System and apparatus for photolithography
    62.
    发明授权
    System and apparatus for photolithography 失效
    用于光刻的系统和装置

    公开(公告)号:US07027125B2

    公开(公告)日:2006-04-11

    申请号:US10808740

    申请日:2004-03-25

    IPC分类号: G03B27/52 G03B27/42

    CPC分类号: G03F7/70808 G03F7/70341

    摘要: A photolithographic apparatus, system and method employing an improved refractive medium. The photolithographic apparatus may be used in an immersion lithography system for projecting light onto a workpiece such as a semiconductor wafer. In one embodiment, the photolithographic apparatus includes a container containing a transparent fluid. The fluid container is positioned between a lens element and the wafer. The container is further characterized as having a substantially flexible and transparent bottom membrane contacting an upper surface of the wafer and overlapping at least one side edge of the wafer such that a fluid filled skirt is formed extending beyond the edges of the wafer.

    摘要翻译: 一种使用改进的折射介质的光刻设备,系统和方法。 光刻设备可以用于浸入式光刻系统中,用于将光投射到诸如半导体晶片的工件上。 在一个实施例中,光刻设备包括容纳透明流体的容器。 流体容器位于透镜元件和晶片之间。 该容器的特征还在于具有与晶片的上表面接触并且与晶片的至少一个侧边缘重叠的基本柔性且透明的底膜,从而形成延伸超过晶片边缘的充满液体的裙部。

    Vertical DRAM having metallic node conductor
    65.
    发明授权
    Vertical DRAM having metallic node conductor 有权
    具有金属节点导体的垂直DRAM

    公开(公告)号:US06583462B1

    公开(公告)日:2003-06-24

    申请号:US09702338

    申请日:2000-10-31

    IPC分类号: H01L27108

    摘要: A dynamic random access memory device formed in a substrate having a trench. The trench has a side wall, a top, a lower portion, and a circumference. The device includes a signal storage node including a metallic storage node conductor formed in the lower portion of the trench and isolated from the side wall by a node dielectric and a collar oxide above the node dielectric. Preferably, the trench has an aspect ratio of greater than 50. A buried strap is coupled to the storage node conductor and contacts a portion of the side wall of the trench above the collar oxide. A trench-top dielectric which is formed upon the buried strap has a trench-top dielectric thickness. A signal transfer device includes a first diffusion region extending into the substrate adjacent the portion of the trench side wall contacted by the buried strap, a gate insulator having a gate insulator thickness formed on the trench side wall above the first buried strap, wherein the gate insulator thickness is less than the trench-top dielectric thickness, and a gate conductor formed within the trench upon the trench-top dielectric and adjacent the gate insulator.

    摘要翻译: 形成在具有沟槽的衬底中的动态随机存取存储器件。 沟槽具有侧壁,顶部,下部和圆周。 该装置包括信号存储节点,该信号存储节点包括形成在沟槽下部的金属存储节点导体,并通过节点电介质和节点电介质上方的环形氧化物与侧壁隔离。 优选地,沟槽具有大于50的纵横比。掩埋带耦合到存储节点导体并且接触环形氧化物上方的沟槽的侧壁的一部分。 形成在掩埋带上的沟槽电介质具有沟槽顶部的电介质厚度。 信号传送装置包括:第一扩散区域,其延伸到与所述掩埋带接触的所述沟槽侧壁的所述部分相邻的所述衬底;门绝缘体,其具有形成在所述第一掩埋带的上方的所述沟槽侧壁上的栅绝缘体厚度, 绝缘体厚度小于沟槽顶部电介质厚度,以及形成在沟槽顶部电介质并且邻近栅极绝缘体的沟槽内的栅极导体。

    SEMICONDUCTOR TRANSISTORS WITH CONTACT HOLES CLOSE TO GATES
    68.
    发明申请
    SEMICONDUCTOR TRANSISTORS WITH CONTACT HOLES CLOSE TO GATES 有权
    具有接触孔的半导体晶体管靠近门

    公开(公告)号:US20080166863A1

    公开(公告)日:2008-07-10

    申请号:US12052855

    申请日:2008-03-21

    IPC分类号: H01L21/28

    摘要: A semiconductor structure. The structure includes (a) a semiconductor layer including a channel region disposed between first and second S/D regions; (b) a gate dielectric region on the channel region; (c) a gate region on the gate dielectric region and electrically insulated from the channel region by the gate dielectric region; (d) a protection umbrella region on the gate region, wherein the protection umbrella region comprises a first dielectric material, and wherein the gate region is completely in a shadow of the protection umbrella region; and (e) a filled contact hole (i) directly above and electrically connected to the second S/D region and (ii) aligned with an edge of the protection umbrella region, wherein the contact hole is physically isolated from the gate region by an inter-level dielectric (ILD) layer which comprises a second dielectric material different from the first dielectric material.

    摘要翻译: 半导体结构。 该结构包括(a)包括设置在第一和第二S / D区之间的沟道区的半导体层; (b)沟道区上的栅介质区; (c)栅极电介质区域上的栅极区域,并且通过栅极电介质区域与沟道区域电绝缘; (d)栅极区域上的保护伞区域,其中保护伞区域包括第一介电材料,并且其中栅极区域完全处于保护伞区域的阴影中; 和(e)直接在第二S / D区域上方并电连接到第二S / D区域的填充接触孔(i)和(ii)与保护伞区域的边缘对准,其中接触孔通过一个 层间介电层(ILD)层,其包括不同于第一介电材料的第二电介质材料。