公开(公告)号：US06627987B1

公开(公告)日：2003-09-30

申请号：US09881343

申请日：2001-06-13

Applicant: Thomas P. Glenn ,  Roy D. Hollaway ,  Steven Webster

Inventor： Thomas P. Glenn ,  Roy D. Hollaway ,  Steven Webster

IPC: H01L2348

CPC classification number: H01L23/10 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16195 ,  Y10T428/239 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A sealed ceramic package for a semiconductor device and a method of fabricating the same are disclosed. In one embodiment, a ceramic substrate has a set of cavities each having an opening at a substrate top surface. A semiconductor die is disposed within each cavity, and is electrically connected through the substrate to input/output terminals of the substrate. The substrate has a metal film on the top surface thereof around the opening of the respective the cavities. A metal lid panel, covering the cavity openings, is soldered to the metal film by reflowing a layer of solder disposed over a lid panel bottom surface, thereby sealing the die in each cavity. Subsequently, individual packages are singulated from the ceramic substrate.

Abstract translation: 公开了一种用于半导体器件的密封陶瓷封装及其制造方法。 在一个实施例中，陶瓷衬底具有一组空腔，每个空腔在衬底顶表面具有开口。 半导体管芯设置在每个腔内，并且通过衬底电连接到衬底的输入/输出端子。 衬底在其顶表面上具有围绕各腔的开口的金属膜。 覆盖空腔开口的金属盖板通过回流设置在盖板底部表面上的焊料层而焊接到金属膜，从而将模具密封在每个空腔中。 随后，从陶瓷衬底分离各个封装。

公开(公告)号：US06624921B1

公开(公告)日：2003-09-23

申请号：US09804805

申请日：2001-03-12

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: G02B2600

CPC classification number: B81B7/0067 ,  B81B2201/042 ,  B81C1/00865 ,  B81C1/00904 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/16235 ,  H01L2224/05599

Abstract: A window is mounted directly to an upper surface of a micromirror device chip. More particularly, the window is mounted above a micromirror device area on the upper surface of the micromirror device chip by a bead. The window in combination with the bead form a hermetic enclosure about the micromirror device area thus protecting the micromirror device area from moisture and contamination.

Abstract translation: 窗口直接安装在微镜器件芯片的上表面。 更具体地，窗口通过珠缘安装在微反射镜装置芯片的上表面上的微镜装置区域上方。 窗口与珠组合形成围绕微镜装置区域的密封外壳，从而保护微镜装置区域免受潮湿和污染。

公开(公告)号：US06620646B1

公开(公告)日：2003-09-16

申请号：US09712314

申请日：2000-11-13

Applicant: Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

Inventor： Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

IPC: H01L2148

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. A noncritical region of the upper surface of the image sensor is between the active area and bond pads of the image sensor. A lower surface of a step up ring is mounted above the noncritical region of the upper surface of the image sensor. An upper surface of the step up ring includes a plurality of electrically conductive traces. Bond wires are formed between the bond pads of the image sensor and the electrically conductive traces on the upper surface of the step up ring. The step up ring is mounted so that the window is located in or adjacent a central aperture of the step up ring.

Abstract translation: 为了形成图像传感器封装，将窗口安装在图像传感器的上表面上的有效区域上方。 图像传感器的上表面的非临界区域在图像传感器的有源区域和接合焊盘之间。 升压环的下表面安装在图像传感器的上表面的非关键区域上方。 升压环的上表面包括多个导电迹线。 接合线形成在图像传感器的接合焊盘和升压环的上表面上的导电迹线之间。 安装升降环使得窗口位于升压环的中心孔中或其附近。

公开(公告)号：US06610167B1

公开(公告)日：2003-08-26

申请号：US09764166

申请日：2001-01-16

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: B32B3100

CPC classification number: H01L27/14685 ,  H01L27/1462 ,  Y10T156/1158

Abstract: A method includes adhesively mounting an adhesive lower surface of a protective layer to a top surface of a die such as an image sensor die or a micromachine die. A special-purpose area on the top surface of the die is contacted and protected by said protective layer. The protective layer includes a polymerizable material, which includes the adhesive lower surface. The method further includes rendering the adhesive lower surface to be nonadhesive. The adhesive lower surface is rendered nonadhesive by polymerizing the polymerizable material of the protective layer with ultraviolet radiation.

Abstract translation: 一种方法包括将保护层的粘合剂下表面粘合地安装到诸如图像传感器模具或微机械模具的模具的顶表面上。 模具顶表面上的专用区域被所述保护层接触和保护。 保护层包括可聚合材料，其包括粘合剂下表面。 该方法还包括使粘合剂下表面不粘附。 通过用紫外线辐射聚合保护层的可聚合材料，使粘合剂下表面变得不粘附。

公开(公告)号：US06572944B1

公开(公告)日：2003-06-03

申请号：US09764190

申请日：2001-01-16

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: B32B900

CPC classification number: H01L21/6836 ,  B81C1/00888 ,  H01L21/78 ,  H01L2221/68327 ,  Y10S428/913 ,  Y10S438/976 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/1486 ,  Y10T428/149 ,  Y10T428/24868 ,  Y10T428/2809 ,  Y10T428/2813 ,  Y10T428/2848

Abstract: A structure for protecting a special-purpose area of an image sensor die or a micromachine die during singulation of the die from a wafer includes a protective layer that has a polymerized upper zone and an unpolymerized lower zone. At least part of the unpolymerized lower zone has an adhesive lower surface that is attached to a top surface of the wafer so that the protective layer overlies and protects the special-purpose area during either frontside or backside sawing. The unpolymerized lower zone is then entirely polymerized to make the adhesive lower surface nonadhesive to facilitate removal of the protective layer from the die.

Abstract translation: 用于在从晶片切割模具期间保护图像传感器芯片或微机械晶粒的专用区域的结构包括具有聚合的上部区域和未聚合的下部区域的保护层。 未聚合的下部区域的至少一部分具有附着到晶片的顶表面的粘合剂下表面，使得保护层在前侧或后侧锯切期间覆盖并保护专用区域。 然后将未聚合的下部区域完全聚合以使粘合剂下表面不粘附以便于将保护层从模具中去除。

公开(公告)号：US06548759B1

公开(公告)日：2003-04-15

申请号：US09895994

申请日：2001-06-28

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2302

CPC classification number: H01L27/14618 ,  H01L23/49572 ,  H01L23/49827 ,  H01L27/14625 ,  H01L31/0203 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599

Abstract: An image sensor package includes a substrate having a central aperture. Electrically conductive traces on a lower surface of the substrate include tabs projecting below and under hanging the central aperture. An image sensor is flip chip mounted to the tabs and thus supported in the central aperture by the tabs. By mounting the image sensor in the central aperture, the resulting image sensor package is relatively thin.

Abstract translation: 图像传感器封装包括具有中心孔的基板。 在基板的下表面上的导电迹线包括突出在中心孔下方并在其下悬挂的突片。 图像传感器被倒装芯片安装到突片上，并由此通过突片支撑在中心孔中。 通过将图像传感器安装在中心孔中，所得到的图像传感器封装相对较薄。

公开(公告)号：US06545345B1

公开(公告)日：2003-04-08

申请号：US09813485

申请日：2001-03-20

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy D. Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy D. Hollaway

IPC: H01L23495

CPC classification number: H05K1/182 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, such as a leadframe or a laminate sheet, and input/output terminals. A chip is on a first side of the base and is electrically connected (directly or indirectly) to the input/output terminals. A cap, which may be a molded encapsulant, is provided on the first side of the base over the chip. The package is mounted on the substrate so that the cap is in the aperture, and a peripheral portion of the first side of the base is over the mounting surface so as to support the package in the aperture and allow the input/output terminals of the package to be juxtaposed with to the circuit patterns of the mounting surface. Because the cap is within the aperture, a height of the package above the mounting surface is minimized.

Abstract translation: 公开了一种用于包含半导体芯片的封装的安装件，以及制造这种安装的方法。 安装件包括具有其上具有导电迹线的安装表面的基板和延伸穿过基板的孔。 该包装包括底座，例如引线框或层压板，以及输入/输出端子。 芯片位于基座的第一侧，并与输入/输出端子电连接（直接或间接）。 在芯片上的基座的第一侧上提供可以是模制密封剂的盖。 封装被安装在基板上，使得帽位于孔中，并且基座的第一侧的周边部分在安装表面上方，以便将封装支撑在孔中，并且允许端子的输入/输出端子 包装与安装表面的电路图案并列。 因为盖在孔内，所以在安装表面上方的包装的高度被最小化。

公开(公告)号：US06441503B1

公开(公告)日：2002-08-27

申请号：US09754393

申请日：2001-01-03

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01L2328

CPC classification number: G01L19/141 ,  G01L19/0645 ,  G01L19/147 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a substrate. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard wire bond techniques. The resulting array of pressure sensor sub-assemblies is then molded, using a mold tool that closes on three sides of the substrate so that a cavity is formed that is open on the fourth side. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of a cavity or hole in the encapsulant. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the cavity. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

Abstract translation: 多个压力传感器芯片附接到位于基板上的压力传感器芯片附着位置的阵列。 然后使用标准引线接合技术将压力传感器芯片电连接到压力传感器芯片附接位置。然后使用在基板的三侧封闭的模具来模制所得到的压力传感器子组件阵列，使得腔体 形成在第四侧是敞开的。 每个压力传感器模具的微机元件的外表面的一部分在密封剂的空腔或孔的底部露出。 在模制之后，微机元件的暴露的外表面被施加在空腔中的压力耦合凝胶覆盖。 然后使用熟知的锯切或激光技术或通过捕捉特殊形成的卡扣阵列来将所得的封装的压力传感器阵列进行旋转。

公开(公告)号：US06429513B1

公开(公告)日：2002-08-06

申请号：US09866100

申请日：2001-05-25

Applicant: Charles A. Shermer, IV ,  Thomas P. Glenn ,  Steven Webster ,  Donald Craig Foster

Inventor： Charles A. Shermer, IV ,  Thomas P. Glenn ,  Steven Webster ,  Donald Craig Foster

IPC: H01L2334

CPC classification number: H01L23/427 ,  H01L23/4334 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/15311

Abstract: Semiconductor packages and other electronic assemblies having an active heat sink are disclosed, along with methods of making the same. The active heat sink includes a cavity partially filled with a heat activated liquid. Heat generated during operation of a chip boils the heat activated liquid. The vapor condenses on an inner surface of the active heat sink and transfers heat to an outer, possibly finned, surface exposed to ambient to dissipate heat. In some embodiments, the active heat sink may be a closed vessel mounted on the chip. In some embodiments, the vessel of the active heat sink is formed from a die pad of a leadframe substrate. The die pad includes a recess that forms the active heat sink cavity when bonded to the back surface of the chip. The heat activated liquid directly contacts the back surface of the chip in these embodiments.

Abstract translation: 公开了具有有源散热器的半导体封装和其它电子组件及其制造方法。 活性散热器包括部分填充有热活化液体的空腔。 在芯片运行期间产生的热量使热活化液体沸腾。 蒸汽在有源散热器的内表面上冷凝，并将热量传递到暴露于环境的外部可能有翅片的表面以散热。 在一些实施例中，有源散热器可以是安装在芯片上的封闭容器。 在一些实施例中，有源散热器的容器由引线框架基板的管芯焊盘形成。 芯片焊盘包括当结合到芯片的背面时形成有源散热腔的凹部。 在这些实施例中，热活化液体直接接触芯片的背面。

公开(公告)号：US06420201B1

公开(公告)日：2002-07-16

申请号：US09754229

申请日：2001-01-03

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01L2100

CPC classification number: G01L9/0054 ,  G01L19/147 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00

Abstract: A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a substrate. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard wire bond techniques. The resulting array of pressure sensor sub-assemblies is then molded, using a mold tool which closes on three sides of the substrate so that a cavity is formed that is open on the fourth side. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of a cavity or hole in the encapsulant. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the cavity. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

Abstract translation: 多个压力传感器芯片附接到位于基板上的压力传感器芯片附着位置的阵列。 然后使用标准导线接合技术将压力传感器芯片电压连接到压力传感器芯片附接位置。然后使用在基板的三侧封闭的模具来模制所得到的压力传感器子组件阵列，使得腔体 形成在第四侧是敞开的。 每个压力传感器模具的微机元件的外表面的一部分在密封剂的空腔或孔的底部露出。 在模制之后，微机元件的暴露的外表面被施加在空腔中的压力耦合凝胶覆盖。 然后使用熟知的锯切或激光技术或通过捕捉特殊形成的卡扣阵列来将所得的封装的压力传感器阵列进行旋转。