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公开(公告)号：US08328207B2
公开(公告)日：2012-12-11
申请号：US12490670
申请日：2009-06-24
Applicant: Tadafumi Hirose , Masanori Shin , Makoto Uchimi , Takayuki Aoki
Inventor： Tadafumi Hirose , Masanori Shin , Makoto Uchimi , Takayuki Aoki
IPC: B62B1/20
CPC classification number: F02B63/04 , F02B63/047
Abstract: An engine generator movable on left and right wheels. The wheels are provided on a rear section of a bottom cover via an axle. A cylinder of an engine is disposed so as to incline upwards towards the direction of the axle. Inclining the cylinder lowers the center of gravity of the engine and disposes the axle positioned below the cylinder at a high position, thereby reducing the height of the engine generator. The orientation of the engine generator during travel is stabilized.
Abstract translation: 可在左右车轮上移动的发动机发电机。 车轮通过车轴设置在底盖的后部。 发动机的气缸被设置成朝向轴的方向向上倾斜。 气缸倾斜降低发动机的重心，将位于气缸下方的轴部置于高位置，从而降低发动机发电机的高度。 行驶过程中发动机发电机的方向稳定。
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公开(公告)号：US08210133B2
公开(公告)日：2012-07-03
申请号：US12485276
申请日：2009-06-16
Applicant: Tadafumi Hirose , Hitoshi Yuki , Takayuki Aoki , Ryosuke Shibata , Hiroki Iikura , Makoto Uchimi , Masashi Kai
Inventor： Tadafumi Hirose , Hitoshi Yuki , Takayuki Aoki , Ryosuke Shibata , Hiroki Iikura , Makoto Uchimi , Masashi Kai
CPC classification number: F02B63/04 , F01P5/06 , F02B63/047
Abstract: Engine cooling structure directs cooling air, introduced into a case by operation of a fan, to a cylinder block of an engine and then discharges the cooling air out of the case through an outlet port along meandering flow passages. Case cooling structure directs cooling along the inner surface of the case. Further cooling flow passage directs the air to vertically-oriented heat radiating fins so that the cooling air flows upward along the fins and then is discharged through the outlet port. Metal cooling-fan cover is supported by the lower cover via mounting members, and a resin-made cover guide is fastened to the engine together with supporting portions and interposed between the fan cover and the engine.
Abstract translation: 发动机冷却结构将通过风扇的操作引入壳体的冷却空气引导到发动机的气缸体，然后通过出口沿着弯曲的流动通道将冷却空气从壳体排出。 外壳冷却结构沿壳体的内表面引导冷却。 进一步的冷却流路将空气引导到垂直取向的散热片，使得冷却空气沿翅片向上流动，然后通过出口排出。 金属冷却风扇盖由下盖通过安装构件支撑，树脂制的盖引导件与支撑部分一起固定在发动机上，并插在风扇盖和发动机之间。
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公开(公告)号：US07930092B2
公开(公告)日：2011-04-19
申请号：US12200683
申请日：2008-08-28
Applicant: Kazuhito Tokugawa , Shinichi Ishikawa , Tomoo Shimokawa , Katsuaki Wachi , Satoshi Chida , Hiroyuki Utsumi , Takayuki Aoki
Inventor： Kazuhito Tokugawa , Shinichi Ishikawa , Tomoo Shimokawa , Katsuaki Wachi , Satoshi Chida , Hiroyuki Utsumi , Takayuki Aoki
IPC: B60T7/12
CPC classification number: F02P1/086 , F02D37/02 , F02D41/009 , F02D41/062 , F02D41/3082 , F02D2041/2013 , F02N3/04 , F02N11/0862 , F02N2250/02 , F02P7/067 , F02P15/00
Abstract: A control apparatus for an internal combustion engine, includes: a fuel injection unit; an ignition unit; a crank angle detection unit; a fuel pump; a booster unit; an ignition discharge unit; and a control unit that controls the fuel injection unit, the ignition unit, and the fuel pump, that ascertains ignition timings based on crank signals output from the crank angle detection unit, and that performs a startup control sequence that is made up of fuel injection processing, voltage boosting processing, ignition processing, and fuel supply processing.
Abstract translation: 一种用于内燃机的控制装置，包括：燃料喷射单元; 点火单元; 曲柄角检测单元; 燃油泵 增压机组; 点火放电单元; 以及控制单元，其控制燃料喷射单元，点火单元和燃料泵，其基于从曲柄角检测单元输出的曲柄信号确定点火正时，并且执行由燃料喷射构成的启动控制序列 处理，升压处理，点火处理和燃料供应处理。
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64.发明授权Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith 有权用于封装半导体器件的环氧树脂组合物和用其封装的半导体器件公开(公告)号：US07898094B2
公开(公告)日：2011-03-01
申请号：US11699370
申请日：2007-01-30
Applicant: Shoichi Osada , Takayuki Aoki
Inventor： Shoichi Osada , Takayuki Aoki
CPC classification number: C08G59/38 , C08G59/621 , C08L63/00 , H01L23/293 , H01L23/295 , H01L2924/0002 , H01L2924/00
Abstract: An epoxy resin composition comprising: (A) an epoxy resin having at least three epoxy groups per molecule and an epoxy equivalent of 170 or lower; (B) an epoxy resin having a phenolic nucleus and two epoxy groups in such an amount that a weight ratio of the epoxy resin (B) to the epoxy resin (A) ranges from 35/65 to 65/35; (C) a phenolic curing agent in such an amount that a molar ratio of phenolic hydroxyl groups to the whole epoxy groups in the composition ranges from 0.5 to 1.5; and (D) an inorganic filler in an amount of from 86 to 92 wt %, based on a total weight of the composition. The composition provides encapsulated semiconductor devices much less warped than those encapsulated with a conventional composition.
Abstract translation: 一种环氧树脂组合物，其包含：（A）每分子具有至少三个环氧基并且环氧当量为170或更低的环氧树脂; （B）环氧树脂（B）与环氧树脂（A）的重量比为35/65〜65/35的环氧树脂，其具有酚核和两个环氧基， （C）酚醛固化剂的用量使酚羟基与组合物中整个环氧基的摩尔比为0.5-1.5; 和（D）基于组合物总重量的86至92重量％的无机填料。 该组合物提供的封装半导体器件比用常规组合物封装的封装半导体器件弯曲得少得多。
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公开(公告)号：US20100104794A1
公开(公告)日：2010-04-29
申请号：US11997831
申请日：2006-07-28
Applicant: Takayuki Aoki , Toshio Shiobara
Inventor： Takayuki Aoki , Toshio Shiobara
CPC classification number: C08G59/42 , C08G59/3245 , C08L63/00 , H01L23/293 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , Y10T428/239 , H01L2924/00014 , H01L2924/00
Abstract: A thermosetting epoxy resin composition characterized by containing as a resin ingredient a product of pulverization of a solid matter obtained by reacting a triazine derivative/epoxy resin with an acid anhydride in such a proportion that the amount of the epoxy groups is 0.6-2.0 equivalents to the acid anhydride groups.
Abstract translation: 一种热固性环氧树脂组合物，其特征在于，作为树脂成分含有将三嗪衍生物/环氧树脂与酸酐反应得到的固体成分与环氧基的量为0.6〜2.0当量的比例相对于 酸酐基团。
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Patent Agency Ranking
公开(公告)号：US20090322046A1
公开(公告)日：2009-12-31
申请号：US12490670
申请日：2009-06-24
Applicant: Tadafumi Hirose , Masanori Shin , Makoto Uchimi , Takayuki Aoki
Inventor： Tadafumi Hirose , Masanori Shin , Makoto Uchimi , Takayuki Aoki
IPC: B62B1/20
CPC classification number: F02B63/04 , F02B63/047
Abstract: An engine generator movable on left and right wheels. The wheels are provided on a rear section of a bottom cover via an axle. A cylinder of an engine is disposed so as to incline upwards towards the direction of the axle. Inclining the cylinder lowers the center of gravity of the engine and disposes the axle positioned below the cylinder at a high position, thereby reducing the height of the engine generator. The orientation of the engine generator during travel is stabilized.
Abstract translation: 可在左右车轮上移动的发动机发电机。 车轮通过车轴设置在底盖的后部。 发动机的气缸被设置成朝向轴的方向向上倾斜。 气缸倾斜降低发动机的重心，将位于气缸下方的轴部置于高位置，从而降低发动机发电机的高度。 行驶过程中发动机发电机的方向稳定。
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67.发明申请公开(公告)号：US20090149559A1
公开(公告)日：2009-06-11
申请号：US12089600
申请日：2006-11-16
Applicant: Toshiaki Masuda , Ichiro Takahara , Kenichi Kitano , Katsushi Miki , Takeshi Inohara , Takeyoshi Fukuda , Takayuki Aoki , Satoshi Kawanami
Inventor： Toshiaki Masuda , Ichiro Takahara , Kenichi Kitano , Katsushi Miki , Takeshi Inohara , Takeyoshi Fukuda , Takayuki Aoki , Satoshi Kawanami
CPC classification number: B01J13/14 , C08F220/14 , C08F220/44 , C08F220/48 , C08F222/1006 , Y10T428/2984
Abstract: Heat-expandable microspheres include a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin, have a maximum expanding ratio not lower than 50 times, and are thermally expanded into hollow particulates having a repeated-compression durability not lower than 75 percent. The method of producing the heat-expandable microspheres includes the steps of dispersing an oily mixture containing a polymerizable component and the blowing agent in an aqueous dispersing medium containing a specific water-soluble compound and polymerizing the polymerizable component contained in the oily mixture.
Abstract translation: 热膨胀性微球包括热塑性树脂的壳和其中包含沸点不高于热塑性树脂的软化点的发泡剂，其最大膨胀比不低于50倍，并且被热膨胀成具有 重复压缩耐久性不低于75％。 制造热膨胀性微球的方法包括以下步骤：将含有可聚合组分和发泡剂的油性混合物分散在含有特定水溶性化合物的水性分散介质中，并使包含在油性混合物中的可聚合组分聚合。
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68.发明申请Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith 有权用于封装半导体器件的环氧树脂组合物和用其封装的半导体器件公开(公告)号：US20070179259A1
公开(公告)日：2007-08-02
申请号：US11699370
申请日：2007-01-30
Applicant: Shoichi Osada , Takayuki Aoki
Inventor： Shoichi Osada , Takayuki Aoki
IPC: C08L63/02
CPC classification number: C08G59/38 , C08G59/621 , C08L63/00 , H01L23/293 , H01L23/295 , H01L2924/0002 , H01L2924/00
Abstract: An epoxy resin composition comprising: (A) an epoxy resin having at least three epoxy groups per molecule and an epoxy equivalent of 170 or lower; (B) an epoxy resin having a phenolic nucleus and two epoxy groups in such an amount that a weight ratio of the epoxy resin (B) to the epoxy resin (A) ranges from 35/65 to 65/35; (C) a phenolic curing agent in such an amount that a molar ratio of phenolic hydroxyl groups to the whole epoxy groups in the composition ranges from 0.5 to 1.5; and (D) an inorganic filler in an amount of from 86 to 92 wt %, based on a total weight of the composition. The composition provides encapsulated semiconductor devices much less warped than those encapsulated with a conventional composition.
Abstract translation: 一种环氧树脂组合物，其包含：（A）每分子具有至少三个环氧基并且环氧当量为170或更低的环氧树脂; （B）环氧树脂（B）与环氧树脂（A）的重量比为35/65〜65/35的环氧树脂，其具有酚核和两个环氧基， （C）酚醛固化剂的用量使酚羟基与组合物中整个环氧基的摩尔比为0.5-1.5; 和（D）基于组合物总重量的86至92重量％的无机填料。 该组合物提供的封装半导体器件比用常规组合物封装的封装半导体器件弯曲得少得多。
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69.发明申请公开(公告)号：US20060216519A1
公开(公告)日：2006-09-28
申请号：US11386667
申请日：2006-03-23
Applicant: Yasuo Kimura , Eiichi Asano , Toshio Shiobara , Takayuki Aoki
Inventor： Yasuo Kimura , Eiichi Asano , Toshio Shiobara , Takayuki Aoki
CPC classification number: H01L23/293 , C08G59/245 , C08G59/3218 , C08G59/621 , C08L63/00 , H01L2924/0002 , Y10T428/31511 , C08L2666/16 , H01L2924/00
Abstract: An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
Abstract translation: 一种环氧树脂组合物，其包含（A）至少一种环氧树脂，其包含（a）在分子中具有至少一个取代或未取代的萘环并且具有175至210的环氧当量的含萘环的环氧树脂，（B） 在分子中具有至少一个取代或未取代的萘环的酚醛树脂和（C）无机填料，所述环氧树脂（a）中的取代或未取代的萘环的含量为45〜60重量％ 环氧树脂（A）的总量最适合于半导体封装，因为它具有良好的流动性，低的线性膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。
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70.发明授权公开(公告)号：US06630745B1
公开(公告)日：2003-10-07
申请号：US09558384
申请日：2000-04-26
Applicant: Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
Inventor： Shoichi Osada , Eiichi Asano , Shigeki Ino , Takayuki Aoki , Kazutoshi Tomiyoshi , Toshio Shiobara
IPC: H01L2329
CPC classification number: H01L23/293 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , Y10T428/31511 , C08L83/00 , H01L2924/00
Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
Abstract translation: 提供半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物，（Di）有机聚硅氧烷，（D-ii）有机聚硅氧烷固化产物或（ D-iii）通过环氧树脂或含烯基的环氧树脂与有机氢聚硅氧烷反应得到的嵌段共聚物和（E）无机填料。 尽管没有卤化环氧树脂和氧化锑，该组合物具有改进的成型性和耐焊料裂纹性，同时显示出高阻燃性。
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