公开(公告)号：US20150138436A1

公开(公告)日：2015-05-21

申请号：US14084410

申请日：2013-11-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H04N5/225 ,  B29D11/00 ,  B29C65/48

CPC classification number: H04N5/2253 ,  B29L2031/764 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H04N5/2257 ,  H01L2924/00014

Abstract: One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.

Abstract translation: 一个或多个实施例涉及光学模块组件，例如相机模块组件，以及形成它们的方法。 一个实施例涉及包括具有第一表面的基板的光学模块组件。 光学装置被固定到基板的第一表面并电耦合到基板。 成型体位于基板的第一表面上，位于光学装置的外侧。 成型体包括第一凹部。 透镜组件通过位于第一凹部中的粘合剂材料固定到模制主体上方的第一凹部上。 在一些实施例中，光学模块组件的成型体还包括与第一凹部间隔开的第二凹部。 透明材料通过位于第二凹部中的粘合剂材料固定在第二凹部上的成型体上。

公开(公告)号：US20150138420A1

公开(公告)日：2015-05-21

申请号：US14086507

申请日：2013-11-21

Applicant: STMicroelectronics Pte Ltd.

Inventor： Hk Looi ,  David Gani ,  Wee Chin Judy Lim ,  Bs Aw ,  Cheng-Hai Cheh

IPC: H04N5/225 ,  G02F1/1341 ,  G02F1/1345 ,  G02F1/1333 ,  G02F1/1343

CPC classification number: H04N5/2257 ,  G02F1/13452 ,  G03B3/10 ,  G03B5/00 ,  G03B17/02 ,  G03B2205/0046 ,  Y10T29/49117

Abstract: Electronics modules and methods of making electronics modules are provided. An electronics module includes a substrate having an electronic circuit mounted thereon, a lens mount affixed to the substrate, the lens mount having a lens assembly mounted therein, and a liquid crystal cell affixed to the lens mount over the lens assembly, the liquid crystal cell having electrical terminals, wherein the lens mount includes adhesive containment pockets that are filled with a conductive adhesive so as to contact the electrical terminals of the liquid crystal cell, wherein the adhesive containment pockets include contacts that are electrically connected to the substrate. In some embodiments, the electronics module is a camera module.

Abstract translation: 提供电子模块和制造电子模块的方法。 电子模块包括其上安装有电子电路的基板，固定到基板的透镜座，安装有透镜组件的透镜座，以及固定在透镜组件上方的透镜座的液晶单元，液晶盒 具有电端子，其中所述透镜座包括粘合剂容纳袋，其填充有导电粘合剂以便接触所述液晶单元的电端子，其中所述粘合剂容纳袋包括电连接到所述基板的触点。 在一些实施例中，电子模块是相机模块。

公开(公告)号：US09013012B2

公开(公告)日：2015-04-21

申请号：US13785938

申请日：2013-03-05

Applicant: STMicroelectronics Pte Ltd.

Inventor： Ravi Shankar ,  Olivier Le Neel ,  Shian Yeu Kam ,  Tien Choy Loh

IPC: H01L29/84 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00293 ,  B81B7/0041 ,  B81C2203/0136

Abstract: Embodiments of the present disclosure are related to MEMS devices having a suspended membrane that are secured to and spaced apart from a substrate with a sealed cavity therebetween. The membrane includes openings with sidewalls that are closed by a dielectric material. In various embodiments, the cavity between the membrane and the substrate is formed by removing a sacrificial layer through the openings. In one or more embodiments, the openings in the membrane are closed by depositing the dielectric material on the sidewalls of the openings and the upper surface of the membrane.

Abstract translation: 本公开的实施例涉及具有悬置膜的MEMS器件，其被固定到衬底上并与衬底间隔开密封腔。 膜包括具有由介电材料封闭的侧壁的开口。 在各种实施例中，通过从开口去除牺牲层来形成膜与衬底之间的空腔。 在一个或多个实施例中，通过将介电材料沉积在开口的侧壁和膜的上表面上来封闭膜中的开口。

公开(公告)号：US20150028187A1

公开(公告)日：2015-01-29

申请号：US13948507

申请日：2013-07-23

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Bin-Hong HUANG

IPC: H01L31/18 ,  H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L2224/16225

Abstract: An image sensor device may include a mounting substrate having an IC-receiving cavity therein and a filter-receiving opening aligned with the IC-receiving cavity, an image sensor integrated circuit (IC) within the IC-receiving cavity and having an image sensing area aligned with the filter-receiving opening, and an adhesive bead on the image sensor IC surrounding the image sensing area. Furthermore, an infrared (IR) filter may be within the filter-receiving opening and have peripheral portions contacting the adhesive bead.

Abstract translation: 图像传感器装置可以包括其中具有IC接收腔的安装基板和与IC接收腔对准的滤光器接收开口，IC接收腔内的图像传感器集成电路（IC），并且具有图像感测区域 与过滤器接收开口对准，以及围绕图像感测区域的图像传感器IC上的粘合剂珠粒。 此外，红外（IR）滤光器可以在过滤器接收开口内，并且具有与粘合剂珠接触的周边部分。

公开(公告)号：US20150001111A1

公开(公告)日：2015-01-01

申请号：US13931313

申请日：2013-06-28

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: B65D85/38

CPC classification number: H01L27/14683 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Embodiments of the present invention are directed to optical packages having a cover made of transparent material with a recess formed therein and methods of forming same. The recess may be formed in a periphery portion of the transparent material and may have various shapes and configurations. Adhesive is provided in at least a portion of the recess of the transparent material, which secures the transparent material to an image sensor.

Abstract translation: 本发明的实施例涉及具有由其中形成有凹部的透明材料制成的盖的光学封装及其形成方法。 凹部可以形成在透明材料的周边部分中，并且可以具有各种形状和构造。 粘合剂设置在透明材料的凹部的至少一部分中，其将透明材料固定到图像传感器。

公开(公告)号：US20140340452A1

公开(公告)日：2014-11-20

申请号：US13893472

申请日：2013-05-14

Applicant: STMICROELECTRONICS ASIA PACIFIC PTE. LTD. ,  STMICROELECTRONICS PTE. LTD. ,  STMICROELECTRONICS, INC.

Inventor： Madanagopal Kunnavakkam ,  Jin Zhi Li ,  Teck Khim Neo ,  Kenneth W. Smiley ,  Chun Chek Bong

IPC: B41J2/14

CPC classification number: B41J2/14129 ,  B41J2/14072 ,  B41J2002/14387

Abstract: An ink jet printhead device includes a substrate and a plurality of thermal resistors on the substrate. Each thermal resistor includes first and second electrodes and a resistive layer extending therebetween. A polarity-changing driver is coupled to the plurality of thermal resistors and configured to change a driving polarity between the first and second electrodes of each of the plurality of thermal resistors.

Abstract translation: 喷墨打印头装置包括基板和基板上的多个热电阻器。 每个热敏电阻器包括第一和第二电极以及在它们之间延伸的电阻层。 极性改变驱动器耦合到多个热电阻器并且被配置为改变多个热电阻器中的每一个的第一和第二电极之间的驱动极性。

公开(公告)号：US20140292317A1

公开(公告)日：2014-10-02

申请号：US13853805

申请日：2013-03-29

Applicant: STMICROELECTRONICS PTE LTD.

Inventor： Olivier Le Neel ,  Ravi Shankar

IPC: G01N27/74

CPC classification number: H01L43/14 ,  G01N27/74 ,  H01L21/8234 ,  H01L43/04 ,  H01L43/065 ,  H01L43/10 ,  Y10T29/4913

Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measureable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.

Abstract translation: 微型氧传感器利用氧气的顺磁特性提供快速的响应时间，低功耗，提高的精度和灵敏度以及优异的耐久性。 所公开的微型氧传感器在半导体衬底中形成的微通道内保持环境空气样品。 O 2分子响应于施加的磁场而分离，从而建立可测量的霍尔电压。 环境空气样品中存在的氧气可以从施加磁场变化的霍尔电压变化推导出来。 磁场可以由外部磁体或集成到微通道内的气体感测腔中的薄膜磁体施加。 差分传感器还包括含有非磁化控制样品的参考元件。 微型氧传感器适用于智能手机等消费类产品中的实时空气质量监控。

公开(公告)号：US08836117B2

公开(公告)日：2014-09-16

申请号：US13652937

申请日：2012-10-16

Applicant: STMicroelectronics Pte. Ltd

Inventor： Yonggang Jin ,  How Yuan Hwang

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/49811 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/18162 ,  H01L2924/00

Abstract: An electronic device may include a bottom interconnect layer and an integrated circuit (IC) carried by the bottom interconnect layer. The electronic device may further include an encapsulation material on the bottom interconnect layer and laterally surrounding the IC. The electronic device may further include electrically conductive pillars on the bottom interconnect layer extending through the encapsulation material. At least one electrically conductive pillar and adjacent portions of encapsulation material may have a reduced height with respect to adjacent portions of the IC and the encapsulation material and may define at least one contact recess. The at least one contact recess may be spaced inwardly from a periphery of the encapsulation material.

Abstract translation: 电子设备可以包括底部互连层和由底部互连层承载的集成电路（IC）。 电子设备还可以包括底部互连层上的封装材料并横向包围IC。 电子器件还可以包括穿过封装材料的底部互连层上的导电柱。 至少一个导电柱和封装材料的相邻部分可以相对于IC和封装材料的相邻部分具有减小的高度，并且可以限定至少一个接触凹部。 所述至少一个接触凹部可以与所述封装材料的周边向内间隔开。

公开(公告)号：US08822267B2

公开(公告)日：2014-09-02

申请号：US13655036

申请日：2012-10-18

Applicant: STMicroelectronics Pte Ltd.

Inventor： How Yuan Hwang ,  Jay Maghirang ,  Yaohuang Huang ,  Kim-Yong Goh ,  Phone Maw Hla ,  Edmond Soon

IPC: H01L21/00

CPC classification number: H01L21/561 ,  H01L21/568 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/81 ,  H01L24/92 ,  H01L24/96 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2224/96 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are related to manufacturing system-in-packages at wafer-level. In particular, various embodiments are directed to adhering a first wafer to a second wafer and adhering solder balls to contact pads of the first wafer. In one embodiment, a first wafer having first and second surfaces is provided. The first wafer includes bond pads located on the first surface that are coupled to a respective semiconductor device located in the first wafer. A second wafer having an electrical component located therein is provided. A conductive adhesive is provided on at least one of the first wafer and the second wafer. Conductive balls are provided on the bond pads on the first surface of the first wafer. The conductive balls and the conductive adhesive are heated to cause the conductive balls to adhere to the bond pad and the conductive adhesive to adhere the first wafer to the second wafer.

Abstract translation: 本公开的实施例涉及在晶片级制造系统级封装。 具体地，各种实施例涉及将第一晶片粘附到第二晶片并将焊球粘附到第一晶片的接触焊盘。 在一个实施例中，提供具有第一和第二表面的第一晶片。 第一晶片包括位于第一表面上的接合焊盘，其耦合到位于第一晶片中的相应半导体器件。 提供了具有位于其中的电气部件的第二晶片。 在第一晶片和第二晶片中的至少一个上提供导电粘合剂。 导电球设置在第一晶片的第一表面上的接合焊盘上。 导电球和导电粘合剂被加热以使导电球粘附到接合焊盘和导电粘合剂以将第一晶片粘附到第二晶片。

公开(公告)号：US20130248887A1

公开(公告)日：2013-09-26

申请号：US13845445

申请日：2013-03-18

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS ,  STMICROELECTRONICS PTE LTD

Inventor： Romain Coffy ,  Eric Saugier ,  Hk Looi ,  Norbert Chevrier

IPC: H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S17/026 ,  H01L25/167 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H03K17/941 ,  H03K2017/9455 ,  H03K2217/94026 ,  H03K2217/94112 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.

Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。