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公开(公告)号：US5665195A
公开(公告)日：1997-09-09
申请号：US476468
申请日：1995-06-07
CPC分类号： B32B37/0023 , B32B37/10 , B32B37/26 , B32B2315/02
摘要： The present invention relates generally to a new apparatus for forming cavities without using an insert. More particularly, the invention encompasses apparatus for fabricating cavities in MLC (multi-layer ceramic) without using inserts.
摘要翻译： 本发明一般涉及一种用于在不使用插入件的情况下形成空腔的新装置。 更具体地，本发明包括用于在不使用插入件的情况下在MLC（多层陶瓷）中制造空腔的装置。
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公开(公告)号：US5707480A
公开(公告)日：1998-01-13
申请号：US530500
申请日：1995-09-19
CPC分类号： H01L21/486 , B32B37/0023 , B32B37/26 , H01L21/4857 , B32B2315/02
摘要： The present invention relates generally to a new apparatus and method for simultaneously laminating a plurality of substrates having at least one cavity. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic). A membrane with or without an opening is placed on the top surface of the unlaminated green sheet having at least one cavity and then standard pressure is applied to laminate the green sheets, while simultaneously a counter pressure is applied in the cavity to prevent the cavity from deforming or collapsing. This is done to simultaneously form a plurality of cavity substrates.
摘要翻译： 本发明一般涉及用于同时层压具有至少一个空腔的多个基板的新装置和方法。 更具体地说，本发明涵盖用于在MLC（多层陶瓷）中制造空腔的装置和方法。 具有或不具有开口的膜被放置在具有至少一个空腔的未层压生片的顶表面上，然后施加标准压力以层压生片，同时在空腔中施加反压力以防止空腔 变形或塌陷。 这样做同时形成多个空腔基板。
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公开(公告)号：US5772837A
公开(公告)日：1998-06-30
申请号：US822798
申请日：1997-03-24
CPC分类号： B32B37/0023 , B32B37/10 , B32B37/26 , B32B2315/02
摘要： The present invention relates generally to a new apparatus and method for forming cavities without using an insert. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic) without using inserts.
摘要翻译： 本发明一般涉及一种用于在不使用插入件的情况下形成空腔的新装置和方法。 更具体地说，本发明涵盖了在不使用插件的情况下在MLC（多层陶瓷）中制造空腔的装置和方法。
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公开(公告)号：US5707476A
公开(公告)日：1998-01-13
申请号：US530499
申请日：1995-09-19
CPC分类号： B32B37/26 , B32B37/0023 , H01L21/4857 , H01L21/486 , B32B2315/02
摘要： The present invention relates generally to a new apparatus and method for simultaneously laminating a plurality of substrates having at least one cavity. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic). A membrane with or without an opening is placed on the top surface of the unlaminated green sheet having at least one cavity and then standard pressure is applied to laminate the green sheets, while simultaneously a counter pressure is applied in the cavity to prevent the cavity from deforming or collapsing. This is done to simultaneously form a plurality of cavity substrates.
摘要翻译： 本发明一般涉及用于同时层压具有至少一个空腔的多个基板的新装置和方法。 更具体地说，本发明涵盖用于在MLC（多层陶瓷）中制造空腔的装置和方法。 具有或不具有开口的膜被放置在具有至少一个空腔的未层压生片的顶表面上，然后施加标准压力以层压生片，同时在空腔中施加反压力以防止空腔 变形或塌陷。 这样做同时形成多个空腔基板。
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公开(公告)号：US5876549A
公开(公告)日：1999-03-02
申请号：US685431
申请日：1996-07-24
CPC分类号： B32B38/1841 , B32B2315/02 , H05K1/0306 , H05K3/4629 , H05K3/4638 , Y10T156/1052 , Y10T156/13 , Y10T156/1322 , Y10T156/1749 , Y10T156/1761
摘要： A method and apparatus for processing sheets, includes placing a sheet on a carrier to form a sheet/carrier structure, sizing the sheet/carrier structure, stacking the sheet/carrier structure in a stacking apparatus having a second sheet stacked in advance therein, so that the sheet contacts the second sheet, aligning the sheets with pins, tacking the sheet to the second sheet and removing the carrier.
摘要翻译： 一种用于处理片材的方法和装置，包括将片材放置在载体上以形成片/载体结构，调整片/载体结构的尺寸，将片/载体结构堆叠在具有预先堆叠的第二片材的堆叠装置中，因此 片材接触第二片材，使片材与针对齐，将片材固定到第二片材并移除载体。
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公开(公告)号：US5783026A
公开(公告)日：1998-07-21
申请号：US448692
申请日：1995-05-24
CPC分类号： B32B38/1841 , B32B2315/02 , H05K1/0306 , H05K3/4629 , H05K3/4638 , Y10T156/1052 , Y10T156/13 , Y10T156/1322 , Y10T156/1749 , Y10T156/1761
摘要： A method and apparatus for processing sheets, includes placing a sheet on a carrier to form a sheet/carrier structure, sizing the sheet/carrier structure, stacking the sheet/carrier structure in a stacking apparatus having a second sheet stacked in advance therein, so that the sheet contacts the second sheet, aligning the sheets with pins, tacking the sheet to the second sheet and removing the carrier.
摘要翻译： 一种用于处理片材的方法和装置，包括将片材放置在载体上以形成片/载体结构，调整片/载体结构的尺寸，将片/载体结构堆叠在具有预先堆叠的第二片材的堆叠装置中，因此 片材接触第二片材，使片材与针对齐，将片材固定到第二片材并移除载体。
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公开(公告)号：US20120326321A1
公开(公告)日：2012-12-27
申请号：US13600716
申请日：2012-08-31
IPC分类号： H01L23/48
CPC分类号： H01L23/5385 , H01L21/486 , H01L23/5384 , H01L23/60 , H01L24/16 , H01L25/0652 , H01L2224/16 , H01L2224/16225 , H01L2924/00014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01047 , H01L2924/01078 , H01L2924/01322 , H01L2924/04941 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/19105 , H01L2924/00 , H01L2224/48
摘要： Techniques for modular chip fabrication are provided. In one aspect, a modular chip structure is provided. The modular chip structure comprises a substrate; a carrier platform attached to the substrate, the carrier platform comprising a plurality of conductive vias extending through the carrier platform; and a wiring layer on the carrier platform in contact with one or more of the conductive vias, wherein the wiring layer comprises one or more wiring levels and is configured to divide the carrier platform into a plurality of voltage islands; and chips, chip macros or at least one chip in combination with at least one chip macro assembled on the carrier platform.
摘要翻译： 提供了模块化芯片制造技术。 一方面，提供了一种模块化芯片结构。 模块化芯片结构包括基板; 载体平台，其附接到所述基底，所述载体平台包括延伸穿过所述载体平台的多个导电通孔; 以及载体平台上的一个或多个导电通孔接触的布线层，其中所述布线层包括一个或多个布线层，并且被配置为将所述载体平台划分成多个电压岛; 芯片，芯片宏或至少一个芯片组合在载体平台上组装的至少一个芯片宏。
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公开(公告)号：US20120301977A1
公开(公告)日：2012-11-29
申请号：US13569872
申请日：2012-08-08
申请人： Paul Stephen Andry , Harm Peter Hofstee , George A. Katopis , John Ulrich Knickerbocker , Robert K. Montoye , Chirag S. Patel
发明人： Paul Stephen Andry , Harm Peter Hofstee , George A. Katopis , John Ulrich Knickerbocker , Robert K. Montoye , Chirag S. Patel
CPC分类号： H01L25/0655 , H01L23/147 , H01L23/60 , H01L25/0652 , H01L2224/16225 , H01L2924/10253 , H01L2924/157 , H01L2924/00
摘要： A silicon carrier structure for electronic packaging includes a base substrate, a silicon carrier substrate disposed on the base substrate, a memory chip disposed on the silicon carrier substrate, a microprocessor chip disposed on the silicon carrier substrate, an input/output chip disposed on the silicon carrier substrate, and a clocking chip disposed on the silicon carrier substrate.
摘要翻译： 一种用于电子封装的硅载体结构包括基底，设置在基底基板上的硅载体衬底，设置在硅载体衬底上的存储芯片，设置在硅载体衬底上的微处理器芯片，设置在硅衬底上的输入/输出芯片 硅载体衬底和设置在硅载体衬底上的时钟芯片。
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公开(公告)号：US07750459B2
公开(公告)日：2010-07-06
申请号：US12024394
申请日：2008-02-01
IPC分类号： H01L23/538
CPC分类号： H01L23/3736 , H01L23/055 , H01L23/42 , H01L23/49827 , H01L23/5384 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L25/165 , H01L25/18 , H01L2224/16145 , H01L2224/16225 , H01L2224/29111 , H01L2224/32145 , H01L2224/73153 , H01L2224/73204 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/0132 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/351 , H01L2924/0105 , H01L2924/01047 , H01L2924/01082 , H01L2224/13111 , H01L2924/00014 , H01L2924/00
摘要： An apparatus for an integrated module. A silicon carrier with through-silicon vias has a plurality of die connected to a top side of the silicon carrier. In addition, a substrate is connected to a bottom side of the silicon carrier. The substrate is coupled to the plurality of die via the through-silicon vias.
摘要翻译： 一种用于集成模块的装置。 具有通硅通孔的硅载体具有连接到硅载体顶侧的多个管芯。 此外，衬底连接到硅载体的底侧。 衬底通过硅通孔耦合到多个管芯。
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10.发明申请公开(公告)号：US20090267238A1
公开(公告)日：2009-10-29
申请号：US12110579
申请日：2008-04-28
IPC分类号： H01L23/538 , H01L21/60
CPC分类号： H01L23/49833 , H01L24/16 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00013 , H01L2924/01079 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15192 , H01L2924/15311 , H01L2224/29099
摘要： A structure and a method for forming the same. The structure includes a substrate, a first interposer on the substrate, a second interposer on the substrate, and a first bridge. The first and second interposers are electrically connected to the substrate. The first bridge is electrically connected to the first and second interposers.
摘要翻译： 一种结构及其形成方法。 该结构包括衬底，衬底上的第一插入件，衬底上的第二插入件和第一桥。 第一和第二插入件电连接到基板。 第一桥电连接到第一和第二插入件。
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