公开(公告)号：US5753537A

公开(公告)日：1998-05-19

申请号：US792338

申请日：1997-01-31

申请人： Ronald Dekker ,  Henricus G. R. Maas ,  Martinus P. J. G. Versleijen

发明人： Ronald Dekker ,  Henricus G. R. Maas ,  Martinus P. J. G. Versleijen

IPC分类号： H01L21/60 ,  H01L21/68 ,  H01L21/762 ,  H01L23/48 ,  H01L23/482 ,  H01L21/44

CPC分类号： H01L21/76264 ,  H01L21/6835 ,  H01L23/481 ,  H01L23/4822 ,  H01L24/11 ,  H01L24/13 ,  H01L21/76289 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68377 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/30105

摘要： The invention relates to a method of manufacturing a semiconductor device (1) for surface mounting. Such a method is known, whereby such a semiconductor device is manufactured in that a semiconductor body with a semiconductor element is mounted on a metal lead frame with metal package leads, after which contact surfaces of the semiconductor element are connected to the package leads by means of bonding wires. It is found that semiconductor devices of small dimensions are difficult to realize by this known method, while in addition the manufacture of integrated circuits with very many package leads is comparatively expensive owing to the many connections which are to be made between the integrated circuits and the package leads. According to the invention, the semiconductor devices are packaged while they are still on a slice of semiconductor material, while the package leads are formed from the semiconductor material. In the method according to the invention, the semiconductor devices are manufactured without the necessity of a lead frame, bonding wires, or metal package leads. Thanks to the IC technologies at the wafer level, such as photolithography, etching, etc., the method according to the invention renders possible semiconductor devices of very small dimensions. In addition, integrated circuits with very many package leads can be manufactured in a simple manner without additional steps being necessary. The method according to the invention is thus comparatively inexpensive.

摘要翻译： 本发明涉及制造用于表面安装的半导体器件（1）的方法。 这种方法是已知的，由此制造这样的半导体器件，其中具有半导体元件的半导体本体安装在具有金属封装引线的金属引线框架上，之后半导体元件的接触表面通过装置连接到封装引线 的接合线。 发现通过这种已知的方法难以实现小尺寸的半导体器件，而另外由于在集成电路和集成电路之间需要进行许多连接，所以具有非常多的封装引线的集成电路的制造相当昂贵 包装线 根据本发明，半导体器件在它们仍然在半导体材料片上时被封装，而封装引线由半导体材料形成。 在根据本发明的方法中，半导体器件被制造而不需要引线框架，接合线或金属封装引线。 由于晶圆级的IC技术，例如光刻，蚀刻等，根据本发明的方法使得可能的尺寸非常小的半导体器件成为可能。 此外，具有非常多的封装引线的集成电路可以以简单的方式制造而无需额外的步骤。 因此，根据本发明的方法相对便宜。

公开(公告)号：US5405789A

公开(公告)日：1995-04-11

申请号：US141888

申请日：1993-10-22

申请人： Ronald Dekker ,  Henricus G. R. Maas ,  Armand Pruijmboom ,  Wilhelmus T. A. J. Van Den Einden

发明人： Ronald Dekker ,  Henricus G. R. Maas ,  Armand Pruijmboom ,  Wilhelmus T. A. J. Van Den Einden

IPC分类号： H01L21/28 ,  H01L21/331 ,  H01L21/335 ,  H01L21/336 ,  H01L21/8249 ,  H01L29/78 ,  H01L21/265

CPC分类号： H01L29/66303 ,  H01L21/28 ,  H01L21/8249 ,  H01L29/66416

摘要： A method of manufacturing a semiconductor device with a semiconductor element which includes a semiconductor zone (19) situated below an electrode (18) and adjoining a surface (5) of a semiconductor body (1), which semiconductor zone substantially does not project outside the electrode (18) in lateral direction. The electrode (18) is here formed on the surface (5) of the semiconductor body (1), after which semiconductor material adjoining the surface (5) and not covered by the electrode (18) is removed by an etching treatment, whereby the position of the semiconductor zone (19) below the electrode (18) is defined. Before the electrode (18) is formed, a surface zone (16) adjoining the surface (5) is formed in the semiconductor body (1) with a depth and a doping such as are desired for the semiconductor zone (19) to be formed below the electrode (18), after which the electrode (18) is formed on this surface zone and, during the etching treatment, the portion of the surface zone (16) not covered by the electrode (18) is etched away through its entire thickness. Conducting materials such as aluminium or aluminium alloys may be used for the electrode (18), i.e. materials which are not resistant to temperatures necessary for forming semiconductor zones through diffusion.

摘要翻译： 一种制造具有半导体元件的半导体器件的方法，该半导体元件包括位于电极（18）下方并邻接半导体本体（1）的表面（5）的半导体区（19），该半导体区基本上不会突出在半导体本体 电极（18）。 此时，电极（18）形成在半导体本体（1）的表面（5）上，然后通过蚀刻处理去除邻接表面（5）并且未被电极（18）覆盖的半导体材料，由此， 限定电极（18）下方的半导体区域（19）的位置。 在形成电极（18）之前，在半导体本体（1）中形成与表面（5）相邻的表面区域（16），以形成半导体区域（19）所需的深度和掺杂 在电极（18）的下方，之后在该表面区域上形成电极（18），并且在蚀刻处理期间，未被电极（18）覆盖的表面区域（16）的部分通过其整个 厚度。 可以使用诸如铝或铝合金的导电材料用于电极（18），即不耐受通过扩散形成半导体区域所需的温度的材料。

公开(公告)号：US09945915B2

公开(公告)日：2018-04-17

申请号：US13265387

申请日：2010-04-13

申请人： Mareike Klee ,  Axel Winkel ,  John Brean Mills ,  Ronald Dekker ,  Bernardus Hendrikus Wilhelmus Hendriks

发明人： Mareike Klee ,  Axel Winkel ,  John Brean Mills ,  Ronald Dekker ,  Bernardus Hendrikus Wilhelmus Hendriks

IPC分类号： G01R33/28 ,  G01R33/34

CPC分类号： G01R33/287 ,  G01R33/34007 ,  G01R33/34084 ,  Y10T29/4902

摘要： An elongate device, such as a catheter, for interventional MRI has one or more passive LC-circuits attached to its distal tip portion for position tracking. The LC-circuits includes an inductor winding and a three-dimensional “trench” capacitor. The LC-circuits are integrated in a piece of silicon. Optical fibers may be included in the device for optical probing of tissue surrounding the distal tip portion.

公开(公告)号：US09072464B2

公开(公告)日：2015-07-07

申请号：US13379226

申请日：2010-07-16

申请人： Jaap Roger Haartsen ,  Ronald Dekker ,  Pascal De Graaf ,  Nicolaas Johannes Anthonius Van Veen ,  Alphonsus Tarcisius Jozef Maria Schipper

发明人： Jaap Roger Haartsen ,  Ronald Dekker ,  Pascal De Graaf ,  Nicolaas Johannes Anthonius Van Veen ,  Alphonsus Tarcisius Jozef Maria Schipper

IPC分类号： G01F1/68 ,  A61B5/11 ,  A61B5/00 ,  A61M15/00 ,  G01P5/10 ,  G01P5/12 ,  G01P13/00 ,  G08B21/04 ,  A61M5/168 ,  A61M16/00

CPC分类号： A61M11/005 ,  A61B5/1117 ,  A61B5/681 ,  A61B5/6831 ,  A61B2562/0219 ,  A61B2562/0271 ,  A61M5/16886 ,  A61M11/003 ,  A61M11/042 ,  A61M15/00 ,  A61M16/0003 ,  A61M16/104 ,  A61M16/18 ,  A61M2016/0021 ,  A61M2016/0027 ,  A61M2016/003 ,  A61M2205/332 ,  A61M2205/3334 ,  A61M2205/3368 ,  A61M2205/3375 ,  A61M2205/50 ,  A61M2205/82 ,  G01P5/10 ,  G01P5/12 ,  G01P13/006 ,  G08B21/0446 ,  Y10T29/49117 ,  Y10T29/49128

摘要： A thermal flow sensor integrated circuit for sensing flow in a channel based on temperature measurements, the integrated circuit having a temperature sensing element (30) on a front side of the integrated circuit arranged to face the channel, and a bond pad (60, 200) coupled electrically to the temperature sensing element, for making electrical contact off the integrated circuit, the bond pad being arranged to face away from the channel. By having the bond pad facing away from the channel, the space needed for the bond pad and any connections to it need not extend beyond the temperature sensing element and get in the way of the channel. Hence the temperature sensing element can be located closer to the channel or in the channel to enable measurements with better response time and sensitivity.

摘要翻译： 一种热流传感器集成电路，用于基于温度测量来感测通道中的流动，所述集成电路具有布置成面对所述通道的所述集成电路的前侧上的温度感测元件（30），以及接合焊盘（60,200 ）电耦合到所述温度感测元件，用于使所述集成电路进行电接触，所述接合焊盘被布置为面向远离所述通道。 通过使接合焊盘面向远离通道，接合焊盘所需的空间和与其连接的空间不需要延伸超过温度感测元件并妨碍通道。 因此，温度感测元件可以位于更靠近通道或通道中以使得能够以更好的响应时间和灵敏度进行测量。

公开(公告)号：US08784367B2

公开(公告)日：2014-07-22

申请号：US13001798

申请日：2009-07-02

申请人： Ronald Dekker ,  Jaap Haartsen ,  Pascal De Graaf ,  Antoon Marie Henrie Tombeur ,  Adrianus Johannes Maria Van Tuijl

发明人： Ronald Dekker ,  Jaap Haartsen ,  Pascal De Graaf ,  Antoon Marie Henrie Tombeur ,  Adrianus Johannes Maria Van Tuijl

IPC分类号： A61M31/00 ,  G01F1/68

CPC分类号： G01F1/6888 ,  A61M5/16886 ,  A61M2205/3334 ,  A61M2205/3368 ,  G01F1/6847 ,  G01F1/696 ,  G01F15/005 ,  G01F15/14

摘要： The invention relates to a sensor (102) and a control unit (702) for cooperation with the sensor. The sensor (102) serves for measuring a velocity of a fluid (308) flowing through a channel (306). The sensor (102) employs a thermal measuring principle, which measuring principle is robust regarding disturbances on the amount of power dissipated by the heating element (106). A sensor receiver (110) is arranged for receiving an electromagnetic radiation generated by a control transmitter (722) comprised in a control (702) unit for cooperation with the sensor (102). The electromagnetic radiation is employed for powering the heating element (106) which is arranged for heating the fluid. On the basis of a measurement signal generated by a transducer arrangement comprised in the sensor (102), a control actuator (724) controls the velocity of the fluid. For this purpose a sensor transmitter (116) is arranged for transmitting the measurement signal to a control receiver (734).

摘要翻译： 本发明涉及一种与传感器配合的传感器（102）和控制单元（702）。 传感器（102）用于测量流过通道（306）的流体（308）的速度。 传感器（102）采用热测量原理，其测量原理对于由加热元件（106）耗​​散的功率的干扰是鲁棒的。 传感器接收器（110）布置成用于接收由包含在控制（702）单元中的控制发射器（722）产生的电磁辐射，用于与传感器（102）协作。 电磁辐射用于为加热元件（106）提供动力，加热元件（106）用于加热流体。 基于由包括在传感器（102）中的换能器装置产生的测量信号，控制致动器（724）控制流体的速度。 为此，传感器发射器（116）被布置用于将测量信号发送到控制接收器（734）。

公开(公告)号：US08708922B2

公开(公告)日：2014-04-29

申请号：US12519817

申请日：2007-12-19

申请人： Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodorus Martinus Michielsen

发明人： Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodorus Martinus Michielsen

IPC分类号： A61B5/04

CPC分类号： A61B5/0031 ,  A61B5/0215 ,  A61B5/027 ,  A61B5/03 ,  A61B5/042 ,  A61B5/1459 ,  A61B5/1473 ,  A61B2560/0219

摘要： A local power-delivery/data-reception unit is installed within an insertion end of a sealed catheter. The local power-delivery/data-reception unit wirelessly powers a separately sealed sensor that is attached to the insertion end and configured for wirelessly sending a data signal to the local power-delivery/data-reception unit. The catheter may further feature a remote power-delivery/data-reception unit disposed within the handle and configured for wirelessly communicating with the local power-delivery/data-reception unit and a controller for controlling the sensor.

摘要翻译： 局部送电/数据接收单元安装在密封导管的插入端内。 本地供电/数据接收单元无线地对附接到插入端的单独密封的传感器供电，并被配置为将数据信号无线发送到本地电力传送/数据接收单元。 导管还可以具有设置在手柄内并被配置为与本地供电/数据接收单元无线通信的远程电力传送/数据接收单元和用于控制传感器的控制器。

公开(公告)号：US20140005521A1

公开(公告)日：2014-01-02

申请号：US13885791

申请日：2011-11-15

申请人： Max Oskar Köhler ,  Peter Dirksen ,  Shunmugavelu Sokka ,  Ronald Dekker

发明人： Max Oskar Köhler ,  Peter Dirksen ,  Shunmugavelu Sokka ,  Ronald Dekker

IPC分类号： A61N7/02 ,  A61B5/055 ,  A61B5/01 ,  A61B6/00 ,  A61B8/12 ,  A61B8/00 ,  A61B5/00 ,  A61B6/03

CPC分类号： A61B5/015 ,  A61B5/055 ,  A61B5/064 ,  A61B5/4836 ,  A61B6/03 ,  A61B6/12 ,  A61B6/4057 ,  A61B8/0841 ,  A61B8/12 ,  A61B8/445 ,  A61B8/4488 ,  A61B8/54 ,  A61B8/58 ,  A61B2018/00023 ,  A61B2090/064 ,  A61B2090/374 ,  A61B2562/028 ,  A61N7/022 ,  A61N2007/0095 ,  B06B1/0292 ,  G06F19/00

摘要： A catheter (700, 800, 1206) comprising: a shaft with distal (808, 906, 1004, 208) and proximal ends (1006),wherein the distal end comprises at least one array of capacitive micromachined ultrasound transducers (308, 402, 404, 500, 512, 600, 604, 802, 008) with an adjustable focus for controllably heating a target zone (806, 1014, 1210); and a connector (1012) at the proximal end for supplying the at least one array of capacitive micromachined ultrasound transducers with electrical power and for controlling the adjustable focus.

摘要翻译： 导管（700,800,1206）包括：具有远端（808,906,1004,208）和近端（1006）的轴，其中所述远端包括至少一个电容微加工超声换能器阵列（308,402， 具有可调焦点，用于可控制地加热目标区域（806,104,1210）; 以及在所述近端处的用于向所述至少一个电容微加工超声换能器阵列供电并用于控制所述可调焦点的连接器（1012）。

公开(公告)号：US08506793B2

公开(公告)日：2013-08-13

申请号：US13147607

申请日：2010-02-02

申请人： Ronald Dekker ,  Anja Van De Stolpe

发明人： Ronald Dekker ,  Anja Van De Stolpe

IPC分类号： G01N27/327

CPC分类号： G01N1/30 ,  C12N5/0657 ,  C12N2503/02 ,  C12N2535/10 ,  G01N33/5061

摘要： Disclosed is a device for determining the cardiotoxicity of a chemical compound, comprising a substrate (10) carrying a deformable stack (34), said stack being partially detached from the substrate by a cavity (32) allowing an out-of-plane deformation of the stack, said stack comprising a first deformable layer (16), a second deformable layer (20) and a multi-electrode structure (18) sandwiched between the first and second deformable layers, the second deformable layer carrying a pattern of cardiomyocytes (28) adhered thereto; and a liquid container (26) mounted on the substrate for exposing the cardiomyocytes to the chemical compound. A method of manufacturing such a device is also disclosed. The present invention further relates to the use of the device for drug target discovery and/or drug development and a method for developing a disease model for a disease that is caused by or modified by stretching of cells, in particular a cardiac disease model.

摘要翻译： 公开了一种用于确定化合物的心脏毒性的装置，包括承载可变形叠层（34）的基底（10），所述叠层通过空腔（32）部分地从基底分离， 所述堆叠包括夹在所述第一和第二可变形层之间的第一可变形层（16），第二可变形层（20）和多电极结构（18），所述第二可变形层承载心肌细胞图案（28 ） 和安装在基板上的用于将心肌细胞暴露于化合物的液体容器（26）。 还公开了制造这种装置的方法。 本发明还涉及该装置用于药物靶发现和/或药物开发的用途，以及用于开发由细胞拉伸，特别是心脏疾病模型引起或改变的疾病的疾病模型的方法。

公开(公告)号：US20120039565A1

公开(公告)日：2012-02-16

申请号：US13208806

申请日：2011-08-12

申请人： Edwin Jan Klein ,  Ronald Dekker ,  Hindrik F. Bulthuis

发明人： Edwin Jan Klein ,  Ronald Dekker ,  Hindrik F. Bulthuis

IPC分类号： G02B6/12

CPC分类号： G02B6/12007 ,  G02B6/29332 ,  G02B6/2938 ,  G02B2006/12061 ,  G02B2006/12123 ,  G02B2006/12147

摘要： A beam combiner is disclosed that comprises a planar lightwave circuit that is based on undoped silicon nitride-based surface waveguides, wherein the planar lightwave circuit comprises a plurality of input ports, a mixing region, and an output port, and wherein the mixing region comprises a plurality of directional couplers that are arranged in a tree structure. Embodiments of the present invention are capable of combining a plurality of light signals characterized by disparate wavelengths on irregular spacings with low loss. Further, the present invention enables high-volume, low cost production of beam combiners capable of combining three or more light signals into a single composite output beam.

摘要翻译： 公开了一种组合器，其包括基于未掺杂的基于氮化硅的表面波导的平面光波电路，其中所述平面光波电路包括多个输入端口，混合区域和输出端口，并且其中所述混合区域包括 以树结构布置的多个定向耦合器。 本发明的实施例能够以不同的波长以不同的间隔组合以不同波长表征的多个光信号，并具有低损耗。 此外，本发明能够高容量，低成本地生产能够将三个或更多个光信号组合成单个复合输出光束的光束组合器。

公开(公告)号：US20120038032A1

公开(公告)日：2012-02-16

申请号：US13279941

申请日：2011-10-24

申请人： Ronald Dekker ,  Theodorus Martinus Michielsen

发明人： Ronald Dekker ,  Theodorus Martinus Michielsen

IPC分类号： H01L29/06 ,  H01L21/56

CPC分类号： H01L27/12 ,  G02F1/133305 ,  G02F1/136227 ,  G02F1/167 ,  G02F2001/13613 ,  G02F2202/105 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/3244 ,  H01L51/524 ,  H01L51/5253 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2251/5338

摘要： The rollable device of the invention comprises a substrate of an insulating material with apertures extending from a first to a second side. On the first side switching elements are present, as well as interconnect lines and the like, covered by a coating of organic material. On the second side a functional layer is present. Examples of such functional layers include capacitors, antennas and particularly electro-optical layers. Thus, with a rollable display that may include an antenna and a driver circuit is obtained.

摘要翻译： 本发明的可滚动装置包括具有从第一侧延伸到第二侧的孔的绝缘材料的基底。 在第一侧上存在开关元件以及由有机材料涂层覆盖的互连线等。 在第二面上存在功能层。 这些功能层的实例包括电容器，天线，特别是电光层。 因此，可以获得可包括天线和驱动电路的可滚动显示器。