Coordinates input device
    62.
    发明申请
    Coordinates input device 失效
    协调输入设备

    公开(公告)号:US20050038944A1

    公开(公告)日:2005-02-17

    申请号:US10912063

    申请日:2004-08-06

    CPC分类号: G06F3/016

    摘要: A coordinates input device includes an operation unit that receives an operation input, a vibration generator that applies a vibration to the operation unit, and a vibration control unit that controls the vibration generator to apply the vibration to the operation unit when the operation input is received by the operation unit. The vibration generator includes a power feed unit provided to the operation unit, and a magnetic-field applying unit having sub-units. Each of the sub-units has first and second magnets spaced apart from each other with a given gap. The magnetic flux produced by the first and second magnets crosses a current flowing in the power feed unit.

    摘要翻译: 坐标输入装置包括:接收操作输入的操作单元,向操作单元施加振动的振动发生器;以及振动控制单元,其在接收到操作输入时控制振动发生器将振动施加到操作单元 由操作单位。 振动发生器包括提供给操作单元的供电单元和具有子单元的磁场施加单元。 每个子单元具有彼此间隔开的给定间隙的第一和第二磁体。 由第一和第二磁体产生的磁通量与在馈电单元中流动的电流交叉。

    Semiconductor apparatus and method for fabricating the same
    66.
    发明授权
    Semiconductor apparatus and method for fabricating the same 失效
    半导体装置及其制造方法

    公开(公告)号:US5986333A

    公开(公告)日:1999-11-16

    申请号:US916445

    申请日:1997-08-22

    申请人: Akio Nakamura

    发明人: Akio Nakamura

    IPC分类号: H01L23/50 H01L23/495

    摘要: A semiconductor apparatus includes a semiconductor chip and a die pad on which the semiconductor chip is mounted. The die pad is provided thereon with an opening. The semiconductor chip and the die pad may be shaped to be similar figures of rectangle, and the opening may include a plurality of first slits which are arranged around the corners of the die pad, respectively.

    摘要翻译: 半导体装置包括半导体芯片和其上安装有半导体芯片的管芯焊盘。 芯片垫在其上设置有开口。 半导体芯片和裸片焊盘可以被成形为类似的矩形图案,并且开口可以分别包括围绕芯片焊盘的角部布置的多个第一狭缝。

    Method for fabricating a gap type semiconductor substrate of red light
emitting devices
    67.
    发明授权
    Method for fabricating a gap type semiconductor substrate of red light emitting devices 失效
    用于制造红色发光器件的间隙型半导体衬底的方法

    公开(公告)号:US5851850A

    公开(公告)日:1998-12-22

    申请号:US516096

    申请日:1995-08-17

    IPC分类号: H01L33/00 H01L33/02 H01L21/00

    CPC分类号: H01L33/025 H01L33/0062

    摘要: A semiconductor substrate for GaP type light emitting devices which includes an n-type single crystal substrate, an n-type GaP layer, and a p-type GaP layer formed on the n-type GaP single crystal substrate. The carbon concentration in the n-type GaP single crystal substrate is more than 1.0.times.10.sup.16 atoms/cc but less than 1.0.times.10.sup.17 atoms/cc. The n-type GaP single crystal substrate is obtained from an n-type GaP single crystal grown by the Liquid Encapsulation Czochralski method wherein B.sub.2 O.sub.3 containing water corresponding to 200 ppm or more is used as an encapsulation liquid.

    摘要翻译: 一种用于GaP型发光器件的半导体衬底,其包括在n型GaP单晶衬底上形成的n型单晶衬底,n型GaP层和p型GaP层。 n型GaP单晶衬底中的碳浓度大于1.0×1016原子/ cc但小于1.0×10 17原子/ cc。 n型GaP单晶基板是通过使用液态封装法,其使用含有对应于200ppm以上的水的B 2 O 3作为封装液体的液体封装法,由n型GaP单晶获得。

    GaP light emitting substrate and a method of manufacturing it
    68.
    发明授权
    GaP light emitting substrate and a method of manufacturing it 失效
    GaP发光基板及其制造方法

    公开(公告)号:US5643827A

    公开(公告)日:1997-07-01

    申请号:US358977

    申请日:1994-12-19

    摘要: A GaP light emitting element substrate comprising an n-type GaP layer, a nitrogen-doped n-type GaP layer and a p-type GaP layer layered one after another on a multi-layer GaP substrate built by forming an n-type GaP buffer layer(s) on an n-type GaP single crystal substrate, wherein the sulfur (S) concentration in said n-type GaP buffer layer is made to be 5.times.10.sup.16 [atoms/cc] or less. The method of manufacturing it is as follows: an n-type GaP buffer layer(s) is formed on an n-type GaP single crystal substrate to prepare a multi-layer GaP substrate, then an n-type GaP layer, a nitrogen doped n-type GaP layer and a p-type GaP layer are layered on said multi-layer GaP substrate by means of the melt-back method to obtain a GaP light emitting element substrate, wherein the sulfur (S) concentration in said n-type GaP buffer layer is made to be 5.times.10.sup.16 [atoms/cc] or less when the multi-layer GaP substrate is prepared.

    摘要翻译: 一种GaP发光元件基板,其包括在通过形成n型GaP缓冲器构成的多层GaP基板上依次层叠的n型GaP层,氮掺杂n型GaP层和p型GaP层 其中n型GaP缓冲层中的硫(S)浓度为5×10 16 [原子/ cc]以下。 其制造方法如下:在n型GaP单晶衬底上形成n型GaP缓冲层,以制备多层GaP衬底,然后将n型GaP层,氮掺杂 n型GaP层和p型GaP层通过熔融回归法层叠在所述多层GaP衬底上,以获得GaP发光元件衬底,其中所述n型GaP层中的硫(S)浓度 当制备多层GaP衬底时,GaP缓冲层为5×10 16 [原子/ cc]以下。

    Electric cigar lighter having a thermal safety fuse
    70.
    发明授权
    Electric cigar lighter having a thermal safety fuse 失效
    具有安全保险丝的电子烟灯

    公开(公告)号:US5173593A

    公开(公告)日:1992-12-22

    申请号:US627004

    申请日:1990-12-13

    IPC分类号: B60N3/14 F23Q7/00 H01H37/76

    CPC分类号: B60N3/14 F23Q7/00

    摘要: A car-borne electric cigar lighter includes a receptacle having a spring contact for receiving the heater element of the lighter for energization. A pair of spaced electrially conductive connecting plates form part of the electrical circuit to the spring contact. A circuit breakable electrically conductive spacer including a heat resistant, form-retaining resilient plate of an electrically insulating rubber, e.g., silicone rubber, penetrated between opposite surfaces with a thermally fusible, electrically conductive portion made from a low melting point metal, e.g., tin foils, to be in contact with the two connecting plates on both sides of the spacer forms an electrical connection between the plates through the tin foils. In case of overheating, the tin foils are melted down to open the electric circuit to the spring contact without losing the mechanical integrity of the spacer to serve as an insulator between the connecting plates.

    摘要翻译: 汽车电动雪茄打火机包括具有弹簧触点的插座,用于接收用于通电的打火机的加热器元件。 一对间隔的导电连接板形成到弹簧触点的电路的一部分。 一种电路易损的导电间隔物,其包括电绝缘橡胶(例如硅橡胶)的耐热形成保持弹性板,该弹性板穿透在相对表面之间,并具有由低熔点金属制成的热熔性导电部分,例如锡 与间隔两侧的两个连接板接触的箔片通过锡箔形成板之间的电连接。 在过热的情况下,锡箔被熔化以将弹簧接触的电路打开,而不会损失间隔件的机械完整性,以用作连接板之间的绝缘体。