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公开(公告)号：US5772837A
公开(公告)日：1998-06-30
申请号：US822798
申请日：1997-03-24
CPC分类号： B32B37/0023 , B32B37/10 , B32B37/26 , B32B2315/02
摘要： The present invention relates generally to a new apparatus and method for forming cavities without using an insert. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic) without using inserts.
摘要翻译： 本发明一般涉及一种用于在不使用插入件的情况下形成空腔的新装置和方法。 更具体地说，本发明涵盖了在不使用插件的情况下在MLC（多层陶瓷）中制造空腔的装置和方法。
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公开(公告)号：US5707476A
公开(公告)日：1998-01-13
申请号：US530499
申请日：1995-09-19
CPC分类号： B32B37/26 , B32B37/0023 , H01L21/4857 , H01L21/486 , B32B2315/02
摘要： The present invention relates generally to a new apparatus and method for simultaneously laminating a plurality of substrates having at least one cavity. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic). A membrane with or without an opening is placed on the top surface of the unlaminated green sheet having at least one cavity and then standard pressure is applied to laminate the green sheets, while simultaneously a counter pressure is applied in the cavity to prevent the cavity from deforming or collapsing. This is done to simultaneously form a plurality of cavity substrates.
摘要翻译： 本发明一般涉及用于同时层压具有至少一个空腔的多个基板的新装置和方法。 更具体地说，本发明涵盖用于在MLC（多层陶瓷）中制造空腔的装置和方法。 具有或不具有开口的膜被放置在具有至少一个空腔的未层压生片的顶表面上，然后施加标准压力以层压生片，同时在空腔中施加反压力以防止空腔 变形或塌陷。 这样做同时形成多个空腔基板。
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公开(公告)号：US5073180A
公开(公告)日：1991-12-17
申请号：US672517
申请日：1991-03-20
申请人： Shaji Farooq , Govindarajan Natarajan , Srinivasa S. N. Reddy , Richard A. Shelleman , Nancy C. Stoffel , Rao V. Vallabhaneni
发明人： Shaji Farooq , Govindarajan Natarajan , Srinivasa S. N. Reddy , Richard A. Shelleman , Nancy C. Stoffel , Rao V. Vallabhaneni
IPC分类号： C03B32/02 , C03C3/064 , C03C10/00 , C03C17/10 , C04B35/622 , C04B35/64 , H05K1/03 , H05K1/09 , H05K3/46
CPC分类号： H05K3/4629 , H05K3/4611 , H05K1/0306 , H05K1/092 , Y10T29/49126 , Y10T29/49163
摘要： A method for forming a co-fired glass ceramic structure including the steps of:forming at least one green sheet of a first crystallizable glass in a thermally decomposable binder;metallizing the green sheet with a pattern of conductive paste including conductive metal, a second crystallizable glass and a thermally decomposable binder, the pattern including at least one via;firing the green sheet according to the following firing cycle steps:a. preheating the green sheet to a first temperature in a furnace with a neutral or reducing ambient so as to effect pyrolysis of the thermally decomposable binders, wherein the first temperature is insufficient to coalesce the first crystallizable glass or the conductive paste;b. introducing a steam ambient into the furnace and then heating the green sheet in the furnace at the first temperature to burn off the pyrolyzed binders;c. replacing the steam ambient with a neutral or reducing ambient and raising the temperature to a second temperature to effect densification and crystallization of the first and second glasses;d. maintaining the second temperature for a predetermined time to effect sealing of the at least one via wherein for a first portion of the predetermined time, the ambient in said furnace is a neutral or reducing ambient and for a second portion of the predetermined time, the neutral or reducing ambient is replaced with a steam ambient; ande. cooling the structure.
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公开(公告)号：US4971738A
公开(公告)日：1990-11-20
申请号：US220192
申请日：1988-07-18
申请人： Lester W. Herron , Sarah H. Knickerbocker , Ananda Hosakere Kumar , Govindarajan Natarajan , Srinivasa S. N. Reddy
发明人： Lester W. Herron , Sarah H. Knickerbocker , Ananda Hosakere Kumar , Govindarajan Natarajan , Srinivasa S. N. Reddy
IPC分类号： C04B35/64 , B32B18/00 , C04B35/634 , C04B35/638 , H01L21/48 , H05K3/46
CPC分类号： C04B35/6342 , B32B18/00 , C04B35/634 , C04B35/638 , C04B35/645 , H01L21/4857 , C04B2235/6582 , C04B2235/6588 , C04B2237/34 , C04B2237/341 , C04B2237/343 , C04B2237/363 , C04B2237/68 , C04B2237/704
摘要： There is disclosed the enhancement of the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.
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公开(公告)号：US07992627B2
公开(公告)日：2011-08-09
申请号：US12338092
申请日：2008-12-18
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/09701 , Y10S165/908 , H01L2924/00
摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.
摘要翻译： 低压降热组件，制造用于高功率通量情况的低压降热组件的系统和方法。 歧管主体连接到分配器以形成子组件。 该子组件与衬底表面连通，衬底表面具有需要对其进行热管理的半导体器件。 在目标衬底表面和子组件之间形成封闭空腔，并且空腔的密封件保护驻留在半导体器件的有源表面上的关键部件。 分配器包括与分布式微喷射排放阵列隔离并平行的分布式液体冲击微喷射入口阵列，用于冲击冷却流体并在与目标表面正交的方向上去除用过的热的流体，以最大化传热速率，从而提供高冷却通量 同时实现低压降。
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公开(公告)号：US20100200197A1
公开(公告)日：2010-08-12
申请号：US12698430
申请日：2010-02-02
IPC分类号： H01L23/473 , F28D15/00 , F28D11/06 , H01L23/433
CPC分类号： H01L23/4735 , F28D15/00 , F28F13/00 , F28F2013/006 , H01L23/3733 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.
摘要翻译： 本发明提供一种散热器及其使用方法，用于冷却集成电路（IC）芯片。 散热器包括歧管块，充满液体的冷却系统和固定到歧管块的柔性箔，并且由闭环冷却系统中的液体支撑。 由箔片后面的液体提供的压力导致箔片弯曲并符合IC芯片表面中的非平面性，从而减少了气隙并增加了IC芯片与散热片之间的热耦合。
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公开(公告)号：US20090303684A1
公开(公告)日：2009-12-10
申请号：US12132882
申请日：2008-06-04
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.
摘要翻译： 提供了通过在将电子设备与散热器分隔开的间隙中的增强的热传导来冷却电子设备的系统和方法。 在一个实施例中，用于冷却电子设备的系统包括：通过间隙与集成电路隔开的散热器; 以及配置成将包含雾化液体和载气的混合物供给到所述间隙的起泡器和雾化器。
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公开(公告)号：US20090109628A1
公开(公告)日：2009-04-30
申请号：US11928165
申请日：2007-10-30
IPC分类号： H01L23/367 , F28F7/00
CPC分类号： H01L23/367 , F28F13/00 , H01L23/3736 , H01L2924/0002 , H01L2924/00
摘要： Integrated circuit chip cooling methods and systems are disclosed. A method for cooling an integrated circuit chip may comprise: providing a cooling mechanism; positioning an interface medium between the cooling mechanism and the integrated circuit chip; and interfacing the cooling mechanism and the integrated circuit chip through the interface medium; wherein at least one of the cooling mechanism, the integrated circuit chip, or the interface medium includes a convex portion on an interface surface thereof.
摘要翻译： 公开了集成电路芯片的冷却方法和系统。 用于冷却集成电路芯片的方法可以包括：提供冷却机构; 在冷却机构和集成电路芯片之间定位界面介质; 并通过接口介质与冷却机构和集成电路芯片接口; 其中所述冷却机构，所述集成电路芯片或所述界面介质中的至少一个在其界面表面上包括凸部。
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公开(公告)号：US20080057569A1
公开(公告)日：2008-03-06
申请号：US11468089
申请日：2006-08-29
申请人： Govindarajan Natarajan , Emmanuel Delamarche , Eric A. Eckberg , James N. Humenik , Kathleen A. McGroddy-Goetz , Scott Partington , Christopher F Perrera , Marco G. Trivella , Timothy M. Wiwel
发明人： Govindarajan Natarajan , Emmanuel Delamarche , Eric A. Eckberg , James N. Humenik , Kathleen A. McGroddy-Goetz , Scott Partington , Christopher F Perrera , Marco G. Trivella , Timothy M. Wiwel
IPC分类号： C12M1/34
CPC分类号： G01N13/04 , A61B2010/0067
摘要： An apparatus, system and method for determining the osmolarity of a fluid. The system includes an apparatus having: a chip with a substantially planar top surface; a first circuit portion and a second circuit portion, each having a plurality of redundant electrically conductive lines disposed on the top surface; and a gap disposed between the first circuit portion and the second circuit portion, wherein a circuit is created when a fluid sample bridges the gap and connects the first circuit portion and the second circuit portion.
摘要翻译： 用于测定流体渗透压的装置，系统和方法。 该系统包括具有：具有基本平坦的顶表面的芯片的装置; 第一电路部分和第二电路部分，每个具有设置在顶表面上的多个冗余导电线; 以及设置在第一电路部分和第二电路部分之间的间隙，其中当流体样品桥接间隙并连接第一电路部分和第二电路部分时产生电路。
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公开(公告)号：US20070227173A1
公开(公告)日：2007-10-04
申请号：US11308504
申请日：2006-03-30
CPC分类号： H01L23/4735 , F28F3/12 , F28F13/02 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.
摘要翻译： 一种用于热控制的分配设备，系统和方法，其中歧管组件的板具有定位在其表面上的特定位置上的预定表面特征，以增强组件的冷却能力。 板的预定表面特征延迟了撞击板表面的流体的速度衰减，同时还增加了暴露于冲击液体的板的表面积，这进而使整体的可靠性和热性能最大化 热系统在给定的最大工作压力。
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