave plate and the microwave transmitting plate are made of the same material, and an equivalent circuit formed by the slow-wave plate, the planar antenna, the microwave transmitting plate, and the plasma due to the process gas formed in the chamber satisfies a resonance condition.
摘要:
ALD apparatuses and methods of depositing multiple layers employ a plurality of reaction spaces. The reaction chamber includes inlets configured to introduce reactant gases sufficient to achieve a first ALD process into a first set of the reaction spaces for a first period of time such that the reactant gases are not mixed one another. The ALD apparatus further includes a driver configured to move the substrates through all of the of reaction spaces in a plurality of cycles during the first period such that a first thin film is deposited by space-divided ALD on each of the substrates. Other inlets introduce reactant gases sufficient to achieve a second ALD process into a second set of the reaction spaces for a second period of time, while purge gas is fed to the first set of reaction spaces. The driver moves the substrates through all of the reaction spaces in a plurality of cycles during the second period such that a second thin film of a different composition from the first film is deposited by space-divided ALD on each of the substrates. Additional sets of reaction spaces can be added for third, fourth, etc. ALD processes. The configuration of the ALD apparatus permits deposition of nanolaminate films on a plurality of substrates for a relatively short period of time while preventing undesired deposition by reaction between the reactant gases.
摘要:
A method and system for coating a glass contacting surface with a thermal barrier and lubricious coating. The system uses a novel exterior surface mixing tip device wherein oxygen is supplied through a predetermined portion of one supply line, and a predetermined gas is supplied through a predetermined portion of another supply line enveloping the first predetermined portion.
摘要:
A lid liner for a chemical vapor deposition chamber includes an annular portion having an inner surface for surrounding a reaction volume within the chemical deposition chamber; a mounting tab formed on an outer surface of the annular portion; and a hole formed in the mounting tab for receiving a fastener wherein the hole does not penetrate the inner surface of the annular portion.