公开(公告)号：US20080079516A1

公开(公告)日：2008-04-03

申请号：US11540413

申请日：2006-09-28

申请人： Richard C. Ruby ,  Wei Pang

发明人： Richard C. Ruby ,  Wei Pang

IPC分类号： H03H9/58

CPC分类号： H03H3/04 ,  H03H9/105 ,  H03H9/605

摘要： An oscillator including a high tone bulk acoustic resonator (HBAR), a film bulk acoustic resonator (FBAR) filter and a method of fabrication are described.

摘要翻译： 描述了包括高音体积声共振器（HBAR），薄膜体声波谐振器（FBAR）滤波器和制造方法的振荡器。

公开(公告)号：US20080078233A1

公开(公告)日：2008-04-03

申请号：US11526948

申请日：2006-09-25

申请人： John D. Larson ,  Storrs T. Hoen ,  Annette C. Grot ,  Richard C. Ruby ,  Graham M. Flower

发明人： John D. Larson ,  Storrs T. Hoen ,  Annette C. Grot ,  Richard C. Ruby ,  Graham M. Flower

IPC分类号： G01H13/00

CPC分类号： G01N29/022 ,  G01N29/036 ,  G01N2291/0253 ,  G01N2291/0256 ,  G01N2291/02845 ,  G01N2291/0426

摘要： A sensor senses an environmental condition. The sensor includes a film bulk acoustic resonator that includes a layer of material that causes resonant frequency and/or quality factor shifts of the film bulk acoustic resonator in response to changes in the environmental condition. The environmental condition may be relative humidity and the layer of material may be a moisture absorptive material.

摘要翻译： 传感器感测环境条件。 传感器包括膜体声波谐振器，其包括响应于环境条件的变化而引起膜体声波谐振器的谐振频率和/或质量因子偏移的材料层。 环境条件可以是相对湿度，并且材料层可以是吸湿材料。

公开(公告)号：US06953990B2

公开(公告)日：2005-10-11

申请号：US10666363

申请日：2003-09-19

申请人： Kendra J. Gallup ,  Frank S. Geefay ,  Ronald Shane Fazzio ,  Martha Johnson ,  Carrie Ann Guthrie ,  Tanya Jegeris Snyder ,  Richard C. Ruby

发明人： Kendra J. Gallup ,  Frank S. Geefay ,  Ronald Shane Fazzio ,  Martha Johnson ,  Carrie Ann Guthrie ,  Tanya Jegeris Snyder ,  Richard C. Ruby

IPC分类号： H01L23/02 ,  B81B7/00 ,  B81C3/00 ,  G02B6/42 ,  H01L21/00 ,  H01L21/46 ,  H01L21/60 ,  H01L23/495 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/00 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/026

CPC分类号： H01S5/02288 ,  G02B6/4206 ,  H01L2924/0002 ,  H01S5/02248 ,  H01S5/02292 ,  H01L2924/00

摘要： A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.

摘要翻译： 晶片级封装包括第一晶片，其包括接合焊盘，第一晶片上的光电器件，以及包括垫片的第二晶片。 第二晶片通过垫圈和接合垫之间的接合附接到第一晶片。

公开(公告)号：US06794958B2

公开(公告)日：2004-09-21

申请号：US10202974

申请日：2002-07-25

申请人： Joel Alan Philliber ,  Richard C. Ruby

发明人： Joel Alan Philliber ,  Richard C. Ruby

IPC分类号： H03H954

CPC分类号： H03H9/105 ,  H03H9/587

摘要： A method for fabricating an apparatus, and an apparatus embodying the same is disclosed. First a device chip having circuit elements is fabricated. Next, a cap with a cap circuit is fabricated. Finally, the cap is placed on the device chip to connect a first contact point with a second contact point using the connector on the cap. The apparatus includes a device chip and a cap. The device chip has the first contact point and a second contact point. The cap has the cap circuit that, when the cap is placed on the device chip, connects the first contact point with the second contact point.

摘要翻译： 公开了一种制造装置的方法及其体现方法。 首先，制造具有电路元件的器件芯片。 接下来，制造具有盖电路的盖。 最后，使用盖上的连接器将盖放置在设备芯片上以将第一接触点与第二接触点连接。 该装置包括装置芯片和盖。 器件芯片具有第一接触点和第二接触点。 盖具有帽盖电路，当帽被放置在器件芯片上时，将第一接触点与第二接触点连接。

公开(公告)号：US06462631B2

公开(公告)日：2002-10-08

申请号：US09783773

申请日：2001-02-14

申请人： Paul Bradley ,  Richard C. Ruby

发明人： Paul Bradley ,  Richard C. Ruby

IPC分类号： H03H958

CPC分类号： H03H9/605

摘要： A filter, such as a transmit filter of a duplexer, includes an array of acoustic resonators that cooperate to establish an asymmetrically shaped filter response over a target frequency passband. The acoustic resonators are preferably film bulk acoustic resonators (FBARs). The filter response defines an insertion loss profile in which a minimum insertion loss within the target passband is located at or near a first end of the frequency passband, while the maximum insertion loss is located at or near the opposite end of the frequency passband. In the transmit filter embodiment, the minimum insertion loss is at or near the high frequency end of the filter response, which is tailored by selectively locating poles and zeros of the array of FBARs.

摘要翻译： 诸如双工器的发射滤波器的滤波器包括声谐振器阵列，其协作以在目标频率通带上建立不对称形状的滤波器响应。 声谐振器优选为薄膜体声波谐振器（FBAR）。 滤波器响应定义了插入损耗曲线，其中目标通带内的最小插入损耗位于频率通带的第一端处或接近频率通带的第一端，而最大插入损耗位于或接近频率通带的相对端。 在发射滤波器实施例中，最小插入损耗处于或接近滤波器响应的高频端，其通过选择性地定位FBAR阵列的极点和零点来定制。

公开(公告)号：US06265246B1

公开(公告)日：2001-07-24

申请号：US09359844

申请日：1999-07-23

申请人： Richard C. Ruby ,  Tracy E. Bell ,  Frank S. Geefay ,  Yogesh M. Desai

发明人： Richard C. Ruby ,  Tracy E. Bell ,  Frank S. Geefay ,  Yogesh M. Desai

IPC分类号： H01L2144

CPC分类号： B81C1/00301 ,  B81B2207/07 ,  B81C1/00484 ,  H01L2224/48463 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. A cap wafer has gaskets formed thereon using a thick photoresist, semiconductor photolithographic process. Bonding pad gaskets match the perimeters of the bonding pads and a peripheral pad gasket matches the peripheral pad on the base wafer. Wells are located inside the perimeters of the bond pad gaskets and are formed to a predetermined depth in the cap wafer. The cap wafer is then placed over the base wafer to cold weld bond the gaskets to the pads and form a hermetically sealed volume between the bonding pad gaskets and the peripheral pad gasket. The cap wafer is then thinned below the predetermined depth until the wells become through holes that provide access to the bonding pads inside the package, but outside the hermetically sealed volume, for connecting wires from a micro device utilizing system.

摘要翻译： 提供了一种微型晶片级封装，其中微型器件连接到基片上的焊盘。 基底晶片上的外围焊盘包围接合焊盘和微型器件。 盖晶片使用厚的光致抗蚀剂，半导体光刻工艺在其上形成垫圈。 接合垫垫片与焊盘的周长相匹配，外围衬垫垫片与基底晶片上的外围焊盘相匹配。 孔位于接合垫垫片的周边内，并且形成在盖晶片中的预定深度。 然后将盖晶片放置在基底晶片上，以将焊垫冷却焊接到焊盘，并在焊盘垫片和外围焊盘垫圈之间形成气密密封的体积。 然后将盖晶片减薄到预定深度以下，直到阱变成通孔，其提供对封装内的接合焊盘的访问，但是在气密密封的体积外部，用于从微器件利用系统连接引线。

公开(公告)号：US5883575A

公开(公告)日：1999-03-16

申请号：US909677

申请日：1997-08-12

申请人： Richard C. Ruby ,  Philip Canfield

发明人： Richard C. Ruby ,  Philip Canfield

IPC分类号： G08B13/24 ,  H03H9/17 ,  H03H9/58 ,  G08B13/14

CPC分类号： H03H9/585 ,  G08B13/2414 ,  G08B13/2417 ,  G08B13/2422 ,  G08B13/2431 ,  G08B13/2437 ,  G08B13/2442 ,  H03H9/171 ,  H03H9/586

摘要： An RF tag having an antenna for receiving a RF signal having a frequency band between first and second frequencies and an acoustical resonator having a resonant frequency related to the first and second frequencies. The acoustical resonator has first and second electrodes that sandwich a layer of piezoelectric material. The antenna is connected to one of these electrodes. The resonator filters the signal received on the antenna. The filter can function either as a notch filter or as a bandpass filter. A resonator that acts as a bandpass filter includes a third electrode and a second layer piezoelectric material sandwiched between the second electrode and the third electrode. A frequency multiplier circuit may be incorporated in the RF tag to provide a response signal that occupies a frequency band at a frequency above the second frequency. In one embodiment of the present invention, multiple resonators having different resonant frequencies are utilized to generate a response code. In one embodiment of the present invention, the resonators are suspended on a support member over a substrate at locations on the support member which differ in thickness.

摘要翻译： 一种具有用于接收具有第一和第二频率之间的频带的RF信号的天线的RF标签和具有与第一和第二频率相关的共振频率的声学谐振器。 声谐振器具有夹着压电材料层的第一和第二电极。 天线连接到这些电极之一。 谐振器对天线上接收到的信号进行滤波。 滤波器可以用作陷波滤波器或带通滤波器。 用作带通滤波器的谐振器包括夹在第二电极和第三电极之间的第三电极和第二层压电材料。 频率乘法器电路可并入RF标签中以提供以高于第二频率的频率占据频带的响应信号。 在本发明的一个实施例中，利用具有不同谐振频率的多个谐振器来产生响应码。 在本发明的一个实施例中，谐振器在不同厚度的支撑构件上的位置处悬挂在基板上的支撑构件上。

公开(公告)号：US5587620A

公开(公告)日：1996-12-24

申请号：US171227

申请日：1993-12-21

申请人： Richard C. Ruby ,  Paul P. Merchant

发明人： Richard C. Ruby ,  Paul P. Merchant

IPC分类号： H03H3/04 ,  H03H9/02 ,  H03H9/17 ,  H03H9/58 ,  H01L41/08

CPC分类号： H03H9/174 ,  H03H3/04 ,  H03H9/02133 ,  H03H9/02236 ,  H03H9/583 ,  H03H9/588 ,  H03H2009/02181 ,  Y10T29/42

摘要： An acoustical resonator comprising top and bottom electrodes that sandwich a PZ layer. The resonance frequency of the acoustical resonator may be adjusted after fabrication by utilizing heating elements included in the acoustical resonator and/or by adjusting the thickness of a tuning layer. In the preferred embodiment of the present invention, the electrodes comprise Mo layers. One embodiment of the present invention is constructed on a Si.sub.3 N.sub.4 membrane. A second embodiment of the present invention is constructed such that it is suspended over a substrate on metallic columns. In the preferred embodiment of the present invention, the electrodes are deposited by a method that minimizes the stress in the electrodes.

摘要翻译： 包括夹着PZ层的顶部和底部电极的声学谐振器。 可以通过利用声谐振器中包含的加热元件和/或通过调节调谐层的厚度来调整声学谐振器的共振频率。 在本发明的优选实施例中，电极包括Mo层。 本发明的一个实施方案构造在Si 3 N 4膜上。 本发明的第二实施例构造成使得其悬挂在金属柱上的基板上。 在本发明的优选实施例中，通过使电极中的应力最小化的方法来沉积电极。

公开(公告)号：US5467067A

公开(公告)日：1995-11-14

申请号：US212544

申请日：1994-03-14

申请人： Leslie A. Field ,  Richard C. Ruby

发明人： Leslie A. Field ,  Richard C. Ruby

IPC分类号： H01H1/00 ,  H01H61/04 ,  H01P1/10 ,  H01H53/00

CPC分类号： H01H61/04 ,  H01H1/0036 ,  H01P1/10 ,  H01H2061/006

摘要： An integration of a micromachined actuator and a signal transmission structure includes a thermal actuator on a side of a displaceable signal line opposite to a fixed signal line. The actuator includes first and second legs. The first leg has a cross-sectional area greater than the second leg, providing a differential in electrical resistance. As current is channeled through the legs, the second leg will elongate more and will deflect both of the legs. The deflection is in a direction to press the displaceable signal line into signal communication with the fixed signal line. Optionally, a thermally operated reset actuator can be positioned to provide a mechanical return of the displaceable signal line. In a preferred embodiment, a microwave transmission environment is provided.

摘要翻译： 微加工致动器和信号传输结构的集成包括在与固定信号线相对的位移信号线的一侧上的热致动器。 致动器包括第一和第二腿。 第一支腿具有大于第二支腿的横截面积，提供电阻差。 当电流通过腿部引导时，第二条腿将伸长并且将使两条腿偏转。 偏转方向将可移动信号线按压到与固定信号线的信号通信。 可选地，热操作的复位致动器可以被定位成提供可移位信号线的机械返回。 在优选实施例中，提供微波传输环境。

公开(公告)号：US5191236A

公开(公告)日：1993-03-02

申请号：US554228

申请日：1990-07-16

申请人： Richard C. Ruby

发明人： Richard C. Ruby

IPC分类号： G01R23/02 ,  H01L39/22 ,  H03B15/00 ,  H03K17/92

CPC分类号： H03B15/00 ,  Y10S505/854 ,  Y10S505/861

摘要： An electronic clock has a single Josephson junction connected in parallel to a resonant circuit, which is a delay line with a matching resistance at the input end to provide series termination. The opposite end of the delay line is an open end to reflect pulses, and the pulse transit time on the line determines the clock rate. A zero crossing detector is provided to initiate the clock operation when an input signal rises above a given threshold, and a reset circuit is included to turn off the clock when the input signal falls below this threshold. A flip-flop circuit allows the clock to be turned on by alternate initiating signal pulses. A modification includes a pulse rejuvenating circuit at the end of the delay line to offset pulse degradation. All of the circuits are fabricated with Josephson junction elements, and the zero crossing detector, reset circuit, flip-flop circuit and pulse rejuvenator circuits include dc-SQUID's. The clock is capable of operation at frequencies up to 100 GHz and can sample input single frequencies as high as 15 GHz.