Abstract:
Process for the manufacture of calibration structures particularly for the calibration of machines for measuring alignment in integrated circuits in general, the peculiarity of which consists in the fact that calibration structures are provided in which the alignment of one layer with respect to another layer is set to a known extent by means of a single masking.
Abstract:
The cell comprises a substrate with diffusions of source and drain separated by a channel area a floating gate superimposed over a first part of said channel area and a control gate formed by a first and a second polysilicon strip, respectively, a cell gate oxide between said floating gate and said first part of the channel area, a transistor gate oxide between said control gate and a second part of the channel area, an interpoly oxide between said floating gate and said control gate and a layer of dielectric filler. By means of a process which provides for self-aligned etchings of layers of polysilicon and of oxides there is obtained a floating gate and a control gate self-aligned with one another and with the diffusions of source and drain, as well as with the first oxide.
Abstract:
The probability of soft-programming of the reference cells of a FLASH-EPROM memory may be excluded by having a decoupling transistor of a type of conductivity opposite to that of the cells functionally connected between the gate of each reference cell and the respective row line. Moreover the elimination of the electrical stresses to which the reference cells are subjected during the repeated programming cycles of the memory cells, increases the stability of the respective reference values of threshold and current level provided by the reference cells, thus increasing the reliability of the device.
Abstract:
In a CMOS logic circuit destined to function at a relatively high supply voltage such as to require the formation of graded diffusions in the structure of N-MOS transistors, a NAND configuration is used which comprises a staked pair of N-MOS transistors. This permits to restrict the number of graded diffusions to be formed in N-MOS structures only to the drain regions which are directly connected to an output node. In clocked CMOS circuitry where transfer transistors are normally used between gates, the advantages in terms of enhanced speed and ability of the circuit to be compacted by cutting the number of N-MOS structures necessarily provided with drain extension regions as in prior art circuits, are remarkable.
Abstract:
The generator of reference voltage comprises a first current generator suitable for generating a current that varies linearly with the supply voltage, a first voltage generator suitable for generating a constant voltage with zero thermal drift, a second current generator suitable for generating a current dependent on the voltage with zero thermal drift, a second voltage generator suitable for generating a voltage with given thermal drift, a third current generator suitable for generating a current dependent on the voltage with given thermal drift and means for combining the three currents together so as to produce across an output resistance an output voltage having a value equal to the product of the output resistance by the first and third current, divided by the second current.
Abstract:
In a dynamic automatic loop for control of the overall gain of an input circuit of a superheterodyne receiver, the response time of the HF-AGC circuit of the TUNER, in response to the action of the TUNER DELAY circuit activated by the IF-AGC in the case of autonomously uncontrollable abrupt increases in the level of the antenna signal from the same HF-AGC of the TUNER, is markedly reduced using an additional TUNER DELAY PLUS circuit able to absorb for a determined interval of time, a discharge current from the storage capacitor the control voltage of the HF-AGC in addition to the discharge current absorbed by the existing TUNER DELAY circuit. The relevant intensity of this additional discharge current and its duration are optimized by way of suitable circuital arrangements in the design of said TUNER DELAY PLUS circuit. The response time is reduced without modifying the time constant of the HF-AGC, which cannot be freely reduced because of inter- and cross-modulation problems.
Abstract:
An amplifier including first and second input transistors which are connected to respective first and second feedback amplification circuits associated with respective frequency-compensating capacitances. The second feedback amplification circuit has a two-stage structure and includes an internal compensating capacitance. The three frequency-compensating capacitances can have low values and can thus conveniently be integrated in the same chip as the amplifier. The amplifier can be used, in particular, as an interface between a zirconium-dioxide oxygen sensor and an electronic control unit which have different earth conductors.
Abstract:
A metal heat sink baseplate of a resin-encapsulated semiconductor power device, onto which the semiconductor die is bonded, is provided with one or more raised portions near the perimeter of the bound area of the semiconductor die, onto which ground wires may be welded in order to increase the reliability of wire connections realized between ground connecting pads and the metallic heat sink baseplate itself. The raised portions are preferably obtained by deep drawing the metal of the baseplate. A Single-In-Line semiconductor device is shown wherein the deep drawing of the metal heat sink baseplate for realizing a ridge on the assembly face, to be used for realizing wire ground connections is formed in a separation zone between a portion of the metallic baseplate which extends beyond the perimeter of the encapsulating resin body and onto which the fastening means of an external heat sink are arranged, and the remaining part of the baseplate onto which the semiconductor die is bonded. The deep drawing performed in this zone is also instrumental in providing a mechanical decoupling between the two portions of the metallic baseplate for reducing transmission of flection stresses.
Abstract:
The bias and precharging circuit comprises a bias part and a precharging part of the bit line together with a sensing amplifier operating by comparison of the voltage of the bit line and a dummy bit line. The precharging part includes components which turn off the bias and precharging parts as soon as the sensing amplifier has read the cell subjected to precharging. The bias part includes components for amplifying the voltage unbalance produced by bias between the bit line and the dummy bit line. It provides a current-mirror to cause said voltage unbalance independently of the precharging part.
Abstract:
A power CMOS operational amplifier with a differential output, having an intrinsically stable current absorption under rest conditions, comprises two symmetric branches, each comprising a first folded cascode input inverting stage, a level shifting circuit, a second currant mirror type noninverting amplifying stage and a third output inverting stage, constituted by a complementary pair of transistors, connected in a common source configuration between the supply rails and driven by the output of the second noninverting stage and by the output of the level shifting circuit. Frequency compensation is accomplished by means of two capacitors connected between each of the two output terminals of the amplifier and the output of the first inverting stage and a node of the output branch of the noninverting current mirror stage. A single common mode feedback network stabilizes both symmetric branches of the amplifier.