公开(公告)号：US20050133061A1

公开(公告)日：2005-06-23

申请号：US10816337

申请日：2004-03-31

申请人： John de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

发明人： John de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

IPC分类号： B08B3/00 ,  H01L21/00 ,  B08B1/02

CPC分类号： B08B3/003 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate. The open region extends over the length of the brush enclosure and enables foam from within the brush enclosure to contact the surface of the substrate. A substrate cleaning system and method for cleaning a substrate are also described.

摘要翻译： 用于处理衬底的装置包括在一定长度上延伸的刷子外壳。 电刷外壳被配置为设置在基板的表面上方，并且具有被配置为设置在基板附近的开放区域。 开放区域在刷子外壳的长度上延伸，并使来自刷子外壳内的泡沫能够接触基板的表面。 还描述了用于清洁衬底的衬底清洁系统和方法。

公开(公告)号：US06894491B2

公开(公告)日：2005-05-17

申请号：US10328884

申请日：2002-12-23

申请人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

发明人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

IPC分类号： H01L21/66 ,  G01B7/06 ,  G01R33/12

CPC分类号： H01L22/26

摘要： A method for detecting a thickness of a layer of a wafer is provided. The method includes defining a particular radius of a wafer carrier configured to engage the wafer to be processed. The method also includes providing a plurality of sensors configured to create a set of complementary sensors. Further included in the method is distributing the plurality of sensors along the particular radius within the wafer carrier such that each sensor of the plurality of sensors is out of phase with an adjacent sensor by a same angle. The method also includes measuring signals generated by the plurality of sensors. Further included is averaging the signals generated by the plurality of sensors so as to generate a combination signal. The averaging is configured to remove noise from the combination signal such that the combination signal is capable of being correlated to identify the thickness of the layer.

摘要翻译： 提供了一种用于检测晶片层的厚度的方法。 该方法包括限定配置成接合要处理的晶片的晶片载体的特定半径。 该方法还包括提供配置成创建一组互补传感器的多个传感器。 该方法还包括沿着晶片载体内的特定半径分布多个传感器，使得多个传感器中的每个传感器与相邻的传感器相位相同角度。 该方法还包括测量由多个传感器产生的信号。 还包括对由多个传感器产生的信号进行平均以产生组合信号。 平均化被配置为从组合信号去除噪声，使得组合信号能够被相关联以识别层的厚度。

公开(公告)号：US06808590B1

公开(公告)日：2004-10-26

申请号：US10186932

申请日：2002-06-28

申请人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

发明人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

IPC分类号： H01L21302

CPC分类号： G01B7/105 ,  G01B7/107 ,  G01B2210/44

摘要： A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded in the wafer carrier. The sensor is configured to induce an eddy current in the wafer to determine a proximity and a thickness of the wafer. A sensor array external to the CMP tool is included. The sensor array is in communication with the sensor embedded in the wafer carrier and substantially eliminates a distance sensitivity. The sensor array provides an initial thickness of the wafer to allow for a calibration to be performed on the sensor embedded in the wafer carrier. The calibration offsets variables causing inaccuracies in the determination of the thickness of the wafer during CMP operation. A method and an apparatus are also provided.

摘要翻译： 提供了一种用于处理晶片的系统。 该系统包括化学机械平面化（CMP）工具。 CMP工具包括限定在壳体内的晶片载体。 载体膜固定到底表面并支撑晶片。 嵌入晶片载体的传感器。 传感器被配置为在晶片中感应涡流以确定晶片的接近度和厚度。 包括CMP工具外部的传感器阵列。 传感器阵列与嵌入在晶片载体中的传感器连通，并且基本上消除了距离灵敏度。 传感器阵列提供晶片的初始厚度，以允许对嵌入在晶片载体中的传感器进行校准。 校准偏移了在CMP操作期间确定晶片厚度的不准确性的变量。 还提供了一种方法和装置。

公开(公告)号：US6098641A

公开(公告)日：2000-08-08

申请号：US897914

申请日：1997-07-21

申请人： Aleksander Owczarz

发明人： Aleksander Owczarz

IPC分类号： B08B11/00 ,  B08B3/02 ,  B08B11/02 ,  F16F1/38 ,  F16F15/00 ,  F16F15/02 ,  F16F15/08 ,  H01L21/00 ,  H01L21/304 ,  H01L21/67 ,  H02K5/124 ,  H02K5/24 ,  B08B13/00

CPC分类号： H01L21/67051 ,  B08B11/02 ,  B08B3/02 ,  F16F1/38 ,  F16F15/02 ,  F16F15/08 ,  H01L21/67 ,  H02K5/124 ,  H02K5/24 ,  Y10S134/902

摘要： An apparatus for processing a semiconductor wafer is set forth. The apparatus comprises a processing bowl that defines a processing chamber. The processing bowl is in fixed alignment with a frame. A wafer support structure adapted to support at least one wafer is mounted for rotation within the processing chamber. A motor drive assembly is disposed exterior to the processing chamber and connected to rotate the wafer support. The motor drive assembly includes an electrically driven motor and at least one shock absorbing member connected between the electrically driven motor and the frame. The electrically driven motor preferably includes a rotor shaft that rotates about an axis of rotation. The shock absorbing member is adapted to elastically deform in substantially all directions perpendicular to the axis of rotation of the rotor shaft in response to vibrational forces having components perpendicular to the axis of rotation and, to a lesser degree, in directions parallel to the axis of rotation of the rotating shaft in response to vibrational forces having components parallel to the axis of rotation. In accordance with a further, independently unique aspect of the present invention, an aggressive seal is provided to prevent materials, such as processing fluids, from entering the motor in the region of the motor rotor. To this end, expulsion threads are provided at an end of the rotor shaft of the motor. A member substantially surrounds the expulsion threads at the end of the rotor. Together, the member defines a chamber with the rotor. Rotation of the rotor and threads assist in preventing foreign materials from entering the motor.

公开(公告)号：US5575641A

公开(公告)日：1996-11-19

申请号：US509704

申请日：1995-07-31

申请人： Aleksander Owczarz ,  Ronald J. Ray ,  Daniel L. Durado

发明人： Aleksander Owczarz ,  Ronald J. Ray ,  Daniel L. Durado

IPC分类号： H01L21/00 ,  H01L21/677 ,  F27D3/00

CPC分类号： H01L21/67126 ,  H01L21/67772

摘要： A semiconductor processor including an enclosure with an access opening. A door assembly is supported for translational movement between aligned and displaced positions relative to the access opening. The door assembly has a main part, and an extension part which telescopically moves toward and away from the access opening. A bellows is provided between the main and extension parts. The closed door is sealed by a first face seal and a second expandable seal. A liquids trap is provided to prevent outward escape of liquids from the access opening. A drain removes liquid collected in the trap.

公开(公告)号：US5224841A

公开(公告)日：1993-07-06

申请号：US874333

申请日：1992-04-24

申请人： Raymon E. Thompson ,  Karl Martin ,  Aleksander Owczarz

发明人： Raymon E. Thompson ,  Karl Martin ,  Aleksander Owczarz

IPC分类号： F04B9/117 ,  F04B43/113 ,  F04B53/10

CPC分类号： F04B9/1174 ,  F04B43/1136 ,  F04B53/1022

摘要： A low contamination double bellows pump suitable for providing relatively constant pressure and delivery. The illustrated pump includes two pumping chambers with bellows arranged in opposed relationship on opposite sides of a central section. The central section acts as a valve body for inlet and outlet valves. The bellows are provided with interior bellows tubes which connect to the free ends of the bellows and slide upon stationary support pistons mounted within each tube. Bellows tube head pieces slide upon piston rods which support the pistons. Pneumatic pressure is controllably supplied to opposing sides of the pistons within the bellows tubes to power the bellows and effect pumping.

摘要翻译： 低污染双波纹管泵适用于提供相对恒定的压力和输送。 示出的泵包括两个泵送室，其中波纹管以相对的关系布置在中心部分的相对侧上。 中心部分用作入口和出口阀的阀体。 波纹管设有内部波纹管，其连接到波纹管的自由端并在安装在每个管内的固定支撑活塞上滑动。 波纹管管头部件在支撑活塞的活塞杆上滑动。 气动压力可控地供应到波纹管内的活塞的相对侧面，以对波纹管供电并实现泵送。

公开(公告)号：US08314027B2

公开(公告)日：2012-11-20

申请号：US13284709

申请日：2011-10-28

申请人： William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Yezdi Dordi ,  John Parks ,  Tiruchirapalli Arunagiri ,  Aleksander Owczarz ,  Todd Balisky ,  Clint Thomas ,  Jacob Wylie ,  Alan M. Schoepp

发明人： William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Yezdi Dordi ,  John Parks ,  Tiruchirapalli Arunagiri ,  Aleksander Owczarz ,  Todd Balisky ,  Clint Thomas ,  Jacob Wylie ,  Alan M. Schoepp

IPC分类号： H01L21/30 ,  C25D1/00

CPC分类号： H01L21/288 ,  C23C18/1619 ,  C23C18/1632 ,  H01L21/76873

摘要： A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).

摘要翻译： 公开了一种用于晶片无电镀的干/干输出系统。 该系统包括用于晶片入口/出口和干燥操作的上部区域。 靠近头部设置在上部区域以执行干燥操作。 该系统还包括用于无电镀操作的下部区域。 下部区域包括通过流体上升流法实现晶片浸没的化学镀设备。 系统的上部和下部区域由双壁室围住，其中内壁是化学惰性塑料，外壁是结构金属。 系统与流体处理系统接口，为系统提供必要的化学物质供应和控制。 系统是环境控制的。 此外，系统与环境受控的托管传输模块（MTM）接口。

公开(公告)号：US07542134B2

公开(公告)日：2009-06-02

申请号：US12131909

申请日：2008-06-02

申请人： Aleksander Owczarz ,  Jaroslaw W. Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred C. Redeker ,  Erik Edelberg

发明人： Aleksander Owczarz ,  Jaroslaw W. Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred C. Redeker ,  Erik Edelberg

IPC分类号： G01N21/00

CPC分类号： G01N21/9501 ,  G01N2021/8822

摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.

摘要翻译： 用于检查基板的系统包括照相机和光源。 相机朝向视场。 该视场包括该基板的第一表面的至少第一部分。 光源相对于衬底的第一表面以第一角度β朝向视场定向。 也包括检查基板的方法。

公开(公告)号：US20080273195A1

公开(公告)日：2008-11-06

申请号：US12131909

申请日：2008-06-02

申请人： Aleksander Owczarz ,  Jaroslaw W. Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred C. Redeker ,  Erik Edelberg

发明人： Aleksander Owczarz ,  Jaroslaw W. Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred C. Redeker ,  Erik Edelberg

IPC分类号： G01N21/00 ,  H01L21/66

CPC分类号： G01N21/9501 ,  G01N2021/8822

摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.

摘要翻译： 用于检查基板的系统包括照相机和光源。 相机朝向视场。 该视场包括该基板的第一表面的至少第一部分。 光源相对于衬底的第一表面以第一角度β朝向视场定向。 也包括检查基板的方法。

公开(公告)号：US20080254225A1

公开(公告)日：2008-10-16

申请号：US11735987

申请日：2007-04-16

申请人： William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Yezdi Dordi ,  John Parks ,  Tiruchirapalli Arunagiri ,  Aleksander Owczarz ,  Todd Balisky ,  Clint Thomas ,  Jacob Wylie

发明人： William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Yezdi Dordi ,  John Parks ,  Tiruchirapalli Arunagiri ,  Aleksander Owczarz ,  Todd Balisky ,  Clint Thomas ,  Jacob Wylie

IPC分类号： B05D1/18 ,  B05C13/00

CPC分类号： H01L21/02104 ,  C23C18/1619 ,  H01L21/67005 ,  H01L21/6715

摘要： A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen.

摘要翻译： 半导体晶片化学镀设备包括压板和流体碗。 压板具有限定为支撑晶片的顶表面和从顶表面的周边向下延伸到压板的下表面的外表面。 流体碗具有由内表面限定的内部容积，以便在内部容积内容纳压板和要支撑在其上的晶片。 密封件设置在流体碗的内表面周围，以便当接合在流体碗的内表面和压板的外表面之间时形成液密屏障。 多个流体分配喷嘴被定位成在密封件上方的流体碗内分配电镀溶液，以便在压板上升起并流动，从而当存在于压板上时流过晶片。