公开(公告)号：US20050210993A1

公开(公告)日：2005-09-29

申请号：US11079475

申请日：2005-03-15

申请人： Inao Toyoda ,  Hiroaki Tanaka ,  Ichiharu Kondo ,  Makoto Totani

发明人： Inao Toyoda ,  Hiroaki Tanaka ,  Ichiharu Kondo ,  Makoto Totani

IPC分类号： B60C23/00 ,  B60C23/04 ,  G01L9/00 ,  G01L9/06 ,  G01L17/00 ,  G01L19/06 ,  G01L19/14 ,  G01L23/24

CPC分类号： B60C23/0408 ,  G01L9/0055 ,  G01L19/0069 ,  G01L19/0627 ,  G01L19/147 ,  G01L23/24

摘要： A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.

摘要翻译： 压力传感器主要包括传感器芯片，电路芯片和基板。 传感器芯片被配置为产生代表正在感测的压力的电信号，并且包括感测区域和多个接触焊盘。 电路芯片包括被配置为处理电信号的电路和多个接触焊盘。 基板包括在树脂片内具有开口和多个导体的树脂片。 基片连接到传感器芯片和电路芯片上，以使传感器芯片的感测区域暴露于通过树脂片的开口感测的压力，传感器芯片和电路芯片的接触垫电气 连接到基板的导体，并且所有接触焊盘和导体都气密地嵌入在基板的树脂片中。

公开(公告)号：US20050205950A1

公开(公告)日：2005-09-22

申请号：US11081525

申请日：2005-03-17

申请人： Ichiharu Kondo ,  Hiroaki Tanaka ,  Inao Toyoda ,  Makoto Totani

发明人： Ichiharu Kondo ,  Hiroaki Tanaka ,  Inao Toyoda ,  Makoto Totani

IPC分类号： G01L9/00 ,  G01L19/06 ,  H01L29/84

CPC分类号： G01L9/0054 ,  G01L19/148

摘要： A pressure sensor includes a sensor chip and a circuit chip. The sensor chip, which is configured to generate an electrical signal representative of a pressure being sensed, has a surface including a sensing area and a plurality of electrical contact pads disposed on the surface. The circuit chip includes a circuit configured to process the electrical signal and has a surface on which a plurality of electrical contact pads of the circuit chip are disposed. The circuit chip is joined to the sensor chip so that the electrical contact pads of the circuit chip are respectively electrically connected to those of the sensor chip, all the electrical contact pads of the circuit chip and the sensor chip are hermetically sealed and isolated from the fluid, and the surfaces of the circuit chip and the sensor chip face each other with the electrical contact pads of the same interposed therebetween.

摘要翻译： 压力传感器包括传感器芯片和电路芯片。 被配置为产生代表被感测的压力的电信号的传感器芯片具有包括感测区域和设置在表面上的多个电接触焊盘的表面。 电路芯片包括被配置为处理电信号并且具有设置电路芯片的多个电接触焊盘的表面的电路。 电路芯片连接到传感器芯片，使得电路芯片的电接触焊盘分别电连接到传感器芯片的电接触焊盘，电路芯片和传感器芯片的所有电接触焊盘都被密封和隔离 流体，并且电路芯片和传感器芯片的表面彼此面对，并且其间具有相同的电接触焊盘。

公开(公告)号：US20050182540A1

公开(公告)日：2005-08-18

申请号：US11033481

申请日：2005-01-12

申请人： Makiko Sugiura ,  Inao Toyoda

发明人： Makiko Sugiura ,  Inao Toyoda

IPC分类号： G01V11/00 ,  B60R21/00 ,  B60R21/01 ,  B60R21/0136 ,  B60R21/16 ,  B60R21/34 ,  G01J1/02 ,  G01J5/10 ,  G05D1/00

CPC分类号： B60R21/0134 ,  B60R21/0136

摘要： A pedestrian detection device, a related method, an air bag system and a vehicle are disclosed. The pedestrian detection device 20 includes an infrared ray sensor 30A, which detects a temperature of a detection object approaching to or in contact with the vehicle 10 to provide a temperature signal, an impact sensor 27a to 27c, which generate impact signals when the vehicle encounters a collision, and an impact collision generation unit 21 operative to generate a pedestrian collision signal upon discrimination that the detection object is a pedestrian, discrimination that the impact signal is being outputted, and discrimination that a direction in which the pedestrian is present and a direction in which the impact is applied to the vehicle falls in a substantially same direction.

摘要翻译： 公开了一种行人检测装置，相关方法，气囊系统和车辆。 行人检测装置20包括红外线传感器30A，其检测接近或与车辆10接触的检测对象的温度以提供温度信号;冲击传感器27a至27c，其产生冲击信号， 车辆遇到碰撞，冲击碰撞产生单元21，在判断为检测对象是行人时产生行人碰撞信号，辨别出影响信号被输出，以及判断行人存在的方向 并且对车辆施加冲击的方向落在基本相同的方向上。

公开(公告)号：US20050034526A1

公开(公告)日：2005-02-17

申请号：US10950561

申请日：2004-09-28

申请人： Keiji Shinyama ,  Yositugu Abe ,  Hiroaki Tanaka ,  Inao Toyoda ,  Yoshifumi Watanabe ,  Ichiharu Kondo

发明人： Keiji Shinyama ,  Yositugu Abe ,  Hiroaki Tanaka ,  Inao Toyoda ,  Yoshifumi Watanabe ,  Ichiharu Kondo

IPC分类号： C23C18/16 ,  C23C18/34 ,  C23C18/42 ,  G01F1/34 ,  G01F1/692 ,  G01F15/00 ,  G01L9/00 ,  H01L23/485 ,  H01L21/66

CPC分类号： G01L19/147 ,  B81B7/0012 ,  B81B2207/07 ,  G01F1/34 ,  G01F1/692 ,  G01F15/006 ,  G01L19/0645 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05558 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48475 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48799 ,  H01L2224/48844 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/8592 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： A method of plating a semiconductor wafer while maintaining a uniform thickness of the plated film, preventing the precipitation on the back surface of the wafer and preventing the contamination in the subsequent steps. In directly forming connection terminals on the aluminum electrodes on the semiconductor wafer, the non-electrolytic plating is effected in a state where the back surface of the wafer is covered with an insulator. The insulator is preferably a glass substrate which is a part constituting the product. A semiconductor type sensor exhibits improved corrosion resistance against a corrosive medium. The semiconductor type sensor has, in a semiconductor substrate, a structural portion for detecting the physical quantity or the chemical component of a corrosive medium and an electric quantity conversion element, and has pads which are the output terminals for sending the detected electric signals to an external unit, wherein the pads are protected by a precious metal.

摘要翻译： 同时保持电镀膜厚度均匀的方法来镀覆半导体晶片，防止晶片的背面沉淀，防止后续步骤的污染。 在半导体晶片上的铝电极上直接形成连接端子时，非电解电镀是在晶片的背面被绝缘体覆盖的状态下进行的。 绝缘体优选为构成产品的部分的玻璃基板。 半导体型传感器对腐蚀性介质表现出改善的耐腐蚀性。 半导体型传感器在半导体基板中具有用于检测腐蚀介质的物理量或化学成分的结构部分和电量转换元件，并且具有作为输出端子的焊盘，用于将检测到的电信号发送到 外部单元，其中垫被贵金属保护。

公开(公告)号：US06647782B2

公开(公告)日：2003-11-18

申请号：US10194305

申请日：2002-07-15

申请人： Inao Toyoda

发明人： Inao Toyoda

IPC分类号： G01N2722

CPC分类号： G01N27/225

摘要： A humidity sensor has two detection electrodes located on a semiconductor substrate and a humidity sensitive film. The capacitance of the film changes in response to humidity. The sensor includes a reference capacitor and a feedback capacitor. An electrode of each capacitor is located beneath one of the detection electrodes to limit the size of the device.

摘要翻译： 湿度传感器具有位于半导体衬底和湿度敏感膜上的两个检测电极。 膜的电容随湿度而变化。 传感器包括参考电容和反馈电容。 每个电容器的电极位于一个检测电极下方以限制器件的尺寸。

公开(公告)号：US06628501B2

公开(公告)日：2003-09-30

申请号：US10151009

申请日：2002-05-21

申请人： Inao Toyoda

发明人： Inao Toyoda

IPC分类号： H01G406

CPC分类号： G01N27/225

摘要： A capacitive moisture sensor includes a semiconductor substrate, which has a hole. A silicon oxide film is located to close the hole. A pair of electrodes is located on the silicon oxide film. Each electrode is in the shape of a comb, and the electrodes mesh with each other. A silicon nitride film is located on the electrodes to cover and protect the electrodes and on the silicon oxide film between the electrodes. A moisture-sensitive film, the dielectric constant of which varies in response to ambient moisture, is located on the silicon nitride film. The thickness of the substrate is substantially zero under the electrodes to eliminate the parasitic capacitance between each electrode and the substrate.

摘要翻译： 电容式湿度传感器包括具有孔的半导体衬底。 定位氧化硅膜以封闭孔。 一对电极位于氧化硅膜上。 每个电极是梳子的形状，并且电极彼此啮合。 氮化硅膜位于电极上，以覆盖和保护电极和电极之间的氧化硅膜。 其湿度敏感膜的介电常数根据环境湿度而变化，位于氮化硅膜上。 基板的厚度在电极下基本为零，以消除每个电极和基板之间的寄生电容。

公开(公告)号：US06579740B2

公开(公告)日：2003-06-17

申请号：US09960360

申请日：2001-09-24

申请人： Inao Toyoda

发明人： Inao Toyoda

IPC分类号： H01L2100

CPC分类号： H01L31/108

摘要： In a thin-film infrared sensor, (100)-oriented semiconductor substrate is used for the sensor fabrication. A surface of the substrate is partially masked to provide an unmasked section where a concave is made and a masked section on the back side of an alley between thin-film sensing areas. An anisotropic etching using an etchant such as KOH is applied to the masked substrate to make the concave (the thin-film sensing areas) and to provide an unetched portion of the substrate at the bottom of the concave on the back side of the alley between the sensing areas. The unetched portion of the substrate makes a rim to support the sensing areas. High concentration Boron doping is not necessary. Thus, it is possible to reduce deformation of thin-film sensing areas caused by a stress in the rim and to reinforce the rim.

摘要翻译： 在薄膜红外传感器中，（100）取向半导体衬底用于传感器制造。 基板的表面部分地被掩蔽，以提供制造凹部的未掩模部分和在薄膜感测区域之间的胡同后侧的掩蔽部分。 使用诸如KOH的蚀刻剂的各向异性蚀刻被施加到被掩蔽的基板上以形成凹部（薄膜感测区域），并且在凹槽的背面的凹部的底部提供基底的未蚀刻部分， 感应区域。 衬底的未蚀刻部分形成边缘以支撑感测区域。 高浓度硼掺杂是不必要的。 因此，可以减小由于边缘中的应力引起的薄膜感测区域的变形并加强边缘。

公开(公告)号：US06462328B2

公开(公告)日：2002-10-08

申请号：US09920720

申请日：2001-08-03

申请人： Inao Toyoda

发明人： Inao Toyoda

IPC分类号： H01J4014

CPC分类号： H01L27/1443

摘要： In a sensor chip for forming the light receiving elements of a photo-detection sensor, p-type regions of the photodiodes are formed in a surface portion of an n-type epitaxial layer, and they are respectively contacted with electrodes. A deep n+-region is formed in the part of the n-type epitaxial layer between the adjacent p-type regions so as to reach a buried n+-region. Carriers created with the projection of light in the photodiodes are trapped by the deep n+-region (30). An aluminum film serving as a light shielding film is arranged over the part of a silicon substrate between the regions for forming the photodiodes. Thus, the photodiodes can be operated independently from each other.

公开(公告)号：US08028584B2

公开(公告)日：2011-10-04

申请号：US12219785

申请日：2008-07-29

申请人： Kiyoshi Otsuka ,  Yasuaki Makino ,  Tsuyoshi Fukada ,  Inao Toyoda ,  Naoki Kakoiyama

发明人： Kiyoshi Otsuka ,  Yasuaki Makino ,  Tsuyoshi Fukada ,  Inao Toyoda ,  Naoki Kakoiyama

IPC分类号： G01L7/00

CPC分类号： G01L19/0092 ,  G01L19/0069 ,  G01L19/0084 ,  G01L19/141 ,  G01L19/143 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

摘要： A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.

摘要翻译： 压力传感器包括：具有压力引入口的壳体; 以及与壳体一体化的连接器壳体。 连接器壳体包括：突出部，其从连接器壳体的一端沿着引入方向在压力引入口中突出，并且具有沿与引入方向垂直的方向中空的凹部; 传感器芯片，其在所述凹部中在所述芯片的一个表面上具有压力计; 端子，其一端插入并模制在连接器壳体中; 以及将传感器芯片和端子的一端电连接的接合线。 连接器壳体密封接合线和端子之间的连接部分，在编织线和传感器芯片之间的连接部分以及接合线。

公开(公告)号：US07536916B2

公开(公告)日：2009-05-26

申请号：US11898519

申请日：2007-09-13

申请人： Hiroshige Matsui ,  Inao Toyoda ,  Hisayuki Takeuchi

发明人： Hiroshige Matsui ,  Inao Toyoda ,  Hisayuki Takeuchi

IPC分类号： G01L9/00

CPC分类号： G01L19/04 ,  G01L19/0645 ,  G01L23/18

摘要： The pressure sensor of the type having a pressure transmitting member transmitting a pressure received by a pressure-receiving diaphragm to a sensor chip is provided with a heat radiating member. This heat radiating member substantially suppresses the heat transferring from the pressure-receiving diaphragm to the sensor chip, to thereby preventing the pressure sensor from malfunction.

摘要翻译： 具有将由受压隔膜接受的压力传递到传感器芯片的压力传递部件的类型的压力传感器设置有散热构件。 该散热构件基本上抑制从受压隔膜向传感器芯片的传热，从而防止压力传感器发生故障。