公开(公告)号：US20140198422A1

公开(公告)日：2014-07-17

申请号：US13905247

申请日：2013-05-30

Applicant: Kemet Electronics Corporation

Inventor： Lonnie G. Jones ,  John Bultitude ,  Mark R. Laps ,  James R. Magee ,  Jeffrey W. Ball

IPC: H02H7/00

CPC classification number: H02H7/00 ,  H01C1/14 ,  H01C7/12 ,  H01G2/14 ,  H01G4/005 ,  H01G4/30

Abstract: An improved electronic component is described. The electronic component has a capacitor with first planer internal electrodes in electrical contact with a first termination and second planer internal electrodes in electrical contact with a second termination. A dielectric is between the first planer electrodes and the second planer internal electrodes. The electronic component further comprises at least one of: an inductor comprising a conductive trace wherein said conductive trace is between the first termination and a third termination; and an overvoltage protection component comprising: a third internal electrode contained within the dielectric and wherein the third internal electrode is electrically connected to the first termination; a fourth internal electrode contained within the ceramic and electrically connected to a fourth termination; and a gap between the third internal electrode and the fourth internal electrode.

Abstract translation: 描述了改进的电子部件。 电子部件具有电容器，其具有与第一端接电接触的第一平面内部电极和与第二端接电接触的第二平面内部电极。 电介质位于第一平面电极和第二平面内部电极之间。 电子部件还包括以下至少一个：包括导电迹线的电感器，其中所述导电迹线在第一端接和第三端接之间; 以及过电压保护部件，包括：包含在所述电介质内的第三内部电极，并且其中所述第三内部电极电连接到所述第一端子; 第四内部电极，其包含在陶瓷内并电连接到第四端子; 以及第三内部电极和第四内部电极之间的间隙。

公开(公告)号：US20140002952A1

公开(公告)日：2014-01-02

申请号：US13959954

申请日：2013-08-06

Applicant: Kemet Electronics Corporation

Inventor： John E. McConnell ,  Garry L. Renner ,  John Bultitude ,  Allen Hill

IPC: H01G4/228

CPC classification number: H01G4/228 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/38 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

Abstract: A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.

Abstract translation: 提供堆叠的MLCC电容器，其中电容器堆叠包括多层陶瓷电容器，其中每个多层陶瓷电容器包括第一电极和交替堆叠的第二电极，每个第一电极和每个相邻的第二电极之间具有电介质。 第一电极在第一侧和第二电极的第二侧终止。 第一瞬态液相烧结导电层是第一侧并与每个第一电极电接触; 并且第二瞬态液相烧结导电层位于第二侧上并与每个第二电极电接触。

公开(公告)号：US11744018B2

公开(公告)日：2023-08-29

申请号：US17147908

申请日：2021-01-13

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Peter Alexandre Blais ,  James A. Burk ,  Galen W. Miller ,  Hunter Hayes ,  Allen Templeton ,  Lonnie G. Jones ,  Mark R. Laps

IPC: H05K1/18 ,  H01G4/38 ,  H05K1/14 ,  H05K1/02 ,  H05K3/32 ,  H01L29/20 ,  H01G4/30 ,  H01L25/07 ,  H01L29/16

CPC classification number: H05K1/181 ,  H01G4/38 ,  H05K1/0272 ,  H05K1/145 ,  H05K3/328 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

公开(公告)号：US20230187134A1

公开(公告)日：2023-06-15

申请号：US18107154

申请日：2023-02-08

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Nathan A. Reed ,  Allen Templeton ,  James R. Magee ,  James Davis ,  Abhijit Gurav ,  Hunter Hayes

IPC: H01G4/12 ,  H01G4/30 ,  C04B35/50 ,  C04B35/495 ,  C04B35/465 ,  H01G4/40

CPC classification number: H01G4/1245 ,  H01G4/306 ,  C04B35/50 ,  C04B35/495 ,  C04B35/465 ,  H01G4/1227 ,  H01G4/30 ,  H01G4/40 ,  C04B2235/66

Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.

公开(公告)号：US20210227693A1

公开(公告)日：2021-07-22

申请号：US17147908

申请日：2021-01-13

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Peter Alexandre Blais ,  James A. Burk ,  Galen W. Miller ,  Hunter Hayes ,  Allen Templeton ,  Lonnie G. Jones ,  Mark R. Laps

IPC: H05K1/18 ,  H01G4/38 ,  H05K1/14 ,  H05K1/02 ,  H05K3/32

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

公开(公告)号：US10757811B2

公开(公告)日：2020-08-25

申请号：US16212156

申请日：2018-12-06

Applicant: KEMET Electronics Corporation

Inventor： James A. Burk ,  John Bultitude ,  Galen W. Miller

IPC: H05K3/00 ,  H05K1/18 ,  H01G4/30 ,  H03H7/01 ,  H05K1/02 ,  H05K3/30 ,  H01G4/228 ,  H01G4/232 ,  H01G4/38 ,  H05K3/34

Abstract: A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.

公开(公告)号：US10729051B2

公开(公告)日：2020-07-28

申请号：US15187451

申请日：2016-06-20

Applicant: KEMET Electronics Corporation

Inventor： John E. McConnell ,  John Bultitude

IPC: H05K13/04 ,  H05K3/30 ,  H05K7/12 ,  H01G4/232 ,  H01C1/01 ,  H01G2/06 ,  H01C13/02 ,  H01G4/38 ,  H01C1/14 ,  H05K3/34 ,  H05K1/02 ,  H01G4/30 ,  H01C7/00

Abstract: An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

公开(公告)号：US20200219657A1

公开(公告)日：2020-07-09

申请号：US16825069

申请日：2020-03-20

Applicant: KEMET Electronics Corporation

Inventor： Iain D. Kinnon ,  John Bultitude ,  Lonnie G. Jones

IPC: H01G4/40 ,  H01T4/10

Abstract: Provided is an improved overvoltage protection element. The overvoltage protection devices comprises at least one ESD protection couple comprising discharge electrodes in a plane, a gap insulator between the discharge electrodes, an overvoltage protection element parallel to the planar discharge electrodes wherein the overvoltage protection element comprises a conductor and an secondary material. The overvoltage protection element also comprises a primary insulator layer between the discharge electrodes and overvoltage protection element.

公开(公告)号：US10707145B2

公开(公告)日：2020-07-07

申请号：US15804515

申请日：2017-11-06

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Galen Miller ,  John E. McConnell

IPC: H01L23/00 ,  H01L23/40 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

公开(公告)号：US20190355523A1

公开(公告)日：2019-11-21

申请号：US16526628

申请日：2019-07-30

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude

IPC: H01G4/33 ,  H01G4/005 ,  H01G4/12 ,  H01G4/008 ,  H01G4/30 ,  H01G4/002 ,  H01G4/248 ,  H01G4/232 ,  H01G4/012

Abstract: An improved multilayer ceramic capacitor is described. The multilayered ceramic capacitor comprises first internal electrodes and second internal electrodes. The first internal electrodes and said second internal electrodes are parallel with dielectric there between. A first external termination is in electrical connection with the first internal electrodes and a second external termination is in electrical contact with the second internal electrodes. A closed void layer, comprising at least one closed void, is between electrodes.