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公开(公告)号：US06266873B1
公开(公告)日：2001-07-31
申请号：US09367514
申请日：1999-11-18
申请人： Naoyuki Kitamura , Osamu Okuda , Akira Kabeshita , Takeshi Takeda
发明人： Naoyuki Kitamura , Osamu Okuda , Akira Kabeshita , Takeshi Takeda
IPC分类号： H05K330
CPC分类号： H05K13/0452 , H05K13/0409 , H05K13/041 , H05K13/0413 , H05K13/085 , Y10S29/044 , Y10T29/4913 , Y10T29/49139 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： Method and apparatus for mounting electronic components in which components are efficiently fed and transferred for enhancing productivity is provided. Tray draw-out device (6) is disposed at a component feeding unit (4) for pulling out a tray (3) accommodating electronic components (2) from the component feeding unit (4) to a given pick-up position, where the electronic components (2) are transferred by the transfer mechanism (11) on to a temporary holder (8) disposed on a draw-out arm (7) of the tray draw-out device (6). Mounting head (5) has a plurality of mounting nozzles (5a), with which the mounting head (5) picks up several electronic components (2) aligned on the temporary holder (8) at a time and mount them on to a circuit board (1) which has been loaded and located at a prescribed position.
摘要翻译： 提供了用于安装电子部件的方法和装置，其中部件被有效地进给和传送以提高生产率。 托盘拉出装置（6）设置在用于将容纳电子部件（2）的托盘（3）从部件供给单元（4）拉出到给定的拾取位置的部件供给单元（4）处，其中 电子部件（2）通过传送机构（11）传送到设置在托盘拉出装置（6）的拉出臂（7）上的临时保持器（8）。 安装头（5）具有多个安装喷嘴（5a），安装头（5）通过该安装喷嘴（5）一次拾取与临时保持器（8）对准的几个电子部件（2），并将其安装到电路板 （1）已被装载并位于规定位置。
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公开(公告)号：US5667129A
公开(公告)日：1997-09-16
申请号：US432579
申请日：1995-05-01
CPC分类号： H05K13/0413 , H05K13/046 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204
摘要： An IC component mounting method includes sucking each of different types of IC components at a supply position to which the IC component having an electrode-provided face thereof to be bonded to a circuit board, recognizing an image of the IC component to detect a sucking position at which a sucking nozzle does not interfere with an electrode of the IC component, detecting a height of the sucking position, positioning the sucking nozzle at the sucking position while the position of the sucking nozzle in a vertical direction is controlled, sucking the IC component by a mounting head, recognizing a position of the IC component sucked by the mounting head, and recognizing a reference position of the circuit board or an IC component-mounting position thereof, and positioning the IC component at the IC component-mounting position of the circuit board and then mounting the IC component on the circuit board.
摘要翻译： 一种IC部件安装方法，其特征在于，将具有电极配置面的IC部件的电源位置与不同类型的IC部件吸附在电路基板上，识别IC部件的图像以检测吸引位置 吸入喷嘴不与IC部件的电极干涉，检测吸引位置的高度，并且在吸嘴的位置在垂直方向上被控制的同时将吸嘴定位在吸引位置，吸引IC部件 通过安装头识别由安装头吸入的IC部件的位置，并且识别电路板的基准位置或其IC部件安装位置，并将IC部件定位在IC部件安装位置 电路板，然后将IC组件安装在电路板上。
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公开(公告)号：US4972798A
公开(公告)日：1990-11-27
申请号：US327990
申请日：1989-03-23
申请人： Tateo Ando , Akira Kabeshita
发明人： Tateo Ando , Akira Kabeshita
CPC分类号： H05K3/1241 , B41J2/01 , B44D3/22 , H05K2203/0126
摘要： A first distance measurement device for measuring a height of the surface of a substrate with respect to a reference plane of a drawing machine which drawing a pattern on the substrate by issuing paste-like material from a nozzle is mounted on a revolution member rotating about the nozzle, and the first distance measurement device is always positioned in the moving direction of the nozzle and measures a height of the surface of the substrate at a slightly preceding position from the nozzle, on the other band a second distance measurement device substantially measures a height of the nozzle from the reference plane, thus, a position of the nozzle is controlled on the basis of both the measured result, and an interval between the nozzle and the surface of the substrate is kept within a predetermined value.
摘要翻译： 第一距离测量装置，其用于测量基板相对于从喷嘴发出糊状材料而在基板上绘制图案的基准面的高度，该旋转构件安装在围绕 喷嘴，并且第一距离测量装置总是位于喷嘴的移动方向上，并且在距喷嘴略微在前的位置处测量基板的表面的高度，在另一条带上，第二距离测量装置基本上测量高度 因此，基于测量结果控制喷嘴的位置，并且将喷嘴和基板的表面之间的间隔保持在预定值内。
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公开(公告)号：US4829665A
公开(公告)日：1989-05-16
申请号：US127030
申请日：1987-11-30
申请人： Akira Kabeshita , Tokuhito Hamane , Souhei Tanaka
发明人： Akira Kabeshita , Tokuhito Hamane , Souhei Tanaka
CPC分类号： H05K13/0413 , H05K13/003 , Y10T29/49144 , Y10T29/53178 , Y10T29/53261
摘要： In mounting electronic components (1) from an electronic components pack (5) to a substrate (10), the substrate (10) is put on a table movable horizontally in X-Y directions, and the electronic components (1) are held in through holding holes (3) in a holding plate (2). A selected one of the electronic components (1) is positioned just above a mounting position on the substrate (10) and a pushing pin (23 or 24 or 26) is positioned just above that electronic component (1). Then, the pushing pin (23 or 24 or 26) lowers and pushes the selected electronic component (1) down out of its holding hole (3) to mount it directly onto the substrate (10).
摘要翻译： 在将电子部件（1）从电子部件组件（5）安装到基板（10）时，将基板（10）放置在可沿XY方向水平移动的工作台上，并且电子部件（1）通过保持 保持板（2）中的孔（3）。 所选择的一个电子部件（1）位于基板（10）上方的安装位置的正上方，并且推动销（23或24或26）位于该电子部件（1）的正上方。 然后，推销（23或24或26）降低并将所选择的电子部件（1）向下推出其保持孔（3），以将其直接安装到基板（10）上。
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65.发明授权Method of forming thick film circuit patterns with a sufficiently wide and uniformly thick strip 失效形成具有足够宽且均匀厚的条带的厚膜电路图案的方法
公开(公告)号：US4656048A
公开(公告)日：1987-04-07
申请号：US802950
申请日：1985-11-27
CPC分类号： H01L21/705 , H05K3/1241 , H05K2203/0126
摘要： Disclosed is a method of forming a thick film circuit pattern according which involves moving a nozzle having a slit opening above the surface of a stationary substrate with the elongation of the slit opening being oriented at an angle to the direction of movement of the nozzle and forcing a paste in the nozzle downward through the slit opening onto the substrate to deposit a sufficiently wide and uniformly thick film strip. Preferably, the surface irregularities of the substrate are detected without contacting it for controlling the position of the slit opening above the substrate so that it follows closely parallel with the surface contour line of the substrate.
摘要翻译： 公开了一种形成厚膜电路图案的方法，其包括在狭缝开口的伸长方向与喷嘴的移动方向成一定角度的情况下移动具有在固定基板的表面上方的狭缝开口的喷嘴，并且迫使 将喷嘴中的浆料向下通过狭缝开口，以沉积足够宽且均匀的厚膜条。 优选地，在不接触基板的情况下检测基板的表面凹凸，以控制基板上方的狭缝开口的位置，使其与基板的表面轮廓线紧密相邻。
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公开(公告)号：US4473247A
公开(公告)日：1984-09-25
申请号：US348404
申请日：1982-02-12
申请人： Eiji Itemadani , Kazuhiro Mori , Sohei Tanaka , Akira Kabeshita
发明人： Eiji Itemadani , Kazuhiro Mori , Sohei Tanaka , Akira Kabeshita
IPC分类号： B25J15/00 , B25J15/06 , B65G47/91 , H01L21/68 , H01L21/683
CPC分类号： B65G47/91 , H01L21/68 , H01L21/6838 , Y10T29/53178
摘要： A component mounting apparatus comprises a hollow rod communicated to a source of vacuum and having a suction head for picking up generally rectangular articles one at a time by the effect of a suction force. At least one pair of finger members for clamping and releasing the articles which has been sucked onto the suction head are provided for effecting a correction in position of the article relative to the suction head. Each of the finger members has an inclined end face which is adapted to support the article sucked onto the suction head from below in engagement with the opposite lower edges of the article.
摘要翻译： 部件安装装置包括连接到真空源的中空杆，并且具有用于通过抽吸力一次拾取大致矩形物品的吸头。 提供用于夹紧和释放被吸入到吸头上的物品的至少一对指状构件用于在物品相对于抽吸头的位置进行校正。 每个指状构件具有倾斜的端面，该倾斜端面适于从下方支撑吸附到吸头上的物品，以与物品的相对的下边缘接合。
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公开(公告)号：US4411362A
公开(公告)日：1983-10-25
申请号：US405105
申请日：1982-08-04
申请人： Eiji Itemadani , Kazuhiro Mori , Sohei Tanaka , Akira Kabeshita
发明人： Eiji Itemadani , Kazuhiro Mori , Sohei Tanaka , Akira Kabeshita
CPC分类号： B65D73/02
摘要： Assembly devices for electrical circuit components which is suitable for feeding electronic chip components, especially for semiconductor IC chips with comb-like leads, to e.g. chip mounting apparatuses, comprises two belt-like long objects made of tape-like and belt-shaped long materials, and is capable of feeding the electronic chip components mounted thereon in a stable and continuous feeding operation.
摘要翻译： 用于电路部件的装配装置，其适于馈送电子芯片部件，特别是用于将具有梳状引线的半导体IC芯片馈送到例如电子部件。 芯片安装装置包括由带状和带状长材料制成的两个带状长的物体，并且能够以稳定且连续的供给操作来供给安装在其上的电子元件部件。
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公开(公告)号：US08366864B2
公开(公告)日：2013-02-05
申请号：US13388492
申请日：2010-08-05
CPC分类号： H01L21/67092 , Y10T29/4913 , Y10T29/53178 , Y10T156/1089 , Y10T156/1744
摘要： Link mechanisms provided corresponding to press bonding heads each include a first link member having one end pivotably connected to an upper end of the press bonding head, a second link member having one end pivotably connected to the other end of the first link member and having the other end pivotably connected to a link bracket above the press bonding head, and a connection slide part connected to a connection part between the first and second link members, collectively drive the connection slide parts of the link mechanisms by a press bonding head driving unit in horizontal directions (Y axis directions) orthogonal to a direction (X axis direction) of side-by-side arrangement of the plurality of press bonding heads, open and close the first and second link members of the link mechanisms in the vertical directions thereby collectively moving the plurality of press bonding heads downward and upward.
摘要翻译： 对应于压接头的连杆机构各自包括：第一连杆部件，其一端可枢转地连接到压接头的上端;第二连杆部件，其一端可枢转地连接到第一连杆部件的另一端， 另一端可枢转地连接到压接头上方的连杆支架，以及连接到第一和第二连杆构件之间的连接部分的连接滑动部分，通过压接头驱动单元共同地驱动连杆机构的连接滑动部件 与多个压接头的并排配置的方向（X轴方向）正交的水平方向（Y轴方向），在垂直方向上打开和关闭连杆机构的第一和第二连杆构件，从而共同地 向下和向上移动多个压接头。
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公开(公告)号：US08001678B2
公开(公告)日：2011-08-23
申请号：US12202594
申请日：2008-09-02
IPC分类号： B23P19/00
CPC分类号： H01L21/67144 , H01L21/67132 , H01L2221/68322 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191
摘要： A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.
摘要翻译： 一种用于将多个部件安装在板上的部件安装装置。 该装置设置有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板保持位置的板上 ，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持其上供给各个部件的晶片的晶片保持台的部件供给装置， 晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。
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公开(公告)号：US20090159216A1
公开(公告)日：2009-06-25
申请号：US12282527
申请日：2007-03-12
申请人： Noboru Furuta , Yuzuru Inaba , Akira Kabeshita
发明人： Noboru Furuta , Yuzuru Inaba , Akira Kabeshita
IPC分类号： B29B15/00
CPC分类号： H05K13/046 , B23K1/203 , B23K2101/40 , H05K3/3436 , H05K3/3489 , H05K2201/035 , Y10T156/1798
摘要： In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first blade and a second blade for film formation use and scraping use of flux, respectively, and which is reciprocatively driven by a rodless cylinder via a drive transmission pin, is held by a movable member so as to be swingable about a swing support pin, and the movable member is braked with a specified braking force by a plate spring member. Thus, each time the direction of motion of the blade is reversed, the blade holding head swings, so that the first blade and the second blade can be automatically switched over without providing any exclusive drive mechanism.
摘要翻译： 在用于电子部件安装装置的磁通转移单元中，用于将磁通量从从部件供给单元拾取的电子部件传送，然后将电子部件安装在电路板上，具有第一叶片和第二叶片的刀片保持头 用于成膜的刮板和通过驱动传动销由无杆缸往复驱动的助焊剂的刮擦用刀片由可动件保持，以便围绕摆动支承销摆动，并且可动件是 用板簧构件以规定的制动力制动。 因此，每当叶片的运动方向反转时，叶片保持头摆动，使得第一叶片和第二叶片可以自动切换而不提供任何排他的驱动机构。
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