摘要:
Each of first and second program circuits includes a determination node, first to fourth fuses, first to fourth N channel MOS transistors, and first to fourth supply lines. The first to fourth N channel MOS transistors receive first to fourth row address predecode signals, respectively. The first N channel MOS transistor included in the first program circuit and the first N channel MOS transistor included in the second program circuit are arranged adjacent to each other. The first supply line provides a first row address predecode signal to the gate of these two N channel MOS transistors. The same applies for the second to fourth N channel MOS transistors and the second to fourth supply lines. Accordingly, the interconnection capacitance of the row address predecode signal line can be reduced. Also, the size of the transistor driving the row address predecode signal and the transistors in the program circuit can be reduced to allow a smaller layout area for the entire chip.
摘要:
In a predetermined multibit test mode, a multibit test circuit 114 issues determination result data pairs RDM0 and /RDM0 to RDM3 and /RDM3, each of which corresponds to match/mismatch of logics of data read from memory cells selected by one column select line in corresponding one of memory cell plane blocks. In each memory cell plane block, memory cell columns selected by one single column select line can be replaced as a unit. The unit of memory cell columns containing a defective memory cell is replaced in accordance with determination result data RDM0 and /RDM0 to RDM3 and /RDM3.
摘要:
A plurality of internal power supply voltage generating circuits generate internal power supply voltages. A column select signal at the same voltage level as a first internal power supply voltage applied to a sense amplifier is generated to an I/O gate circuit connecting a bit line pair and an internal data line pair together. A current driving capability of an I/O gate circuit is made relatively small, so that rapid change in potential on a sense node of a sense amplifier is prevented. Thereby, inversion of latched data of the sense amplifier due to collision of data is prevented in such a case voltages on the internal data line pair are not equalized sufficiently.
摘要翻译:多个内部电源电压产生电路产生内部电源电压。 与施加到读出放大器的第一内部电源电压相同的电压电平的列选择信号被产生到连接位线对和内部数据线对的I / O门电路。 I / O门电路的电流驱动能力相对较小,从而防止了读出放大器的感测节点上的电位的快速变化。 因此,在这种情况下,防止了数据冲突导致的读出放大器的锁存数据的反转,内部数据线对上的电压不能充分均衡。
摘要:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
摘要:
Each of sense amplifiers is coupled to two bit lines with another bit line being interposed therebetween. Information stored in a memory cell is read out onto one of the two bit lines coupled to each of the sense ampliers, while a reference potential is read out onto the other bit line. Outside of the two bit lines, a reference potential is respectively read out onto other bit lines adjacent to the two bit lines. The information stored in the memory cell is read out onto the other bit line between the two bit lines.
摘要:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
摘要:
In a set of memory cells selected by one column select line, a memory cell of at least 1 bit is connected to an internal data line that is different from the internal data line to which another memory cell in the same set is connected. An internal data line pair is connected to a data terminal. Thus, data having different logic levels can be written into adjacent memory cells even in an IO compression test mode.
摘要:
An output buffer includes a pull up transistor of N type field effect to charge a data output terminal by an external power supply potential Vdd in a high level data output operation, and a pull down transistor of N type field effect to discharge the data output terminal to a ground potential Vss in a low level data output operation. The substrate potential of the pull up NMOS transistor is set to a potential of a level higher than the normal case in a high level data output operation. As a result, the output buffer can speedily charge the data terminal in a high level data output operation.
摘要:
An MOS capacitor is provided in the proximity of the boundary between a P well and an N well formed of a bottom N well and an N well. Accordingly, the proximity of the boundary corresponding to the so-called dead space can be used effectively.
摘要:
Data buses are arranged in a one-to-one correspondence to pads. These data buses are arranged in common to a plurality of memory arrays. A read data driver is rendered active selectively according to a word configuration to switch equivalently the connection between a memory array and a data bus.