公开(公告)号：US5068381A

公开(公告)日：1991-11-26

申请号：US667266

申请日：1991-03-11

申请人： Yoshihiko Ito ,  Masahiro Murakami

发明人： Yoshihiko Ito ,  Masahiro Murakami

IPC分类号： C08G77/60 ,  C07F7/08 ,  C08G77/48

CPC分类号： C07F7/0809 ,  C07F7/0801

摘要： A process for preparing a poly(silvinylene) represented by the following general formula [III]: ##STR1## characterized in that (A) a polysilane represented by the following general formula [I]: ##STR2## and (B) an acetylene represented by the following general formula [II]:R.sup.5 --C.ident.C--R.sup.6 tm [II]are reacted in the presence of a catalyst comprising an isocyanide compound and a palladium compound. This poly(silvinylene) is useful as a photosensitive material and a crosslinking agent. This poly(silvinylene) is obtained generally in high yield irrespective of the type of the substituent possessed by the silane that is a raw material.

摘要翻译： 制备由以下通式[III]表示的聚（硅亚乙烯基）的方法：其中（A）由以下通式[I]表示的聚硅烷：其中， （B）由以下通式[II]表示的乙炔：R5-C = C-R6tm [II]在含有异氰化物化合物和钯化合物的催化剂存在下反应。 该聚（硅亚乙烯基）可用作感光材料和交联剂。 通常以高产率获得该聚（硅亚乙烯基），而不管作为原料的硅烷具有的取代基的类型如何。

公开(公告)号：US4351947A

公开(公告)日：1982-09-28

申请号：US236542

申请日：1981-02-20

申请人： Chisei Shibuya ,  Masahiro Murakami ,  Masateru Kobayashi ,  Takanori Sone

发明人： Chisei Shibuya ,  Masahiro Murakami ,  Masateru Kobayashi ,  Takanori Sone

IPC分类号： C07D257/04 ,  C07D501/36

CPC分类号： C07D257/04

摘要： This invention relates to a tetrazole-5-thiol ester having D-configuration of the formula, ##STR1## a process for the preparation of the thiol ester and a process for the preparation of cefamandole using the thiol ester.

摘要翻译： 本发明涉及具有下式的D构型的四唑-5-硫醇酯：制备硫羟酸酯的方法和使用硫羟酸酯制备头孢丹多的方法。

公开(公告)号：US4347421A

公开(公告)日：1982-08-31

申请号：US233576

申请日：1981-02-11

申请人： Mutsuo Mukuda ,  Masahiro Murakami ,  Kazuo Aotsuka

发明人： Mutsuo Mukuda ,  Masahiro Murakami ,  Kazuo Aotsuka

IPC分类号： B23K9/028 ,  B23K37/02 ,  B23K9/225

CPC分类号： B23K37/0276 ,  B23K9/0286

摘要： Herein disclosed is an automatic welding apparatus which comprises an arcuate frame including a welding unit and a pair of wire feeders, and an arcuate frame including a running truck and a pair of clamping mechanisms for fastening the outer circumference of a pipe to be welded. The aforementioned two arcuate frames are detachably connected at two positions thereby to form a ring shape. Thus, the pipe is automatically welded while the truck is being made to run in the circumferential direction. The running truck of the welding apparatus thus constructed carries both a mechanism for effecting close contact with the outer circumference of the pipe and a shock absorbing mechanism so that the distance between the leading end of a welding torch and the outer circumference of the pipe may be constant at all times.

摘要翻译： 这里公开了一种自动焊接装置，其包括：包括焊接单元和​​一对送丝器的弓形框架，以及包括行进车辆的弓形框架和用于紧固待焊接管的外周的一对夹紧机构。 上述两个弓形框架可拆卸地连接在两个位置，从而形成环形。 因此，在卡车在圆周方向上行进时，管道被自动焊接。 这样构成的焊接装置的行驶车辆具有与管子的外周紧密接触的机构和减震机构，使得焊炬的前端和管的外周之间的距离可以是 始终不变。

公开(公告)号：US4181424A

公开(公告)日：1980-01-01

申请号：US915303

申请日：1978-06-12

申请人： Tetuya Okada ,  Tadashi Umeda ,  Masahiro Murakami ,  Tatsuo Aizawa

发明人： Tetuya Okada ,  Tadashi Umeda ,  Masahiro Murakami ,  Tatsuo Aizawa

IPC分类号： G03B27/50 ,  B65H3/06 ,  G03G15/00 ,  G03G15/04 ,  G03G15/043 ,  G03G15/28 ,  G03G21/00

CPC分类号： G03G15/28 ,  B65H3/0669

摘要： A method of and apparatus for synchronously transferring an original and a sheet of copying paper for electrostatic photoduplication. A paper feeding device feeds the sheets of copying paper one at a time until the front edge reaches a predetermined position at a front edge stop. The sheet of copying paper is held at the predetermined position on standby for a period of time, and then a paper transfer device transfers it to move the front edge to an exposure point. At the same time an original placed on a mount is moved from a stopping point in the cycle of movement of the mount to a position in which the leading edge of the original is at an irradiation point optically aligned with the exposure point. The period of time during which the copying paper is fed from the supply, held in the predetermined position, and then moved to the exposure position is equal to the time for moving the mount for the original from a predetermined point along the path of movement of the mount to the irradiation point. Thereafter, the original is moved past the irradiation point synchronously with transfer of the copying paper past the exposure point at a predetermined rate for exposing the copying paper to the image from the original.

摘要翻译： 一种用于同步传送用于静电复印的原稿和一张复印纸的方法和装置。 送纸装置一次一张地输送复印纸，直到前边缘到达前边缘止挡处的预定位置。 复印纸被保持在预定位置待机一段时间，然后纸张传送装置传送它以将前边缘移动到曝光点。 同时，将安装在底座上的原稿从安装件的运动循环中的停止点移动到原稿的前缘处于与曝光点光学对准的照射点的位置。 从供给部保持在预定位置然后移动到曝光位置的复印纸的时间段等于从原稿的安装位置沿着沿着移动路径的预定点移动的时间 安装到照射点。 此后，原稿经过曝光点以预定的速度传送到复印纸，同时被移动通过照射点，从而将复印纸从原稿曝光。

公开(公告)号：US09076892B2

公开(公告)日：2015-07-07

申请号：US13470029

申请日：2012-05-11

申请人： Takae Sakai ,  Masahiro Murakami ,  Masahiko Kushino ,  Yoshihisa Amano ,  Shinichi Tokuno

发明人： Takae Sakai ,  Masahiro Murakami ,  Masahiko Kushino ,  Yoshihisa Amano ,  Shinichi Tokuno

IPC分类号： H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L25/065

CPC分类号： H01L23/60 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01065 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.

摘要翻译： 为了牢固地研磨外部屏蔽并降低施加在切割刀片和外部屏蔽上的负担，制造半导体模块的方法包括形成从密封树脂层3的顶表面延伸的孔30的孔形成步骤 设置在集合基板100上的接地布线111（112），成膜步骤，形成由导电材料制成的导电膜，以至少覆盖密封树脂层3的顶面，内部 孔20的表面和接地布线111（112），以及分离步骤，分离各个模块部分所包括的多个单独的模块部分。

公开(公告)号：US08846180B2

公开(公告)日：2014-09-30

申请号：US13128091

申请日：2009-11-06

申请人： Hideaki Nitta ,  Junichi Shibata ,  Atsushi Sasaki ,  Masahiro Murakami

发明人： Hideaki Nitta ,  Junichi Shibata ,  Atsushi Sasaki ,  Masahiro Murakami

IPC分类号： B32B3/00 ,  B29C47/88 ,  G02B5/30 ,  B29C55/06 ,  B29K69/00

CPC分类号： G02B5/3083 ,  B29C47/0021 ,  B29C47/8845 ,  B29C47/887 ,  B29C55/06 ,  B29K2069/00 ,  B29K2995/0032 ,  Y10T428/24479

摘要： A retardation film which has few foreign matter defects and small retardation nonuniformity and meets the required quality of a retardation film is provided with high productivity at a low cost by melt extruding a polycarbonate.The retardation film obtained by stretching and orienting a melt extruded film of a polycarbonate is characterized in that: (1) the polycarbonate constituting the film has a viscosity average molecular weight of 1.3×104 to 1.8×104; (2) the retardation R(589) within the plane of the film measured at a wavelength of 589 nm is 50 to 800 nm; (3) the retardation R(589) nonuniformity within the plane of the film is ±5 nm; (4) the average thickness of the film is 10 to 150 μm; and (5) the number of film defects as large as 100 μm or more is 2 or less/m2.

摘要翻译： 通过熔融挤出聚碳酸酯，以低成本提供少量异物缺陷和小的延迟不均匀性并且满足延迟膜的所需质量的延迟膜。 通过拉伸和取向聚碳酸酯的熔融挤出膜获得的延迟膜的特征在于：（1）构成膜的聚碳酸酯的粘均分子量为1.3×10 4〜1.8×10 4; （2）在波长589nm处测量的膜的平面内的延迟R（589）为50〜800nm; （3）薄膜平面内的延迟R（589）不均匀度为±5nm; （4）膜的平均厚度为10〜150μm; （5）大于100μm以上的膜缺陷的数量为2个以下/ m 2。

公开(公告)号：US08179678B2

公开(公告)日：2012-05-15

申请号：US12753436

申请日：2010-04-02

申请人： Mitsuyoshi Yamashita ,  Yoshihisa Amano ,  Akiteru Deguchi ,  Masahiko Kushino ,  Masahiro Murakami

发明人： Mitsuyoshi Yamashita ,  Yoshihisa Amano ,  Akiteru Deguchi ,  Masahiko Kushino ,  Masahiro Murakami

IPC分类号： H05K7/20

CPC分类号： H05K1/0243 ,  H01L23/552 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2224/0401

摘要： Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.

摘要翻译： 提供一种电子部件模块，其具有高可靠性并且能够抑制安装机器的操作性能的降低。 电子部件模块包括安装在模块基板的上表面上的多个电子部件，覆盖电子部件的平面顶板和用于保持顶板的顶板保持部件。 多个电子部件包括石英谐振器和具有比石英谐振器的高度小的RF-IC，并且被布置在模块基板的顶表面上以与石英谐振器并排。 此外，顶板固定在石英谐振器上，用于保持顶板的顶板保持构件设置在RF-IC和顶板之间。

公开(公告)号：US20120105113A1

公开(公告)日：2012-05-03

申请号：US13267184

申请日：2011-10-06

申请人： Takashi Maeno ,  Masahiro Murakami

发明人： Takashi Maeno ,  Masahiro Murakami

IPC分类号： H03L7/00

CPC分类号： G06F13/4217

摘要： A circuit that transfers data between a first clock domain using a first clock and a second clock domain using a second clock synchronized with the first clock. The circuit comprises a data holding circuit operating at the first clock, an enable signal generation circuit connected to the data holding circuit. Preferably, the data transfer circuit includes an edge signal generation circuit connected to the data holding circuit, the edge signal generation circuit generating an edge signal allowing the data holding circuit to receive and send the data when edges of the first clock and the second clock align, and applying the edge signal to the data holding circuit.

摘要翻译： 使用与第一时钟同步的第二时钟，使用第一时钟和第二时钟域在第一时钟域之间传送数据的电路。 电路包括在第一时钟工作的数据保持电路，连接到数据保持电路的使能信号发生电路。 优选地，数据传送电路包括连接到数据保持电路的边沿信号产生电路，边沿信号产生电路产生边沿信号，允许数据保持电路在第一时钟和第二时钟的边缘对准时接收和发送数据 ，并将边沿信号应用于数据保持电路。

公开(公告)号：US08139966B2

公开(公告)日：2012-03-20

申请号：US11902690

申请日：2007-09-25

申请人： Masahiro Murakami

发明人： Masahiro Murakami

IPC分类号： G03G15/00

CPC分类号： G03G15/553 ,  G03G15/0194 ,  G03G15/5058 ,  G03G15/556 ,  G03G2215/00059 ,  G03G2215/0132 ,  G03G2215/0164

摘要： An image forming system includes an image forming unit, a measurement unit, a correction unit, and an inhibition unit. The image forming unit forms an image. The measurement unit measures densities of a plurality of density patches formed by the image forming unit. The correction unit performs a density correction for the image forming unit based on the densities of the plurality of density patches measured by the measurement unit. The inhibition unit determines whether or not the densities of the plurality of the density patches are normal based on at least one of the densities of the plurality of density patches, and, if the densities are determined not to be normal, inhibits the correction unit from performing a density correction based on the densities of the plurality of density patches determined to be not normal.

摘要翻译： 图像形成系统包括图像形成单元，测量单元，校正单元和禁止单元。 图像形成单元形成图像。 测量单元测量由图像形成单元形成的多个密度斑块的密度。 校正单元基于由测量单元测量的多个密度斑块的密度，对图像形成单元执行浓度校正。 抑制单元基于多个密度斑块的密度中的至少一个来确定多个密度斑块的密度是否正常，并且如果确定密度不正常，则禁止校正单元 基于确定为不正常的多个密度片的密度进行密度校正。

公开(公告)号：US20110046372A1

公开(公告)日：2011-02-24

申请号：US12734961

申请日：2008-12-04

申请人： Masahiro Murakami ,  Naoki Ishida ,  Mizuna Narumi ,  Yoichi Arimoto ,  Munehiro Hasegawa ,  Tomoya Arai ,  Tsuyoshi Goya

发明人： Masahiro Murakami ,  Naoki Ishida ,  Mizuna Narumi ,  Yoichi Arimoto ,  Munehiro Hasegawa ,  Tomoya Arai ,  Tsuyoshi Goya

IPC分类号： C07F5/02

CPC分类号： H01L51/008 ,  C07F5/02 ,  C07F5/027 ,  C09K11/06 ,  C09K2211/1014 ,  C09K2211/1022 ,  C09K2211/1029 ,  C09K2211/1092 ,  H01L51/5012 ,  H01L51/5048 ,  H01L51/5092 ,  H05B33/14

摘要： The present invention provides novel boron compounds which are useful, depending on their characteristics, as light-emitting materials, electron-transport materials, electron-injection materials, hole-blocking materials, or organic semiconductor materials, and which have new molecular structures quite different from those of the heretofore known boron compounds; their production processes; and functional electronic devices using the same. The novel boron compounds are, for example, those of the following formula (1): These boron compounds can be produced by, for example, reacting boron compounds of the following formula (4): with compounds of the following formula (5): in the presence of a catalyst containing at least one metal element selected from the group consisting of palladium, platinum, and nickel. These boron compounds are used for the functional electronic devices.

摘要翻译： 本发明提供新颖的硼化合物，它们根据其特性可用作发光材料，电子传输材料，电子注入材料，空穴阻挡材料或有机半导体材料，并且具有非常不同的新分子结构 从迄今已知的硼化合物的那些; 他们的生产工艺; 和使用其的功能电子设备。 新的硼化合物是例如下式（1）的那些：这些硼化合物可以通过例如使下式（4）的硼化合物与下式（5）的化合物反应来制备： 在含有选自钯，铂和镍的至少一种金属元素的催化剂存在下进行。 这些硼化合物用于功能电子器件。