公开(公告)号：US20070246247A1

公开(公告)日：2007-10-25

申请号：US11785873

申请日：2007-04-20

申请人： Yasunari Ooyabu ,  Jun Ishii

发明人： Yasunari Ooyabu ,  Jun Ishii

IPC分类号： H05K1/03

CPC分类号： H05K1/0259 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/09554

摘要： The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a semiconductive layer formed on the insulating base layer so as to cover the conductive pattern, and a ground connecting portion formed on the metal supporting board to be in contact with the metal supporting board and the semiconductive layer.

摘要翻译： 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在绝缘基底层上以覆盖导电图案的半导体层，以及 接地连接部分形成在金属支撑板上以与金属支撑板和半导体层接触。

公开(公告)号：US07286370B2

公开(公告)日：2007-10-23

申请号：US11135511

申请日：2005-05-24

申请人： Yasunari Ooyabu

发明人： Yasunari Ooyabu

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K1/142 ,  H01R12/61 ,  H05K3/0058 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/0969 ,  H05K2201/2009

摘要： A wired circuit board is provided that is formed by connecting a first wired circuit board and a second wired circuit board, which include a first connection terminal and a second connection terminal, respectively. A solder bump is provided to continuously extend over surfaces of the first connection terminal and the second connection terminal to mechanically couple the first wired circuit board and the second wired circuit board. Consequently, the solder bump is not interposed between opposed surfaces of the first connection terminal and the second connection terminal, thereby allowing the electrical connection provided by the solder bump to be confirmed by visual observation.

摘要翻译： 提供一种布线电路板，其通过分别连接包括第一连接端子和第二连接端子的第一布线电路板和第二布线电路板而形成。 提供焊料凸块以连续地延伸到第一连接端子和第二连接端子的表面上以机械地耦合第一布线电路板和第二布线电路板。 因此，在第一连接端子和第二连接端子的相对面之间没有插入焊料凸块，从而通过目视观察来确认由焊料凸块提供的电连接。

公开(公告)号：US20070209829A1

公开(公告)日：2007-09-13

申请号：US11713053

申请日：2007-03-02

申请人： Jun Ishii ,  Yasunari Ooyabu

发明人： Jun Ishii ,  Yasunari Ooyabu

IPC分类号： H05K1/03

CPC分类号： H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28

摘要： A suspension board with circuit has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and including a terminal portion for connecting to an external terminal, and an antistatic barrier layer formed on the conductive pattern. The antistatic barrier layer includes a metal thin film and a semiconductive layer having at least one end facing the terminal portion and at least the other end in contact with the metal supporting board.

摘要翻译： 具有电路的悬挂板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上的导电图案，并且包括用于连接到外部端子的端子部分和形成在导体上的抗静电阻挡层 模式。 抗静电阻挡层包括金属薄膜和半导体层，其具有面向端子部的至少一个端部，并且至少另一端与金属支撑板接触。

公开(公告)号：US20060087011A1

公开(公告)日：2006-04-27

申请号：US11236815

申请日：2005-09-28

申请人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H01L23/495

CPC分类号： H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.

摘要翻译： 一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。 绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，使得多条导线4a，4b，4c，4d的线，磁头连接端子 如图7所示，外部连接端子8一体形成，并且第一通孔9形成在外部连接端子8中。 此后，在形成绝缘覆盖层10之后，分别在支撑板2和绝缘基底层3中形成第三通孔20和第二通孔19，以与第一通孔9连通。 这可以得到当外部连接端子8连接到外部端子23时的结果，可以在确认从各个通孔放置焊球21的同时进行连接。

公开(公告)号：US09072207B2

公开(公告)日：2015-06-30

申请号：US12458996

申请日：2009-07-29

申请人： Yasunari Ooyabu ,  Tetsuya Ohsawa ,  Emiko Tani

发明人： Yasunari Ooyabu ,  Tetsuya Ohsawa ,  Emiko Tani

IPC分类号： H05K1/00 ,  H05K1/11 ,  G11B5/48 ,  G11B21/16 ,  H05K3/40 ,  H05K1/02 ,  H05K1/05 ,  H05K3/00

CPC分类号： H05K1/02 ,  G11B5/4826 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/0266 ,  H05K1/056 ,  H05K3/0041 ,  H05K3/06 ,  H05K3/4092 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2203/0502 ,  H05K2203/0756 ,  H05K2203/167

摘要： A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.

摘要翻译： 具有电路的悬挂板包括金属支撑板，层压在金属支撑板上的导电层和介于金属支撑板和导电层之间的通孔层。 导电层包括导电图案，以及用作定位基准的参考部分，用于将悬架板放置在负载梁上。

公开(公告)号：US08723167B2

公开(公告)日：2014-05-13

申请号：US13484399

申请日：2012-05-31

申请人： Satoshi Sato ,  Hisataka Ito ,  Yasunari Ooyabu ,  Yuki Shinbori

发明人： Satoshi Sato ,  Hisataka Ito ,  Yasunari Ooyabu ,  Yuki Shinbori

IPC分类号： H01L35/24

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/0095 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00012

摘要： A reflecting material contains a silicone resin composition prepared from a polysiloxane containing silanol groups at both ends, an ethylenic silicon compound, a silicon compound containing an epoxy group, an organohydrogenpolysiloxane, a condensation catalyst, and an addition catalyst; and a light reflecting component.

摘要翻译： 反射材料含有由两端含有硅烷醇基的聚硅氧烷，乙烯基硅化合物，含有环氧基的硅化合物，有机氢聚硅氧烷，缩合催化剂和加成催化剂制备的有机硅树脂组合物; 和光反射部件。

公开(公告)号：US08327535B2

公开(公告)日：2012-12-11

申请号：US13317108

申请日：2011-10-11

申请人： Yasunari Ooyabu ,  Jun Ishii ,  Kensuke Nishi

发明人： Yasunari Ooyabu ,  Jun Ishii ,  Kensuke Nishi

IPC分类号： H05K3/10

CPC分类号： H05K1/0269 ,  G11B5/486 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/163 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24331

摘要： A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a terminal portion. An opening is formed in the insulating base layer to expose the metal foil.

摘要翻译： 布线电路板具有金属支撑板，形成在金属支撑板上的金属箔，形成在金属支撑板上以覆盖金属箔的绝缘基底层，以及形成在绝缘基底层上的导电图案， 端子部分。 在绝缘基底层中形成开口以露出金属箔。

公开(公告)号：US08146246B2

公开(公告)日：2012-04-03

申请号：US12929520

申请日：2011-01-31

申请人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H01R9/00 ,  H05K3/00

CPC分类号： H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

摘要： A method of manufacturing a wired circuit board, including: forming an insulating layer in a pattern thereby forming second through holes penetrating the insulating layer in a thickness direction thereof; and after forming the insulating layer, forming, on the insulating layer, a conductive pattern in a pattern having terminals which are continuous with an upper surface and a side surface of a side end portion of the insulating layer such that the terminals extend into the second through holes. The terminals are operative for connecting with external terminals via a molten metal. The terminals include annular, step-shaped shoulder portions aligned with the second through holes and that are recessed downward from an upper surface, and first through holes having a diameter smaller than that of the second through holes and which pass through the terminals in a thickness direction thereof.

摘要翻译： 一种制造布线电路板的方法，包括：以图案形成绝缘层，从而形成沿其厚度方向穿过绝缘层的第二通孔; 并且在形成绝缘层之后，在绝缘层上形成具有与绝缘层的侧端部的上表面和侧表面连续的端子的图案的导电图案，使得端子延伸到第二 通孔。 端子用于通过熔融金属与外部端子连接。 端子包括与第二通孔对准的并且从上表面向下凹陷的环状的阶梯形肩部，以及具有小于第二通孔的直径的第一通孔，并且以贯穿端子的厚度 方向。

公开(公告)号：US20110119911A1

公开(公告)日：2011-05-26

申请号：US12929520

申请日：2011-01-31

申请人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H05K3/34

CPC分类号： H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.

摘要翻译： 一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。 绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，从而导线4a，4b，4c，4d，磁头连接端子7和外部 连接端子8一体形成，并且在外部连接端子8中也形成有第一通孔9.然后，在形成绝缘覆盖层10之后，在支撑板2上形成第三通孔20和第二通孔19， 绝缘基底层3分别与第一通孔9连通。这可以得到当外部连接端子8连接到外部端子23时可以进行连接，同时确认焊球的位置 21从相应的通孔。

公开(公告)号：US07737365B2

公开(公告)日：2010-06-15

申请号：US11812797

申请日：2007-06-21

申请人： Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

发明人： Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

IPC分类号： H05K1/00

CPC分类号： H05K1/0259 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K2201/09554 ,  Y10T428/1328 ,  Y10T428/1393 ,  Y10T428/256 ,  Y10T428/257

摘要： A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.

摘要翻译： 布线电路板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上并具有间隔布置的一对电线的导电图案，以及形成在绝缘层上的半导体层 并且电连接到金属支撑板和导电图案。 导电图案具有第一区域，其中一对导线之间的距离小，并且一对导线之间的距离大于第一区域中的距离的第二区域。 半导体层设置在第二区域中。