摘要:
A top-side cooled compact semiconductor package with integrated bypass capacitor is disclosed. The top-side cooled compact semiconductor package includes a circuit substrate with terminal leads, numerous semiconductor dies bonded atop the circuit substrate, numerous elevation-adaptive interconnection plates for bonding and interconnecting top contact areas of the semiconductor dies with the circuit substrate, a first member of the elevation-adaptive interconnection plates has a first flat-top area and a second member of the elevation-adaptive interconnection plates has a second flat-top area in level with the first flat-top area, a bypass capacitor, having two capacitor terminals located at its ends, stacked atop the two interconnection plate members while being bonded thereto via the first flat-top area and the second flat-top area for a reduced interconnection parasitic impedance.
摘要:
This disclosure related to a heater. The heater includes a heating element and at least two electrodes connected to the heating element. The heating element includes a carbon nanotube composite structure. The carbon nanotube composite structure includes a matrix and at least one carbon nanotube structure. The at least one carbon nanotube structure includes a plurality of carbon nanotubes joined by van der Waals attractive force therebetween to obtain a free-standing carbon nanotube structure.
摘要:
An apparatus includes a hollow heater. The hollow heater has a hollow supporter, a heating element and at least two electrodes. The at least two electrodes are separately and electrically connected to the heating element. The hollow supporter defines a hollow space, the hollow supporter has an inner surface and an outer surface. The heating element disposed on one of the surfaces of the hollow supporter. The heating element includes a carbon nanotube structure. The carbon nanotube structure includes a plurality of carbon nanotubes combined by wan der Waals attractive force.
摘要:
A coil structure for a filter device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil. A portion of the second coil is oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A portion of the third coil is oriented interiorly of the second coil.
摘要:
An apparatus for making an array of carbon nanotubes includes a reaction chamber with a gas inlet and a gas outlet; a quartz boat disposed in the reaction chamber; a substrate with a surface deposited with a film of first catalyst, the substrate being disposed in the quartz boat; and a second catalyst disposed in the quartz beside the substrate. A method for making an array of carbon nanotubes, comprising the steps of: (a) providing a substrate with a surface deposited with a film of first catalyst; (b) disposing a second catalyst beside the substrate to produce small amounts of hydrogen gas which flows to the first catalyst; (c) introducing a carrier gas and a carbon source gas flowing from the second catalyst to the first catalyst at a predetermined temperature; and (d) growing an array of carbon nanotubes extending from the substrate.
摘要:
A clip for a semiconductor device package may include a metal sheet including an array of windows and one or more conductive fingers. Each of the conductive fingers has a first end and a second end. The first end is electrically connected to the metal sheet at one of the windows. Each of the conductive fingers is adapted to provide electrical connection to a top semiconductor region of a semiconductor device or a lead frame at the second end.
摘要:
Rather than have a unique code set per TV product, a common code base is provided to service multiple products and even multiple product lines. Embedded systems can be upgraded through a network connection. The software architecture provides a flexible approach to supporting multiple product offerings through a plug-in modular middle-ware and to providing standardized hardware acceleration for both 2D and 3D graphics. The plug-in capability provides for feature additions and upgrades after sale.
摘要:
A semiconductor device has an inductor and capacitor formed on the substrate. The inductor and capacitor are electrically connected in series. The inductor is a coiled conductive layer. The capacitor has first and second conductive layers separated by an insulating layer. A first test pad and second test pad are formed on the substrate. A terminal of the inductor is coupled to the first and second test pads. A third test pad and fourth test pad are formed on the substrate. A terminal of the capacitor is coupled to the third and fourth test pads such that the inductor and capacitor are connected in shunt between the first and second test pads and the third and fourth test pads. An electrical characteristic of the inductor and capacitor such that resonant frequency and quality factor are tested using a two-port shunt measurement which negates series resistance of test probes.
摘要:
An apparatus includes a hollow heater. The hollow heater has a hollow supporter, a heating element and at least two electrodes. The at least two electrodes are separately and electrically connected to the heating element. The hollow supporter defines a hollow space, the hollow supporter has an inner surface and an outer surface. The heating element disposed on one of the surfaces of the hollow supporter. The heating element includes a carbon nanotube film. The carbon nanotube film is made of a plurality of carbon nanotubes entangled with each other.
摘要:
A method for making a hollow heater is provided. The method includes providing a hollow supporter and, the hollow supporter defines a hollow space. A carbon nanotube structure is made and then fixed on a surface of the hollow supporter. A first electrode and a second electrode is provided and electrically connected to the carbon nanotube structure.