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公开(公告)号:US20100242115A1
公开(公告)日:2010-09-23
申请号:US12306541
申请日:2007-10-09
Applicant: Suxian Shi , Cunliang Tong
Inventor: Suxian Shi , Cunliang Tong
IPC: G06F21/24
CPC classification number: H05K5/0208 , H05K1/0275 , H05K1/141 , H05K1/147 , H05K2201/047 , H05K2201/10151
Abstract: The present invention is available for the field of electronic circuit protection, and provides a security cover for enclosing a protective area on the protected PCB and protecting the components in this area. The security cover comprises a flexible PCB that is folded with a receiving space and an opening in a side in the space. The flexible PCB is covered on the protective area of the protected PCB and encloses the components in the protective area. The flexible PCB triggers the related circuits to remove or destroy the information on the components in this protective area in case of physical attack. The present invention is to enclose the key components on PCB via the flexible PCB with the receiving space so as to prevent the key components from being attacked.
Abstract translation: 本发明可用于电子电路保护领域,并且提供了用于在受保护的PCB上封闭保护区域并保护该区域中的部件的安全盖。 安全盖包括柔性PCB,其被折叠成具有接收空间和在该空间中的一侧的开口。 柔性PCB被覆盖在受保护的PCB的保护区域上,并将组件包围在保护区域中。 灵活的PCB触发相关电路,以便在物理攻击的情况下移除或破坏该保护区域中组件的信息。 本发明是通过具有接收空间的柔性PCB将关键部件封装在PCB上,以防止关键部件受到攻击。
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公开(公告)号:US20100088883A1
公开(公告)日:2010-04-15
申请号:US12376150
申请日:2006-09-25
Applicant: You Jung Kwon
Inventor: You Jung Kwon
IPC: H04R31/00
CPC classification number: H05K1/189 , H04R25/60 , H04R25/652 , H04R2225/025 , H05K2201/047 , H05K2201/10083 , Y10T29/49002 , Y10T29/49005 , Y10T29/4908
Abstract: Provided is a faceplate for an In-The-Ear (ITE) hearing aid and a method of manufacturing a faceplate for an In-The-Ear (ITE) hearing aid in which the faceplate can be manufactured in a compact size, using a foldable flexible printed circuit board (PCB), while maintaining the quality, enabling mass-production, and reducing the manufacturing cost.
Abstract translation: 提供了一种用于耳内(ITE)助听器的面板和用于制造耳内(ITE)助听器的面板的方法,其中面板可以以紧凑的尺寸制造,使用可折叠的 柔性印刷电路板(PCB),同时保持质量,实现批量生产,降低制造成本。
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公开(公告)号:US20240147623A1
公开(公告)日:2024-05-02
申请号:US18494861
申请日:2023-10-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Shigeru ENDO
IPC: H05K1/14
CPC classification number: H05K1/14 , H05K2201/047 , H05K2201/10143
Abstract: An arrangement is provided reduces deformation induced by vibration movements in electronic devices such as Micro Inertial Measurement systems. The result is achieved by the use and particular arrangement of additional printed circuit boards.
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公开(公告)号:US20240107674A1
公开(公告)日:2024-03-28
申请号:US17952895
申请日:2022-09-26
Applicant: Infineon Technologies Austria AG
Inventor: Eung San Cho , Danny Clavette
CPC classification number: H05K1/18 , H02M3/003 , H05K1/117 , H05K1/141 , H05K1/145 , H05K3/0052 , H05K3/30 , H05K3/366 , H02M3/1584 , H05K2201/047 , H05K2201/09145 , H05K2201/10015 , H05K2201/1003 , H05K2201/1053
Abstract: This disclosure includes multiple assemblies, sub-assemblies, etc., as well as one or more methods of fabricating same. For example, a first assembly includes a first circuit board. The first circuit board further includes first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board. The first edge may be disposed substantially opposite the second edge on the first circuit board. The apparatus may further include first circuitry affixed to the first circuit board. The first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry. The first assembly is used to fabricate a second assembly.
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公开(公告)号:US20180317314A1
公开(公告)日:2018-11-01
申请号:US15770114
申请日:2016-10-24
Applicant: Universität des Saarlandes
Inventor: Simon Olberding , Jürgen Steimle
CPC classification number: H05K1/028 , G06F3/044 , G06F3/0488 , G06F2203/0339 , G06F2203/04102 , G06T19/00 , G06T2219/021 , G09F9/301 , H03K17/962 , H05K1/0326 , H05K1/0386 , H05K1/11 , H05K1/162 , H05K3/0005 , H05K3/1216 , H05K2201/0145 , H05K2201/046 , H05K2201/047 , H05K2201/09381 , H05K2201/09409 , H05K2201/09418 , H05K2201/10053 , H05K2201/10128 , H05K2201/10151
Abstract: The invention is directed to an object (2) with a three-dimensional shape made of a folded sheet (4) so as to form at least one face (6), at least one corner (10) and/or at least one edge (8), the object comprising electrically conductive traces (14) printed on the sheet (4); and at least one functional area (12) printed on one of the at least one face (6), adjacent to one of the at least one edge (8), or adjacent to one of the at least one corner (10), the at least one functional area (12) being electrically connected to the conductive traces (14) and forming at least one control for a touch input, for a display output, and/or for sensing a change of shape of the object.
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公开(公告)号:US09933148B2
公开(公告)日:2018-04-03
申请号:US14457859
申请日:2014-08-12
Applicant: Cree, Inc.
Inventor: George R. Brandes , Julio A. Garceran
IPC: F21V29/70 , F21V29/51 , F21V23/00 , F21V23/02 , F21V29/00 , F21K9/90 , F21V29/02 , F21V29/507 , F21V29/67 , F21V29/74 , F21V29/83 , F21V29/57 , F21K9/23 , F21K9/232 , F21K9/60 , F21K9/64 , F21K9/238 , F21V3/04 , F21V29/506 , F21Y101/00 , F21Y105/10 , F21Y115/30 , F21Y115/10 , F21Y107/30 , F21Y107/40
CPC classification number: F21V29/70 , F21K9/135 , F21K9/23 , F21K9/232 , F21K9/238 , F21K9/60 , F21K9/64 , F21K9/90 , F21V3/049 , F21V3/08 , F21V3/12 , F21V23/005 , F21V23/02 , F21V29/006 , F21V29/506 , F21V29/507 , F21V29/51 , F21V29/57 , F21V29/677 , F21V29/74 , F21V29/83 , F21Y2101/00 , F21Y2105/10 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10 , F21Y2115/30 , H05K2201/047 , H05K2201/10106 , Y10S362/80 , Y10T29/4913
Abstract: LED light bulbs include openings in base or cover portions, and optional forced flow elements, for convective cooling. Thermally conductive optically transmissive material may be used for cooling, optionally including fins. A LED light engine may be fabricated from a substrate via planar fabrication techniques and shaped to form a substantially rigid upright support structure. Mechanical, electrical, and thermal connections may be made between a LED light engine and a LED light bulb.
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公开(公告)号:US09854675B2
公开(公告)日:2017-12-26
申请号:US14539035
申请日:2014-11-12
Applicant: ZODIAC AERO ELECfRIC
Inventor: Vianney Pouget , Antonio Simao
CPC classification number: H05K1/148 , H05K1/028 , H05K1/11 , H05K1/189 , H05K3/361 , H05K2201/047 , H05K2201/05 , H05K2201/058 , H05K2201/10106 , H05K2201/10151
Abstract: This electronic circuit, includes a set of electronic boards intended to support components and linked together by joining elements. The joining elements include curved flexible printed circuits linking two opposing ends of two electronic boards running side by side, the said curved flexible printed circuits being foldable for erecting the electronic circuit into a volume so that the electronic circuit comprises electronic boards placed opposite one another.
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公开(公告)号:US20170271793A1
公开(公告)日:2017-09-21
申请号:US15610825
申请日:2017-06-01
Applicant: STMicroelectronics (Tours) SAS
Inventor: Arnaud Edet , Christian Nopper
CPC classification number: H01R12/71 , H01R12/716 , H01R13/665 , H05K1/0298 , H05K1/14 , H05K1/185 , H05K2201/047
Abstract: An electrical connector includes a frame delimiting an elongated open cavity, and having two parallel long sides provided with contact areas capable of cooperating with contact areas of a complementary electrical connector. Each long side is formed of a multilayer printed circuit board.
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公开(公告)号:US09755167B2
公开(公告)日:2017-09-05
申请号:US14681444
申请日:2015-04-08
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Daiki Nakamura , Hisao Ikeda
IPC: F21S4/00 , F21V21/00 , H01L51/00 , F21Y103/00 , F21Y115/20 , H05K1/02 , H05K1/14 , H05K1/18
CPC classification number: H01L51/0097 , F21Y2103/00 , F21Y2115/20 , H01L2251/5338 , H01L2251/5361 , H05K1/028 , H05K1/147 , H05K1/189 , H05K2201/047 , H05K2201/10106 , H05K2201/10113 , H05K2201/2018 , Y02E10/549 , Y02P70/521
Abstract: A novel light-emitting device that is highly convenient or reliable is provided. The light-emitting device includes a framework, a flexible first light-emitting panel supported by the framework so as to form a first developable surface, and a flexible second light-emitting panel supported by the framework so as to form a second developable surface.
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公开(公告)号:US20170250726A1
公开(公告)日:2017-08-31
申请号:US15592429
申请日:2017-05-11
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Douglas B. Gundel , Zulfiqar A. Khan , Alexander W. Barr , Steven A. Neu
CPC classification number: H04B1/40 , G02B6/4279 , H04B1/3827 , H04B5/0037 , H04B5/0075 , H04B7/0413 , H04B10/803 , H05K1/0239 , H05K1/0243 , H05K1/144 , H05K1/18 , H05K3/366 , H05K5/0026 , H05K2201/042 , H05K2201/047 , H05K2201/10098 , H05K2201/10189
Abstract: A wireless connector is disclosed that includes a first communication device configured to wirelessly transmit, by radiative coupling, a modulated signal including a carrier signal modulated with a digital signal. The wireless connector also includes a second communication device configured to receive the modulated signal. The first and second communication devices are coupled to one another through at least one wired connection that carries a signal used to demodulate the modulated signal.
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