Abstract:
Provided are an adhesive film, an organic electronic device (OED) encapsulation product using the same, and a method of encapsulating the organic electronic device, and more particularly, an adhesive film for encapsulating an organic electronic element including a first adhesive layer having a loss coefficient (tan δ) at 60 to 100° C. of 1 to 5, and a second adhesive layer formed on the first adhesive layer, and a method of encapsulating an organic electronic device using the same.
Abstract:
Provided are a base film, a laminate, and a method of forming a polarizing film. Particularly, a base film which may effectively form a polarizing film having a thickness of approximately 10, 8, 7, 6, or 5 μm or less and exhibiting excellent functions such as polarizing performance, a laminate, and a method of forming the same are provided. Therefore, a polarizing film may be formed by preventing tearing or curling during an elongation process, and easily elongating a polarizing material such as a polyvinylalcohol-based resin.
Abstract:
The present invention relates to swelling tape for filling a gap and its use. The swelling tape is, for example, applied between gaps in which a fluid is present, thereby being deformed into a three-dimensional shape to fill the gap and fix an object separated by gaps as needed.
Abstract:
There is provided a preparation method for a porous pressure sensitive adhesive article, a porous pressure sensitive adhesive article, and an abrasive pad. According to an example of the present application, as a porous pressure sensitive adhesive article including a pressure sensitive adhesive layer formed on a porous article, an article having excellent resistance to an external shear strength and to peeling can be provided. Further, according to the above method, the porous article can be attached firmly to a large-area adherent. In an example, the porous article may be an abrasive pad.
Abstract:
There is provided a pressure sensitive adhesive composition and a pressure sensitive adhesive. A pressure sensitive adhesive composition example of the present application can provide a pressure sensitive adhesive having, for example, a high shear resistance together with an excellent peeling property or tacking property with respect to an attachment target surface.
Abstract:
An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.