公开(公告)号：US20070019172A1

公开(公告)日：2007-01-25

申请号：US11189236

申请日：2005-07-25

申请人： Peter Benson

发明人： Peter Benson

IPC分类号： G03B27/42

CPC分类号： G03F7/70341 ,  G03F7/708

摘要： Systems and methods for retrieving residual liquid during immersion lens photolithography are disclosed. A method in accordance with one embodiment includes directing radiation along a radiation path, through a lens and through a liquid volume in contact with the lens, to a microfeature workpiece in contact with the liquid volume. The method can further include, while moving at least one of the microfeature workpiece and the lens relative to the other, recovering liquid from the liquid volume and replenishing liquid in the liquid volume. A spacing between the lens and the microfeature workpiece can be controlled by providing a gas bearing between the lens and the microfeature workpiece. Residual liquid remaining on a surface on the microfeature workpiece can be directed back into the liquid volume, for example, by injecting a gas through at least one injection port that is oriented annularly inwardly toward the liquid volume.

摘要翻译： 公开了在浸没透镜光刻期间检索残留液体的系统和方法。 根据一个实施例的方法包括将辐射沿着辐射路径引导通过透镜并且通过与透镜接触的液体体积指向与液体体积接触的微特征工件。 该方法还可以包括在微动工件和透镜中的至少一个相对于另一个移动时，从液体体积中回收液体并补充液体中的液体。 可以通过在透镜和微特征工件之间提供气体轴承来控制透镜和微特征工件之间的间隔。 残留在微特征工件表面上的剩余液体可以被引回到液体体积中，例如通过将气体通过至少一个朝向液体体积的环向内部的注入口注入。

公开(公告)号：US20060264041A1

公开(公告)日：2006-11-23

申请号：US11494982

申请日：2006-07-28

申请人： Sidney Rigg ,  Charles Watkins ,  Kyle Kirby ,  Peter Benson ,  Salman Akram

发明人： Sidney Rigg ,  Charles Watkins ,  Kyle Kirby ,  Peter Benson ,  Salman Akram

IPC分类号： H01L21/44 ,  H01L23/04

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and dies are disclosed herein. In one embodiment, a method includes forming a bond-pad on a die having an integrated circuit, the bond-pad being electrically coupled to the integrated circuit. A conductive line is then formed on the die, the conductive line having a first end portion attached to the bond-pad and a second end portion spaced apart from the bond-pad. The method can further include forming a via or passage through the die, the bond-pad, and the first end portion of the conductive line, and depositing an electrically conductive material in at least a portion of the passage to form a conductive interconnect extending at least generally through the microelectronic device.

摘要翻译： 本文公开了微电子器件，用于封装微电子器件的方法，以及用于在微特征工件和管芯中形成通路和导电互连的方法。 在一个实施例中，一种方法包括在具有集成电路的管芯上形成接合焊盘，所述接合焊盘电耦合到集成电路。 然后在管芯上形成导线，导电线具有附接到接合焊盘的第一端部和与接合焊盘间隔开的第二端部。 该方法还可以包括形成通过管芯，接合焊盘和导电线的第一端部的通孔或通道，以及在通道的至少一部分中沉积导电材料以形成延伸在 最不通常地通过微电子器件。

公开(公告)号：US20060216862A1

公开(公告)日：2006-09-28

申请号：US11430735

申请日：2006-05-09

申请人： Sidney Rigg ,  Charles Watkins ,  Kyle Kirby ,  Peter Benson ,  Salman Akram

发明人： Sidney Rigg ,  Charles Watkins ,  Kyle Kirby ,  Peter Benson ,  Salman Akram

IPC分类号： H01L21/00

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and dies are disclosed herein. In one embodiment, a method includes forming a bond-pad on a die having an integrated circuit, the bond-pad being electrically coupled to the integrated circuit. A conductive line is then formed on the die, the conductive line having a first end portion attached to the bond-pad and a second end portion spaced apart from the bond-pad. The method can further include forming a via or passage through the die, the bond-pad, and the first end portion of the conductive line, and depositing an electrically conductive material in at least a portion of the passage to form a conductive interconnect extending at least generally through the microelectronic device.

公开(公告)号：US07073033B2

公开(公告)日：2006-07-04

申请号：US10434483

申请日：2003-05-08

申请人： Harlan Sexton ,  David Unietis ,  Peter Benson

发明人： Harlan Sexton ,  David Unietis ,  Peter Benson

IPC分类号： G06F12/00

CPC分类号： G06F9/461 ,  G06F9/5022 ,  Y10S707/99932 ,  Y10S707/99933 ,  Y10S707/99934 ,  Y10S707/99935

摘要： A memory model for a run-time environment is disclosed that includes a process-specific area of memory where objects in call-specific area of memory and session-specific area of memory can be migrated to at the end of a database call. User-specific objects can be then migrated to the session-specific area of memory. In one embodiment, the process-specific area of memory can be saved in a disk file and used to hot start another instance of an application server.

公开(公告)号：US20060115926A1

公开(公告)日：2006-06-01

申请号：US11336540

申请日：2006-01-20

申请人： Alan Wood ,  Warren Farnworth ,  Charles Watkins ,  Peter Benson

发明人： Alan Wood ,  Warren Farnworth ,  Charles Watkins ,  Peter Benson

IPC分类号： H01L21/50

CPC分类号： H01L27/14685 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/56 ,  H01L23/3128 ,  H01L27/14618 ,  H01L27/14627 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/12041

摘要： A conductive element is formed on a substrate by forming an organometallic layer on at least a portion of a surface of the substrate, heating a portion of the organometallic layer, and removing an unheated portion of the organometallic layer. In other methods, a flowable, uncured conductive material may be deposited on a surface of the substrate, the flowable, uncured conductive material may be selectively cured over at least a portion of the surface of the substrate, and a portion of the cured conductive material may be removed. A conductive via is formed by forming a hole at least partially through a thickness of a substrate, depositing an organometallic material within at least a portion of the hole, and selectively heating at least a portion of the organometallic material.

摘要翻译： 通过在基板表面的至少一部分上形成有机金属层，加热部分有机金属层，去除有机金属层的未加热部分，在基板上形成导电元件。 在其他方法中，可流动的未固化的导电材料可以沉积在基底的表面上，可流动的未固化的导电材料可以选择性地固化在基底表面的至少一部分上，并且一部分固化的导电材料 可能被删除。 通过至少部分地穿过衬底的厚度形成孔，在孔的至少一部分内沉积有机金属材料并选择性地加热至少一部分有机金属材料来形成导电通孔。

公开(公告)号：US20060115925A1

公开(公告)日：2006-06-01

申请号：US11336228

申请日：2006-01-20

申请人： Alan Wood ,  Warren Farnworth ,  Charles Watkins ,  Peter Benson

发明人： Alan Wood ,  Warren Farnworth ,  Charles Watkins ,  Peter Benson

IPC分类号： H01L21/50

CPC分类号： H01L27/14685 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/56 ,  H01L23/3128 ,  H01L27/14618 ,  H01L27/14627 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/12041

摘要： A microlens for use in an imaging device may be fabricated by disposing a flowable, uncured optically transmissive material in at least one layer onto a surface of a substrate, selectively curing at least a portion of the flowable, uncured optically transmissive material, and removing the flowable, uncured optically transmissive material from the surface of the substrate.

摘要翻译： 用于成像装置的微透镜可以通过将至少一层中的可流动的未固化的光学透射材料设置在基板的表面上来选择性地固化可流动的未固化的光学透射材料的至少一部分， 可流动的，未固化的光学透射材料。

公开(公告)号：US20060046461A1

公开(公告)日：2006-03-02

申请号：US10933197

申请日：2004-09-01

申请人： Peter Benson ,  Charles Watkins

发明人： Peter Benson ,  Charles Watkins

IPC分类号： H01L21/44 ,  H01L21/4763

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L21/76804 ,  H01L21/76879 ,  H01L23/3171 ,  H01L24/02 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/0001 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014

摘要： A method for forming at least one conductive element is disclosed. Particularly, a semiconductor substrate, including a plurality of semiconductor dice thereon, may be provided and a dielectric layer may be formed thereover. At least one depression may be laser ablated in the dielectric layer and an electrically conductive material may be deposited thereinto. Also, a method for assembling a semiconductor die having a plurality of bond pads and a dielectric layer formed thereover to a carrier substrate having a plurality of terminal pads is disclosed. At least one depression may be laser ablated into the dielectric layer and a conductive material may be deposited thereinto for electrical communication between the semiconductor die and the carrier substrate. The semiconductor die may be affixed to the carrier substrate and at least one of the dielectric layer and the conductive material may remain substantially solid during affixation therebetween. The methods may be implemented at the wafer level.

公开(公告)号：US20060046346A1

公开(公告)日：2006-03-02

申请号：US10932842

申请日：2004-09-01

申请人： Peter Benson ,  Charles Watkins

发明人： Peter Benson ,  Charles Watkins

IPC分类号： H01L21/50

CPC分类号： H01L21/563 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method comprises providing a workpiece including a substrate having a plurality of microelectronic dies on and/or in the substrate. The individual dies include integrated circuitry and pads electrically coupled to the integrated circuitry. The method then includes depositing an underfill layer onto a front side of the substrate. The method also includes selectively forming apertures in the underfill layer to expose the pads at the front side of the substrate. The method further includes depositing a conductive material into the apertures and in electrical contact with the corresponding pads. In one aspect of this embodiment, the underfill layer is a photoimageable material.

公开(公告)号：US20060011809A1

公开(公告)日：2006-01-19

申请号：US10894262

申请日：2004-07-19

申请人： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

发明人： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

IPC分类号： H01L27/00

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

公开(公告)号：US20050250292A1

公开(公告)日：2005-11-10

申请号：US10840733

申请日：2004-05-06

申请人： Pary Baluswamy ,  Peter Benson

发明人： Pary Baluswamy ,  Peter Benson

IPC分类号： B23K26/36 ,  G03F9/00 ,  H01L21/00 ,  H01L21/301 ,  H01L21/3065 ,  H01L21/46 ,  H01L21/76 ,  H01L21/78 ,  H01L23/544

CPC分类号： H01L21/67282 ,  B23K26/364 ,  G03F9/708 ,  G03F9/7084 ,  H01L21/3065 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54453 ,  H01L2223/5446 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein are methods for forming photolithography alignment markers on the back side of a substrate, such as a crystalline silicon substrate used in the manufacture of semiconductor integrated circuits. According to the disclosed techniques, laser radiation is used to remove the material (e.g., silicon) from the back side of a substrate to form the back side alignment markers at specified areas. Such removal can comprise the use of laser ablation or laser-assisted etching. The substrate is placed on a motor-controlled substrate holding mechanism in a laser removal chamber, and the areas are automatically moved underneath the laser radiation to removal the material. The substrate holding mechanism can comprise a standard chuck (in which case use of a protective layer on the front side of the substrate is preferred), or a substrate clamping assembly which suspends the substrate at its edges (in which case the protective layer is not necessary). Alternatively, a stencil having holes corresponding to the shape of the back side alignment markers can be placed over the back side of the substrate to mitigate the need to move the substrate to the areas with precision.

摘要翻译： 这里公开了在衬底的背面上形成光刻对准标记的方法，例如用于制造半导体集成电路的晶体硅衬底。 根据所公开的技术，使用激光辐射从衬底的背面去除材料（例如硅），以在特定区域形成背面对准标记。 这种去除可以包括使用激光烧蚀或激光辅助蚀刻。 将基板放置在激光去除室中的电动机控制的基板保持机构上，并且这些区域在激光辐射下自动移动以去除材料。 基板保持机构可以包括标准卡盘（在这种情况下优选使用基板的正面上的保护层）或将基板悬挂在其边缘处的基板夹持组件（在这种情况下保护层不是保护层） 必要）。 或者，具有与背面对准标记的形状对应的孔的模板可以放置在衬底的背面上，以减轻将衬底精确地移动到区域的需要。