摘要:
A high-frequency relay comprises a body containing a contact unit having at least one contact terminal protruding from a bottom surface of the body, contact states switched according to energization of a coil and a base covering at least a bottom surface of the body. The contact unit is connected with at least one contact terminal. The base has a grounding function and includes a conductive layer.
摘要:
A coordinates input device includes an operation unit that receives an operation input, a vibration generator that applies a vibration to the operation unit, and a vibration control unit that controls the vibration generator to apply the vibration to the operation unit when the operation input is received by the operation unit. The vibration generator includes a power feed unit provided to the operation unit, and a magnetic-field applying unit having sub-units. Each of the sub-units has first and second magnets spaced apart from each other with a given gap. The magnetic flux produced by the first and second magnets crosses a current flowing in the power feed unit.
摘要:
A cross substrate and a method of mounting a semiconductor element are provided in which semiconductor elements can be mounted at a high density. Element side electrodes of a circuit forming surface of a semiconductor element and conductive filaments of a cross substrate are connected in a one-to-one correspondence by solder bumps. Thereafter, sealing is carried out by using a molten epoxy-based resin. In this way, a circuit forming surface side of the semiconductor element is sealed with sealing resin of the cross substrate, with the element side electrodes of the mounted semiconductor element electrically connected to conductive filaments which are wires of a cross substrate.
摘要:
The sealing resin of a semiconductor device is prevented from being peeled off from the substrate of the semiconductor device. A semiconductor device according to the present invention has a semiconductor substrate containing a central portion having a first thickness and a peripheral portion having a second thickness that is smaller than the first thickness, an electrode pad formed on the semiconductor substrate, a sealing resin for sealing the semiconductor substrate, a protruded electrode formed on the sealing resin, and a wire which electrically connects the electrode pad to the protruded electrode.
摘要:
A semiconductor device having electrodes formed along a peripheral part thereof in a staggered arrangement of lines including inside-line electrodes, central-line electrodes and outside-line electrodes. The inside-line electrodes are hexagonal shaped with hypotenuses on the central-line electrodes sides thereof. The central-line electrodes are hexagonal shaped with hypotenuses on the inside-line electrode sides thereof. The maximum width of the outside-line electrode wires immediately between the hypotenuses of adjacent inside-line and central-line electrodes depends on the distance between the centers of the inside-line and central-line electrodes, the minimum lengths of the inside-line and central-line electrodes and the electrode protective film, and the minimum length of the corresponding wire. The position and form of the central line electrodes are thus determinable based on the given relationship and the necessary value of current.
摘要:
A semiconductor apparatus includes a semiconductor chip and a die pad on which the semiconductor chip is mounted. The die pad is provided thereon with an opening. The semiconductor chip and the die pad may be shaped to be similar figures of rectangle, and the opening may include a plurality of first slits which are arranged around the corners of the die pad, respectively.
摘要:
A semiconductor substrate for GaP type light emitting devices which includes an n-type single crystal substrate, an n-type GaP layer, and a p-type GaP layer formed on the n-type GaP single crystal substrate. The carbon concentration in the n-type GaP single crystal substrate is more than 1.0.times.10.sup.16 atoms/cc but less than 1.0.times.10.sup.17 atoms/cc. The n-type GaP single crystal substrate is obtained from an n-type GaP single crystal grown by the Liquid Encapsulation Czochralski method wherein B.sub.2 O.sub.3 containing water corresponding to 200 ppm or more is used as an encapsulation liquid.
摘要翻译:一种用于GaP型发光器件的半导体衬底,其包括在n型GaP单晶衬底上形成的n型单晶衬底,n型GaP层和p型GaP层。 n型GaP单晶衬底中的碳浓度大于1.0×1016原子/ cc但小于1.0×10 17原子/ cc。 n型GaP单晶基板是通过使用液态封装法,其使用含有对应于200ppm以上的水的B 2 O 3作为封装液体的液体封装法,由n型GaP单晶获得。
摘要:
A GaP light emitting element substrate comprising an n-type GaP layer, a nitrogen-doped n-type GaP layer and a p-type GaP layer layered one after another on a multi-layer GaP substrate built by forming an n-type GaP buffer layer(s) on an n-type GaP single crystal substrate, wherein the sulfur (S) concentration in said n-type GaP buffer layer is made to be 5.times.10.sup.16 [atoms/cc] or less. The method of manufacturing it is as follows: an n-type GaP buffer layer(s) is formed on an n-type GaP single crystal substrate to prepare a multi-layer GaP substrate, then an n-type GaP layer, a nitrogen doped n-type GaP layer and a p-type GaP layer are layered on said multi-layer GaP substrate by means of the melt-back method to obtain a GaP light emitting element substrate, wherein the sulfur (S) concentration in said n-type GaP buffer layer is made to be 5.times.10.sup.16 [atoms/cc] or less when the multi-layer GaP substrate is prepared.
摘要:
A gas purge unit for a portable closed container is defined by a purge box including an opening, and a container stand around the opening on which a closed container is set; a gas supplying inlet coupled to a gas supplying source, and a gas discharging outlet; and a lifting mechanism for closing the opening from inside of the purge box and controlling the locking and unlocking operations of a locking mechanism provided in the lid of the container.
摘要:
A car-borne electric cigar lighter includes a receptacle having a spring contact for receiving the heater element of the lighter for energization. A pair of spaced electrially conductive connecting plates form part of the electrical circuit to the spring contact. A circuit breakable electrically conductive spacer including a heat resistant, form-retaining resilient plate of an electrically insulating rubber, e.g., silicone rubber, penetrated between opposite surfaces with a thermally fusible, electrically conductive portion made from a low melting point metal, e.g., tin foils, to be in contact with the two connecting plates on both sides of the spacer forms an electrical connection between the plates through the tin foils. In case of overheating, the tin foils are melted down to open the electric circuit to the spring contact without losing the mechanical integrity of the spacer to serve as an insulator between the connecting plates.