公开(公告)号：US20090085202A1

公开(公告)日：2009-04-02

申请号：US11862609

申请日：2007-09-27

申请人： Bing Dang ,  Mario J. Interrante ,  John Ulrich Knickerbocker ,  Edmund Juris Sprogis ,  Son K. Tran

发明人： Bing Dang ,  Mario J. Interrante ,  John Ulrich Knickerbocker ,  Edmund Juris Sprogis ,  Son K. Tran

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L21/4853 ,  H01L21/6835 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2203/016 ,  H01L2924/00

摘要： Methods of assembling an integrated circuit are provided. An interposer supported by an integrated handler is solder bumped onto one or more bond pads on a substrate. The integrated handler is removed from the interposer. A side of the interposer opposite that of the substrate is solder bumped to one or more bond pads on a chip.

摘要翻译： 提供组装集成电路的方法。 由集成处理器支持的插入器焊接在衬底上的一个或多个接合焊盘上。 集成处理程序从插入器中删除。 插入器的与衬底相反的一侧是焊接到芯片上的一个或多个接合焊盘。

公开(公告)号：US20080182362A1

公开(公告)日：2008-07-31

申请号：US11872331

申请日：2007-10-15

申请人： Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Raymond R. Horton ,  John Ulrich Knickerbocker ,  Cornelia K. Tsang ,  Steven Lorenz Wright

发明人： Paul Stephen Andry ,  Leena Paivikki Buchwalter ,  Raymond R. Horton ,  John Ulrich Knickerbocker ,  Cornelia K. Tsang ,  Steven Lorenz Wright

IPC分类号： H01L21/00

CPC分类号： H01L24/81 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/20109 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide opening, the guide opening extending from a top surface of the placement guide to a bottom surface of the placement guide; aligning the placement guide to an integrated circuit chip position on the module substrate; fixing the placement guide to the module substrate; placing an integrated circuit chip in the guide opening, sidewalls of the placement guide opening constraining electrically conductive bonding structures on bottom surface of the integrated circuit chip to self-align to an electrically conductive module substrate contact pad on the top surface of the module substrate in the integrated circuit chip position; and bonding the bonding structures to the module substrate contact pads, the bonding structures and the module substrate contact pads in direct physical and electrical contact after the bonding.

摘要翻译： 一种电子潜水及其制造方法。 所述方法包括将放置引导件放置在模块基板的顶表面上，所述放置引导件具有引导开口，所述引导开口从所述放置引导件的顶表面延伸到所述放置引导件的底表面; 将所述放置引导件对准所述模块基板上的集成电路芯片位置; 将所述放置引导件固定到所述模块基板; 将集成电路芯片放置在引导开口中，放置引导开口的侧壁约束集成电路芯片的底表面上的导电接合结构，以与模块基板的顶表面上的导电模块衬底接触焊盘自对准 集成电路芯片位置; 以及在接合之后将结合结构粘合到模块衬底接触焊盘，接合结构和模块衬底接触焊盘，直接物理和电接触。

公开(公告)号：US20080029886A1

公开(公告)日：2008-02-07

申请号：US11498689

申请日：2006-08-03

申请人： John Michael Cotte ,  Brian Paul Gaucher ,  Janusz Grzyb ,  Nils Deneke Hoivik ,  Christopher Vincent Jahnes ,  John Ulrich Knickerbocker ,  Duixian Liu ,  John Harold Magerlein ,  Chirag Suryakant Patel ,  Ullrich R. Pfeiffer ,  Cornelia Kang-I Tsang

发明人： John Michael Cotte ,  Brian Paul Gaucher ,  Janusz Grzyb ,  Nils Deneke Hoivik ,  Christopher Vincent Jahnes ,  John Ulrich Knickerbocker ,  Duixian Liu ,  John Harold Magerlein ,  Chirag Suryakant Patel ,  Ullrich R. Pfeiffer ,  Cornelia Kang-I Tsang

IPC分类号： H01L23/34

CPC分类号： H01L25/165 ,  H01L23/66 ,  H01L24/24 ,  H01L24/82 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01L2924/00 ,  H01L2224/0401

摘要： An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.

摘要翻译： 描述了一种装置，其具有用于天线结构的一部分的空腔的插入件，具有导体穿过通孔，顶部Si部分具有互连布线并具有用于在其上电气安装集成电路芯片的焊盘，其中顶部Si部分与 内插器电气和机械。 插入器和顶部Si部分可以被缩放以提供功能单元的阵列。 本发明克服了将高效天线与Si封装中的集成电路芯片组合在一起的信号频率为1至100GHz的问题，以及屏蔽靠近天线的组件的问题，并减少了由于TCE失配引起的应变。