公开(公告)号：US08593628B2

公开(公告)日：2013-11-26

申请号：US13165205

申请日：2011-06-21

申请人： Kohei Shimbo ,  Naohiro Kamijo ,  Manabu Seo ,  Yoichi Kubota

发明人： Kohei Shimbo ,  Naohiro Kamijo ,  Manabu Seo ,  Yoichi Kubota

IPC分类号： G01J3/00 ,  G01R13/00

CPC分类号： H04N1/6027 ,  G01J3/462 ,  G01J3/501 ,  G01J3/502 ,  G01J3/51

摘要： Spectral characteristics of an object is estimated using an extended sensor response, which includes a product of at least two light intensity signals whose wavelength ranges are partially overlapped with each other.

摘要翻译： 使用扩展的传感器响应来估计对象的光谱特性，该响应包括至少两个波长范围彼此重叠的光强度信号的乘积。

公开(公告)号：US08472019B2

公开(公告)日：2013-06-25

申请号：US13037941

申请日：2011-03-01

申请人： Manabu Seo ,  Naohiro Kamijo ,  Kohei Shimbo ,  Yoichi Kubota

发明人： Manabu Seo ,  Naohiro Kamijo ,  Kohei Shimbo ,  Yoichi Kubota

IPC分类号： G01J3/28

CPC分类号： G01J3/02 ,  G01J3/0205 ,  G01J3/0229 ,  G01J3/2803 ,  G01J3/502

摘要： A spectroscopic characteristics acquisition unit includes a light emitting unit to illuminate a measurement target; a lens array including lenses to receive reflected light reflected from the measurement target; a light blocking member having a pinhole array including openings; a focusing unit to focus light coming from the pinhole array; a diffraction unit to diffract the light to different directions depending on wavelength of light received by the focusing unit; and a light receiving unit to receive the reflected light diffracted by the diffraction unit. The light receiving unit includes a spectroscopic sensor array having spectroscopy sensors including pixels. Each of the lenses constituting the lens array corresponds to one of the openings of the pinhole array. The numerical aperture NA of the lens in the arrangement direction in the lens array satisfies the formula NA>sin(θmax) with respect to the maximum angle of view θmax of the focusing unit.

摘要翻译： 光谱特性获取单元包括照亮测量对象的发光单元; 透镜阵列，包括用于接收从测量对象反射的反射光的透镜; 具有包括开口的针孔阵列的遮光构件; 聚焦单元，用于聚焦来自针孔阵列的光; 衍射单元，用于根据由聚焦单元接收的光的波长将光衍射到不同的方向; 以及光接收单元，用于接收由衍射单元衍射的反射光。 光接收单元包括具有包括像素的光谱传感器的光谱传感器阵列。 构成透镜阵列的每个透镜对应于针孔阵列的一个开口。 透镜阵列中透镜在排列方向上的数值孔径NA相对于聚焦单元的最大视角角度满足公式NA> sin（tamax）。

公开(公告)号：US08461460B2

公开(公告)日：2013-06-11

申请号：US12459864

申请日：2009-07-08

申请人： Chang Myung Ryu ,  Kimitaka Endo ,  Belgacem Haba ,  Yoichi Kubota

发明人： Chang Myung Ryu ,  Kimitaka Endo ,  Belgacem Haba ,  Yoichi Kubota

IPC分类号： H05K1/03

CPC分类号： B81B7/0006 ,  B81C1/00539 ,  C25D7/00 ,  H01L21/4846 ,  H01L21/768 ,  H01L23/498 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/244 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

摘要： A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

摘要翻译： 微电子互连元件可以包括与第一金属线交错的多个第一金属线和多个第二金属线。 第一和第二金属线中的每一个具有在相同参考平面内延伸的表面。 第一金属线具有高于参考平面并远离其的表面，并且第二金属线具有低于参考平面并远离其的表面。 电介质层可以将第一金属线的金属线与第二金属线的相邻金属线分开。

公开(公告)号：US07176043B2

公开(公告)日：2007-02-13

申请号：US11014439

申请日：2004-12-16

申请人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

发明人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

IPC分类号： H01L21/66

CPC分类号： H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.

摘要翻译： 微电子封装包括具有面和触点的微电子元件和与微电子元件的第一面间隔开并且覆盖其上的柔性基板。 该封装还包括从柔性基板延伸并从远离微电子元件的第一面突出的多个导电柱，其中至少一些导电柱与微电子元件电互连，以及多个支撑元件 微电子元件上的柔性衬底。 导电柱从支撑元件偏移以便于基板的挠曲和柱相对于微电子元件的移动。

公开(公告)号：US20050189635A1

公开(公告)日：2005-09-01

申请号：US11068831

申请日：2005-03-01

申请人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

发明人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

IPC分类号： B81B7/00 ,  H01L23/495 ,  H04R19/00 ,  H04R19/04

CPC分类号： B81B7/0077 ,  B81B2201/0257 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04R19/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.

摘要翻译： 本文公开了封装芯片的各种实施例及其制造方法。 本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件，该器件可操作为声能和电磁的至少一个的换能器 能量，并且所述芯片包括在前表面和后表面中的一个处暴露的多个接合焊盘。 封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向芯片的内表面和背离芯片的外表面。 金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。 金属层还包括第一开口，用于使声能和电磁能中的至少一个沿至少一个方向传递到所述装置和所述装置。

公开(公告)号：US5612602A

公开(公告)日：1997-03-18

申请号：US176511

申请日：1994-01-03

申请人： Yoichi Kubota ,  Naoki Kawamata ,  Masahiro Morisada ,  Katsuhiro Fujii ,  Hiroshi Itoh ,  Hiroaki Takeishi

发明人： Yoichi Kubota ,  Naoki Kawamata ,  Masahiro Morisada ,  Katsuhiro Fujii ,  Hiroshi Itoh ,  Hiroaki Takeishi

IPC分类号： G05B19/23 ,  G11B5/55

CPC分类号： G05B19/237 ,  G11B5/553 ,  G05B2219/31137 ,  G05B2219/33224 ,  G05B2219/33268 ,  G05B2219/34047 ,  G05B2219/37176 ,  G05B2219/37296 ,  G05B2219/41245 ,  G05B2219/41319

摘要： A positioning device and method includes a motor having a rotation axis, a driver for driving the motor on the basis of control information, a detector for detecting position information of the rotation axis of the motor, and a digital signal processor for performing an operation on the control information in accordance with the position information detected by the detector.

摘要翻译： 一种定位装置和方法，包括：具有旋转轴的马达，用于基于控制信息驱动马达的驱动器;用于检测马达的旋转轴的位置信息的检测器;以及用于对马达执行操作的数字信号处理器 根据由检测器检测到的位置信息的控制信息。

公开(公告)号：US5000542A

公开(公告)日：1991-03-19

申请号：US346701

申请日：1989-05-03

申请人： Tetsuharu Nishimura ,  Masaaki Tsukiji ,  Satoshi Ishii ,  Koh Ishizuka ,  Yoichi Kubota

发明人： Tetsuharu Nishimura ,  Masaaki Tsukiji ,  Satoshi Ishii ,  Koh Ishizuka ,  Yoichi Kubota

IPC分类号： G01D5/38

CPC分类号： G01D5/38

摘要： In an optical type encoder for projecting a light beam onto an optical type scale having a diffraction grating formed thereon, forming an interferenced light by the use of a diffracted light from the scale, and photoelectrically converting the interferenced light to thereby measure the displacement of the scale, first and second light beams are caused to enter substantially the same position on the scale from different first and second directions, first and second diffracted light beams emerging from the scale by the first and second light beams being diffracted by the scale are directed to the aforementioned position by a reflecting device, the diffracted light beams emerging in the first and second directions by the first and second diffracted light beams being diffracted by the scale are superposed one upon the other to thereby form an interferenced light, and light components created by the first and second light beams being regularly reflected at the aforementioned position are not included in the interferenced light.

摘要翻译： 在用于将光束投射到其上形成有衍射光栅的光学刻度尺的光学型编码器中，通过使用来自刻度的衍射光形成介入光，并对该干涉光进行光电转换，从而测量 使第一和第二光束在不同的第一和第二方向上在刻度上进入基本上相同的位置，第一和第二光束通过刻度被衍射的第一和第二衍射光束被引导到 通过反射装置的上述位置，由第一和第二方向由第一和第二衍射光束以标尺衍射的第一和第二方向的衍射光束彼此重叠，从而形成介入光，并且由 在上述位置规则地反射的第一和第二光束为No t包含在干涉光中。