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    INTERNAL COMPONENT ARRANGEMENT WITHIN A HOUSING
    62.
    发明申请
    INTERNAL COMPONENT ARRANGEMENT WITHIN A HOUSING 有权
    内部组件在房屋中的安排

    公开(公告)号：US20160044816A1

    公开(公告)日：2016-02-11

    申请号：US14456943

    申请日：2014-08-11

    Applicant: Apple Inc.

    Inventor： Daniel W. Jarvis ,  Benjamin J. Pope ,  Jason S. Sloey ,  Jonathan C. Denby ,  Ian A. Spraggs ,  Shayan Malek

    IPC: H05K7/02 ,  H01R43/20 ,  H05K7/06

    CPC classification number: H05K7/14 ,  H01H23/04 ,  H01H23/148 ,  H01R43/205 ,  H04M1/026 ,  H04M1/0274 ,  H04M1/0277 ,  H05K7/026 ,  H05K7/06

    Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.

    Abstract translation: 本申请涉及在便携式计算设备的壳体内固定和定位内部部件。 在一个实施例中，使用整流罩将多个板对板连接器保持在印刷电路板（PCB）上的通信槽内。 在另一个实施例中，使用许多插入模制的保持构件来防止在丢弃事件期间便携式计算设备的侧壁向外变形。 在另一个实施例中，使用具有直径相对的突起的C形垫圈来调节内部部件的对准。

    Capacitive Sensor Packaging
    63.
    发明申请
    Capacitive Sensor Packaging 有权
    电容传感器封装

    公开(公告)号：US20150242675A1

    公开(公告)日：2015-08-27

    申请号：US14709388

    申请日：2015-05-11

    Applicant: Apple Inc.

    Inventor： Benjamin J. Pope ,  Shawn Arnold ,  Barry J. Corlett ,  Terry L. Gilton ,  Syed Husaini ,  Steven Webster ,  Scott A. Myers ,  Matthew D. Hill ,  Benjamin B. Lyon

    IPC: G06K9/00 ,  G06F3/044

    CPC classification number: G06K9/00087 ,  G06F3/044 ,  G06K9/0002 ,  G06K9/0004 ,  G06K9/00053 ,  G06K9/00073

    Abstract: An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

    Abstract translation: 一种装置包括指纹传感器，其具有被配置为电容耦合到用户指纹的一组电容性元件。 指纹传感器可以设置在电子设备的控制按钮或显示元件下方，例如控制按钮和显示组件中的一个或多个。 响应元件响应于用户指纹的接近度，例如响应于控制按钮的运动的第一电路中的一个或两个，以及响应于指纹和显示元件的表面之间的耦合的第二电路。 指纹传感器比响应元件更靠近指纹。 控制按钮或显示组件可以包括各向异性介电材料，例如蓝宝石。

    Capacitive sensor packaging
    64.
    发明授权
    Capacitive sensor packaging 有权
    电容传感器封装

    公开(公告)号：US09030440B2

    公开(公告)日：2015-05-12

    申请号：US13842920

    申请日：2013-03-15

    Applicant: Apple Inc.

    Inventor： Benjamin J. Pope ,  Shawn Arnold ,  Barry J. Corlett ,  Terry L. Gilton ,  Syed Husaini ,  Steven Webster ,  Scott A. Myers ,  Matthew D. Hill ,  Benjamin B. Lyon

    IPC: G06F3/045 ,  G06K9/00 ,  G06F3/044

    CPC classification number: G06K9/00087 ,  G06F3/044 ,  G06K9/0002 ,  G06K9/0004 ,  G06K9/00053 ,  G06K9/00073

    Abstract: An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

    Abstract translation: 一种装置包括指纹传感器，其具有被配置为电容耦合到用户指纹的一组电容性元件。 指纹传感器可以设置在电子设备的控制按钮或显示元件下方，例如控制按钮和显示组件中的一个或多个。 响应元件响应于用户指纹的接近度，例如响应于控制按钮的运动的第一电路中的一个或两个，以及响应于指纹和显示元件的表面之间的耦合的第二电路。 指纹传感器比响应元件更靠近指纹。 控制按钮或显示组件可以包括各向异性介电材料，例如蓝宝石。

    Microphone proximity detection
    65.
    发明授权
    Microphone proximity detection 有权
    麦克风接近检测

    公开(公告)号：US08917577B2

    公开(公告)日：2014-12-23

    申请号：US13936599

    申请日：2013-07-08

    Applicant: Apple Inc.

    Inventor： Shaohai Chen ,  Richard Hung Minh Dinh ,  Jae Lee ,  Chad G. Seguin ,  Benjamin J. Pope

    IPC: H04M1/00 ,  H04W8/22 ,  H04M1/60 ,  G01S11/14 ,  H04M1/03

    CPC classification number: H04W8/22 ,  G01S11/14 ,  H04M1/03 ,  H04M1/6008 ,  H04M1/605 ,  H04M2250/22

    Abstract: A mobile communications device contains at least two microphones. One microphone is located away from the handset receiver and serves to pick up voice of a near end user of the device for transmission to the other party during a call. Another microphone is located near the handset receiver and serves to pick up acoustic output of the handset receiver (a far end signal). A signal processor measures the frequency response of the receiver. The signal processor performs spectral analysis of the receiver frequency response to determine whether or not the device is being held at the ear of the user. On that basis, the device automatically changes its operating mode, e.g., turns on or off a touch sensitive display screen during the call. Other embodiments are also described.

    Abstract translation: 移动通信设备包含至少两个麦克风。 一个麦克风位于远离手机接收器的位置，用于拾取设备的近端用户的语音，以便在通话过程中传送给对方。 另一个麦克风位于手机接收机附近，用于拾取手机接收机的声输出（远端信号）。 信号处理器测量接收机的频率响应。 信号处理器执行接收机频率响应的频谱分析，以确定设备是否被保持在用户的耳朵处。 在此基础上，设备自动改变其操作模式，例如，在通话期间打开或关闭触敏显示屏幕。 还描述了其它实施例。

    Liquid-Based Pressure Sensitive Adhesive for Grounding Applications
    66.
    发明申请
    Liquid-Based Pressure Sensitive Adhesive for Grounding Applications 有权
    液体压敏粘合剂用于接地应用

    公开(公告)号：US20140308465A1

    公开(公告)日：2014-10-16

    申请号：US13863264

    申请日：2013-04-15

    Applicant: APPLE INC.

    Inventor： James R. Krogdahl ,  Benjamin J. Pope ,  Dennis R. Pyper ,  Nicholas G.L. Merz ,  Scott A. Myers

    IPC: C09J7/02 ,  H05K3/38

    CPC classification number: H05K3/386 ,  C09J5/00 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/31 ,  H05K3/323 ,  H05K3/361 ,  Y10T156/10 ,  Y10T428/13 ,  Y10T428/31678

    Abstract: An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths.

    Abstract translation: 电子设备可以设置有诸如壳体结构，天线结构，印刷电路和与电气部件相关联的结构的电子设备结构。 结构可以使用粘合剂彼此附接。 将液体压敏粘合剂前体材料沉积在要结合的结构的一个或多个表面上。 可以施加光或热来固化液体粘合剂材料并形成压敏粘合剂层。 在固化期间，在粘合剂材料和结构之间形成化学键。 组装设备可以将结构压在一起以形成可以重新加工而不干扰粘合剂材料的化学结合部分的压敏粘合剂粘合。 压敏粘合剂可以包括用于形成导电路径的导电颗粒。

    SYSTEMS AND METHODS FOR EJECTING REMOVABLE MODULES FROM ELECTRONIC DEVICES
    67.
    发明申请
    SYSTEMS AND METHODS FOR EJECTING REMOVABLE MODULES FROM ELECTRONIC DEVICES 审中-公开
    从电子设备中取出可拆卸模块的系统和方法

    公开(公告)号：US20140307372A1

    公开(公告)日：2014-10-16

    申请号：US14317711

    申请日：2014-06-27

    Applicant: Apple Inc.

    Inventor： Ashutosh Y. Shukla ,  Benjamin J. Pope ,  Kenneth A. Jenks ,  Scott A. Myers

    IPC: H05K7/14 ,  F16H19/00 ,  H05K5/03

    CPC classification number: H05K7/1401 ,  F16H19/001 ,  G06F1/1658 ,  G06K13/0831 ,  H04B1/3816 ,  H05K5/0295 ,  H05K5/03 ,  H05K7/2039 ,  Y10T74/18992

    Abstract: An electronic device may be provided with an ejectable component assembly having a connector that can receive and retain a removable module within a housing of the electronic device. The ejectable component assembly may also be provided with an ejector mechanism for at least partially ejecting the removable module from the connector. The ejector mechanism may receive a user input force at an ejector user interface, translate that user input force into an ejection force, and apply that ejection force onto the removable module for ejecting the module. The ejector user interface may be provided at any suitable position of the housing that may not interfere with other functions of the device. The path along which the ejector mechanism translates the user input force into the ejection force between the ejector user interface and the removable module may be provided in any suitable way throughout the device.

    Abstract translation: 电子设备可以设置有具有可以在电子设备的壳体内容纳和保持可拆卸模块的连接器的可弹出部件组件。 可喷射部件组件还可以设置有用于从连接器至少部分地弹出可移除模块的喷射器机构。 喷射器机构可以在喷射器用户界面处接收用户输入力，将该用户输入力转换成弹出力，并且将该弹出力施加到可移除模块上用于弹出模块。 喷射器用户界面可以设置在壳体的任何合适的位置，其可以不干扰装置的其它功能。 喷射器机构将用户输入力平移到喷射器用户界面和可移除模块之间的弹出力的路径可以以整个装置中的任何合适的方式提供。

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