公开(公告)号：US20060245629A1

公开(公告)日：2006-11-02

申请号：US11412286

申请日：2006-04-27

申请人： Zhimin Huo ,  Hui Wang ,  Xu Liu

发明人： Zhimin Huo ,  Hui Wang ,  Xu Liu

IPC分类号： G06K9/00

CPC分类号： G06T7/60 ,  G06T7/0012 ,  G06T2207/10096 ,  G06T2207/20036 ,  G06T2207/30068

摘要： A method for detecting and analyzing candidate lesions in a magnetic resonance image of a breast. The method includes the steps of: accessing a plurality of temporal magnetic resonance images of the breast; identifying candidate lesions by performing a temporal pattern analysis of the plurality of images to produce temporal features based on an uptake phase and a washout phase; performing a morphological operation on the candidate lesions to produce morphological features; and classifying the candidate lesions using the morphological features and temporal features to produce classified candidate lesions.

摘要翻译： 一种用于检测和分析乳房的磁共振图像中的候选病变的方法。 该方法包括以下步骤：访问乳房的多个时间磁共振图像; 通过执行所述多个图像的时间模式分析来识别候选病变，以基于摄取阶段和冲洗阶段产生时间特征; 对候选病变进行形态学运算以产生形态特征; 并使用形态特征和时间特征对候选病变进行分类以产生分类的候选病变。

公开(公告)号：US20060227917A1

公开(公告)日：2006-10-12

申请号：US11446144

申请日：2006-06-05

申请人： Aaron Buchwald ,  Michael Le ,  Josephus Van Engelen ,  Xicheng Jiang ,  Hui Wang ,  Howard Baumer ,  Avanindra Madisetti

发明人： Aaron Buchwald ,  Michael Le ,  Josephus Van Engelen ,  Xicheng Jiang ,  Hui Wang ,  Howard Baumer ,  Avanindra Madisetti

IPC分类号： H04L7/00

CPC分类号： H04L25/03885 ,  H03L7/07 ,  H03L7/0814 ,  H03L7/091 ,  H04L7/0025 ,  H04L7/0274 ,  H04L7/0337 ,  H04L25/03006 ,  H04L2025/03477 ,  H04L2025/03617

摘要： A high-speed serial data transceiver includes multiple receivers and transmitters for receiving and transmitting multiple analog, serial data signals at multi-gigabit-per-second data rates. Each receiver includes a timing recovery system for tracking a phase and a frequency of the serial data signal associated with the receiver. The timing recovery system includes a phase interpolator responsive to phase control signals and a set of reference signals having different predetermined phases. The phase interpolator derives a sampling signal, having an interpolated phase, to sample the serial data signal. The timing recovery system in each receiver independently phase-aligns and frequency synchronizes the sampling signal to the serial data signal associated with the receiver. A receiver can include multiple paths for sampling a received, serial data signal in accordance with multiple time-staggered sampling signals, each having an interpolated phase.

公开(公告)号：US20060221353A9

公开(公告)日：2006-10-05

申请号：US10276286

申请日：2001-05-03

申请人： Hui Wang

发明人： Hui Wang

IPC分类号： G01N21/00

CPC分类号： B24B49/10 ,  B24B37/013 ,  C25F3/22 ,  C25F7/00 ,  G01N21/55 ,  H01L21/32115 ,  H01L21/32134 ,  H01L21/7684

摘要： An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer (1004) includes an end-point detector. The end-point detector is disposed adjacent the nozzle (1008) used to electropolish the wafer. In one embodiment, the end-point detector is configured to measure the optical reflectivity of the portion of the wafer being electropolished.

摘要翻译： 用于检测形成在晶片（1004）上的金属层的电解抛光工艺的端点的装置包括端点检测器。 端点检测器设置在用于电抛光晶片的喷嘴（1008）附近。 在一个实施例中，端点检测器被配置为测量正被电抛光的晶片的部分的光学反射率。

公开(公告)号：US20060049056A1

公开(公告)日：2006-03-09

申请号：US10510656

申请日：2003-04-11

申请人： Hui Wang ,  Jian Wang ,  Peihaur Yih ,  Huiquan Wu

发明人： Hui Wang ,  Jian Wang ,  Peihaur Yih ,  Huiquan Wu

IPC分类号： C25D7/12

CPC分类号： C25D3/02 ,  C25D3/38 ,  C25D5/18 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76834 ,  H01L21/7684 ,  H01L21/76877

摘要： In one aspect of the present invention, an exemplary method is provided for electroplating a conductive film on a wafer. The method includes electroplating a metal film on a semiconductor structure having recessed regions and non-recessed regions within a first current density range before the metal layer is planar above recessed regions of a first density, and electroplating within a second current density range after the metal layer is planar above the recessed regions. The second current density range is greater than the first current density range. In one example, the method further includes electroplating in the second current density range until the metal layer is planar above recessed regions of a second density, the second density being greater than the first density, and electroplating within a third current density range thereafter.

摘要翻译： 在本发明的一个方面，提供了一种用于在晶片上电镀导电膜的示例性方法。 该方法包括在金属层在第一密度的凹陷区域之上平面之前在第一电流密度范围内的具有凹陷区域和非凹陷区域的半导体结构上电镀金属膜，并且在金属之后的第二电流密度范围内进行电镀 层在凹陷区域之上是平面的。 第二电流密度范围大于第一电流密度范围。 在一个示例中，该方法还包括在第二电流密度范围内的电镀，直到金属层在第二密度的凹陷区域之上是平面的，第二密度大于第一密度，并且之后在第三电流密度范围内进行电镀。

公开(公告)号：US06995594B2

公开(公告)日：2006-02-07

申请号：US10855392

申请日：2004-05-28

申请人： Aaron W. Buchwald ,  Myles Wakayama ,  Michael Le ,  Jurgen Van Engelen ,  Xicheng Jiang ,  Hui Wang ,  Howard A. Baumer ,  Avanindra Madisetti

发明人： Aaron W. Buchwald ,  Myles Wakayama ,  Michael Le ,  Jurgen Van Engelen ,  Xicheng Jiang ,  Hui Wang ,  Howard A. Baumer ,  Avanindra Madisetti

IPC分类号： H03H11/16

CPC分类号： H04L25/03885 ,  H03L7/07 ,  H03L7/0814 ,  H03L7/091 ,  H04L7/0025 ,  H04L7/0274 ,  H04L7/0337 ,  H04L25/03006 ,  H04L2025/03477 ,  H04L2025/03617

摘要： A high-speed serial data transceiver includes multiple receivers and transmitters for receiving and transmitting multiple analog, serial data signals at multi-gigabit-per-second data rates. Each receiver includes a timing recovery system for tracking a phase and a frequency of the serial data signal associated with the receiver. The timing recovery system includes a phase interpolator responsive to phase control signals and a set of reference signals having different predetermined phases. The phase interpolator derives a sampling signal, having an interpolated phase, to sample the serial data signal. The timing recovery system in each receiver independently phase-aligns and frequency synchronizes the sampling signal to the serial data signal associated with the receiver. A receiver can include multiple paths for sampling a received, serial data signal in accordance with multiple time-staggered sampling signals, each having an interpolated phase.

公开(公告)号：US06853941B2

公开(公告)日：2005-02-08

申请号：US10136710

申请日：2002-04-30

申请人： Hui Wang ,  Kenichi Kanai ,  Hiroyasu Koike

发明人： Hui Wang ,  Kenichi Kanai ,  Hiroyasu Koike

IPC分类号： G01R31/305 ,  G01R31/00

CPC分类号： G01R31/305

摘要： Methods and apparatus, including computer program products, implementing and using techniques for open-loop waveform acquisition. In general, in one aspect, the invention provides a method for open-loop waveform acquisition. The method includes acquiring an S-curve of an acquisition loop of an electron-beam probe system. The S-curve represents a response of the acquisition loop to changes of potential differences between the acquisition loop and a device under test. The method includes calibrating the acquisition loop to obtain a linear region in the acquired S-curve and using the linear portion of the acquired S-curve to calculate voltage at a probe point of the device under test.

摘要翻译： 方法和设备，包括计算机程序产品，实现和使用开环波形采集技术。 通常，一方面，本发明提供了一种开环波形采集方法。 该方法包括获取电子束探针系统的采集环路的S曲线。 S曲线表示采集环路对采集环路和被测器件之间的电位差的变化的响应。 该方法包括校准采集环路以获得所获得的S曲线中的线性区域，并且使用获取的S曲线的线性部分来计算被测器件的探针点处的电压。

公开(公告)号：US06495007B2

公开(公告)日：2002-12-17

申请号：US09800990

申请日：2001-03-07

申请人： Hui Wang

发明人： Hui Wang

IPC分类号： B23H304

CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/06 ,  C25F7/00

摘要： A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.

摘要翻译： 用于在晶片的电抛光和/或电镀期间保持晶片的晶片卡盘包括顶部部分，底部部分和弹簧部件。 根据本发明的一个方面，顶部部分和底部部分构造成接收用于处理的晶片。 弹簧构件设置在底部上并构造成向晶片施加电荷。 根据本发明的另一方面，弹簧构件接触晶片外周的一部分。 在本发明的另一种配置中，晶片卡盘还包括密封件，用于将弹簧件与用于电抛光和/或电镀工艺中的电解液密封。

公开(公告)号：US06440295B1

公开(公告)日：2002-08-27

申请号：US09497894

申请日：2000-02-04

申请人： Hui Wang

发明人： Hui Wang

IPC分类号： C25F316

CPC分类号： H01L21/32115 ,  C25F3/22 ,  C25F7/00 ,  H01L21/32134 ,  H01L21/7684

摘要： An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.

摘要翻译： 用于抛光形成在晶片（31）上的金属层的电抛光设备包括电解质（34），抛光容器（100），晶片卡盘（29），流体入口（5,7,9） 一个阴极（1,2,3）。 晶片卡盘（29）将晶片（31）保持并定位在抛光容器（100）内。 电解质（34）通过流体入口（5,7,9）输送到抛光容器（100）中。 然后，阴极（1,2,3）将电解抛光电流施加到电解质上以对晶片（31）进行电解抛光。 根据本发明的一个方面，晶片（31）的离散部分可以被电抛光以增强电抛光晶片的均匀性。

公开(公告)号：US06395152B1

公开(公告)日：2002-05-28

申请号：US09346699

申请日：1999-07-02

申请人： Hui Wang

发明人： Hui Wang

IPC分类号： C25D1700

CPC分类号： H01L21/32115 ,  C25F3/22 ,  C25F7/00 ,  H01L21/32134 ,  H01L21/7684

摘要： An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.

摘要翻译： 用于抛光形成在晶片（31）上的金属层的电抛光设备包括电解质（34），抛光容器（100），晶片卡盘（29），流体入口（5,7,9） 一个阴极（1,2,3）。 晶片卡盘（29）将晶片（31）保持并定位在抛光容器（100）内。 电解质（34）通过流体入口（5,7,9）输送到抛光容器（100）中。 然后，阴极（1,2,3）将电解抛光电流施加到电解质以对晶片（31）进行电解抛光。 根据本发明的一个方面，晶片（31）的离散部分可以被电抛光以增强电抛光晶片的均匀性。

公开(公告)号：US06363659B1

公开(公告)日：2002-04-02

申请号：US09448331

申请日：1999-11-23

申请人： Hui Wang

发明人： Hui Wang

IPC分类号： E05D1522

CPC分类号： E05D15/22 ,  E05Y2900/148 ,  E06B3/44 ,  E06B3/4407 ,  E06B3/5063

摘要： A storm resistant device for a window that has a window frame enclosing at least one sash slidingly and pivotally mounted therein. The sash has side rails and the frame has vertical jambs that engage the side rails of the sash to raise and lower and pivot the sash. The storm resistant device comprises a first elongated bracket having a substantially Z-shaped cross section with two end segments and a middle segment connecting the two end segments. The middle segment is connectable to the side rails of the sashes with one of the end segments extending outward from the sash toward an adjacent jamb. There is a second elongated bracket having a substantially L-shaped cross section with two legs, one leg of the bracket adapted to be mounted to the jamb with a second leg of the L extending toward an adjacent side rail of the sash. The first and second brackets are mounted to the frame and sash, respectively, so that when the sash is closed, the one end segment of the first bracket interlocks with the second leg of the second bracket and prevents the sash from pivoting when pressure is applied to the sash.

摘要翻译： 一种用于窗户的防风雨装置，其具有围绕至少一个窗框的窗框，其滑动地并枢转地安装在其中。 窗框具有侧轨，框架具有垂直的边框，其接合窗框的侧轨以升高和降低并枢转窗扇。 防暴装置包括具有大致Z形截面的第一细长支架，其具有两个端部段和连接两个端部段的中间段。 中间部分可连接到窗扇的侧轨，其中一个端部段从窗扇向外延伸到相邻的边框。 存在具有两个腿的基本上L形横截面的第二细长支架，支架的一个支腿适于安装到侧柱，其中L的第二支腿朝向窗扇的相邻侧轨延伸。 第一和第二支架分别安装到框架和窗框上，使得当窗框关闭时，第一支架的一端部与第二支架的第二支腿互锁，并且防止当施加压力时窗框摆动 到窗扇