公开(公告)号：US20020109000A1

公开(公告)日：2002-08-15

申请号：US10016270

申请日：2001-11-02

Inventor： Glenn A. Rinne

IPC: B23K001/00 ,  B23K031/00 ,  B23K031/02 ,  B23K013/08 ,  B23K015/02

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/0212 ,  H05K3/3436 ,  H05K2201/10484 ,  H05K2203/0278 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A second substrate is positioned relative to a first substrate having phase-changeable bumps, such as solder bumps, between them, wherein the second substrate has a first face adjacent the first substrate, a second face remote from the first substrate, and at least one edge wall between the first and second faces. The phase-changeable bumps are liquefied to establish an equilibrium position of the first and second substrates relative to one another. At least a portion of the second face is pushed away from the equilibrium position towards the first substrate, to a new position, without applying external force to the first face other than spring forces of the phase-changeable bumps that are liquefied, and without applying external force to any edge wall. Thus, only spring forces of the phase-changeable bumps that are liquefied oppose the pushing. The phase-changeable bumps that are liquefied then are solidified, to maintain the new position.

Abstract translation: 第二基板相对于在它们之间具有相变凸块（例如焊料凸块）的第一基板定位，其中第二基板具有邻近第一基板的第一面，远离第一基板的第二面，以及至少一个 第一和第二面之间的边缘壁。 相变凸块被液化以建立第一和第二衬底相对于彼此的平衡位置。 将第二面的至少一部分从平衡位置朝向第一基板推向新的位置，而不对除液化的相变凸块的弹簧力之外的第一面施加外力，并且不施加 对任何边缘墙的外力。 因此，只有液化的可相变凸块的弹簧力相对于推动。 然后液化的相变凸块被固化，以保持新的位置。

公开(公告)号：US20020008131A1

公开(公告)日：2002-01-24

申请号：US09909459

申请日：2001-07-19

Inventor： Peter Hess ,  Carlo Durrer ,  Elmar Ottiger

IPC: B23K001/00 ,  B23K031/02

CPC classification number: H01L24/78 ,  B23K20/005 ,  B23K31/12 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An apparatus for making wire connections between a first connection area (2) and a second connection area (3) by means of a capillary (10) contains an image recognition system which is designed so that the tip (27) of the capillary (10) enters the image area of the image recognition system immediately before impacting on the respective connection area (2). In this way, the position of the desired point of impact of the capillary (10) on the connection area (2) as well as the position of the tip (27) of the capillary (10) can be determined with the same measuring system, evaluated and used for the precise control of the movement of the capillary (10).

Abstract translation: 用于通过毛细管（10）在第一连接区域（2）和第二连接区域（3）之间进行电线连接的装置包含图像识别系统，其被设计成使得毛细管（10）的尖端（27） ）在冲击相应的连接区域（2）之前立即进入图像识别系统的图像区域。 以这种方式，可以使用相同的测量系统来确定毛细管（10）对连接区域（2）的期望的冲击点的位置以及毛细管（10）的尖端（27）的位置 ，评估并用于精确控制毛细管（10）的运动。

公开(公告)号：US20010048187A1

公开(公告)日：2001-12-06

申请号：US09848260

申请日：2001-05-04

Inventor： Andrea Bortoloni

IPC: C22B007/00 ,  F27D001/18 ,  B23K001/00 ,  C21B007/06

CPC classification number: F27D1/1858 ,  F27D3/0025 ,  F27D21/02 ,  F27D2003/0056

Abstract: The invention is a new automatic door for molten metal holding furnaces, comprising a fixed plate with charging and inspection hole, provided with two supports positioned at the sides of the charging hole and with two vertical wings positioned on the upper part of the plate; two guides with rectangular hole are hinged to the two vertical wings positioned on the upper part of the plate and directed downwards, beyond the lower edge of the charging hole; the closing panel with gasket is equipped with lateral pins that in turn are housed in the rectangular holes of the guides, said pins and guides being suitable for making the closing panel slide along the guides. One or more pressuremechanisms, acting on the lower end of the guides, rotate the guides in such a way as to bring the closing panel in contact with the plate hole and press the panel against the hole or to move it away from the plate. A hydraulic cylinder controls the translation of the closing panel along the guides with rectangular hole.

Abstract translation: 本发明是一种用于熔融金属保温炉的新型自动门，包括带充电和检查孔的固定板，设有位于充电孔侧面的两个支撑件，以及位于板上部的两个垂直翼; 具有矩形孔的两个引导件铰接到位于板的上部的两个垂直翼，并且向下指向超过充电孔的下边缘; 具有垫圈的封闭面板配备有横向销，该侧销又被容纳在导向件的矩形孔中，所述销和引导件适合于使封闭板沿着引导件滑动。 作用在引导件的下端上的一个或多个压力机构以这样的方式旋转引导件，使得封闭板与板孔接触并将板压在孔上或将其从板上移开。 液压缸控制沿着具有矩形孔的引导件的闭合面板的平移。

公开(公告)号：US20010016786A1

公开(公告)日：2001-08-23

申请号：US09782889

申请日：2001-02-12

Applicant: KABUSHIKI KAISHA SHINKAWA

Inventor： Kuniyuki Takahashi ,  Shinji Maki

IPC: G06F019/00 ,  B23K001/00 ,  G06K009/00 ,  G05B019/00

CPC classification number: H01L24/85 ,  B23K20/10 ,  G05B19/4015 ,  G05B2219/37555 ,  G05B2219/45033 ,  G05B2219/50033 ,  G05B2219/50035 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/78703 ,  H01L2224/78801 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: So as to achieve accurate detection of the bonding tool position in, for instance, a wire bonding apparatus, the positional relationship between a position detection camera and a reference hole formed in, for instance, a clamper is measured by imaging the reference hole by the position detection camera. The position detection camera and a bonding tool are moved by an XY table, and the tip end of the bonding tool is inserted into the reference hole. Then, the bonding tool is moved in the X and Y directions, and the contact of the bonding tool to an edge of the reference hole is detected based upon changes in the waveform of the ultrasonic vibrations applied to the bonding tool, thus measuring the positional relationship between the tool and the reference hole. The offset amount between the position detection camera and the bonding tool is then determined based upon the measured values and the amounts of movement of the bonding tool between the locations for such measured values.

Abstract translation: 为了实现例如引线接合装置中的接合工具位置的精确检测，通过将参考孔成像（例如）通过将参考孔成像，来测量位置检测摄像机和形成在例如钳位器中的参考孔之间的位置关系 位置检测摄像机。 位置检测摄像机和接合工具通过XY工作台移动，接合工具的前端插入到基准孔中。 然后，接合工具沿X和Y方向移动，并且基于施加到接合工具的超声波振动的波形的变化来检测接合工具与参考孔的边缘的接触，从而测量位置 工具与参考孔之间的关系。 然后基于测量值和粘合工具在这些测量值的位置之间的移动量来确定位置检测摄像机和接合工具之间的偏移量。

公开(公告)号：US20010010322A1

公开(公告)日：2001-08-02

申请号：US09817587

申请日：2001-03-26

Applicant: ROHM CO., LTD.

Inventor： Kazuya Ikoma

IPC: B23K001/00 ,  B23K031/00

CPC classification number: H01L24/85 ,  B23K31/125 ,  G01N3/00 ,  G01N3/08 ,  G01N19/04 ,  G01N2203/0296 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking method, first, a first position of the bonding tool is detected when the bonding of the wire is completed. Then, a pulling force, which is small enough to prevent breakage of the wire, is applied to the wire. In this state, a second position of the bonding tool is detected. Finally, the first and the second positions of the bonding tool are compared with each other.

Abstract translation: 提供一种检查引线条件的方法，其中引线键合条件是由导电线与诸如半导体芯片和引线之类的物体的结合而产生的。 导线由接合工具引导。 根据该检查方法，首先，当线的接合完成时，检测接合工具的第一位置。 然后，施加足够小以防止电线断裂的拉力。 在该状态下，检测接合工具的第二位置。 最后，将焊接工具的第一和第二位置相互比较。

公开(公告)号：US20040245317A1

公开(公告)日：2004-12-09

申请号：US10474070

申请日：2004-05-27

Inventor： Vladimir Larionov ,  Natalay Kouprina ,  J. Carl Barrett

IPC: B23K001/00

CPC classification number: C12N15/81 ,  C12N15/63 ,  C12N15/85 ,  C12N2800/204 ,  C12N2800/206 ,  C12N2800/208

Abstract: Disclosed are artificial chromosomes based on centromeric sequences having specific alphoid repeats and alpha satellites.

Abstract translation: 公开了基于具有特定的亚晶重复和α卫星的着丝粒序列的人造染色体。

公开(公告)号：US20040238598A1

公开(公告)日：2004-12-02

申请号：US10883670

申请日：2004-07-06

Applicant: Stavo Industries, Inc.

Inventor： Richard Timperio

IPC: B23K001/00

CPC classification number: B01D25/164 ,  B01D25/215 ,  Y10T29/49604

Abstract: A wrought metal single piece filter outlet plate or inlet frame, which is weld free in the liquid contact areas and sealing surface areas. The frame is used as an inlet frame or as an outlet plate for a horizontal or vertical type filter unit. The support ears on the sides of the plate and frame are an integral part of the wrought plate or frame, welded to the plate or frame or attached to the plate or frame utilizing any number of fasteners. Advantageously, the filter elements may be mounted in a filter press assembly at an angle to increase drainage.

Abstract translation: 锻造金属单件过滤器出口板或入口框架，其在液体接触区域和密封表面区域中无焊接。 框架用作入口框架或用作水平或垂直型过滤器单元的出口板。 板和框架侧面的支撑耳是锻造板或框架的整体部分，焊接到板或框架上，或者使用任何数量的紧固件附接到板或框架。 有利地，过滤器元件可以以一定角度安装在压滤机组件中以增加排水。

公开(公告)号：US20040149805A1

公开(公告)日：2004-08-05

申请号：US10358650

申请日：2003-02-05

Inventor： Carl T. Ito

IPC: B23K001/00

CPC classification number: B23K1/0016 ,  B23K2101/36 ,  H05K3/3478

Abstract: A solder ball dispenser (100) has feeder unit and head unit chambers (200, 300) and a pneumatic singulator (370). Solder balls (101) are put into motion in the chambers by moving air. The pneumatic singulator and a channel for solder balls are formed, machined or molded in a head plate (142) of a dispenser and enclosed by a front plate (141) and a back plate (143) secured adjacent to the head plate. The solder ball dispenser receives a continuous supply of unorganized solder balls and arranges them in a single stack (340). The pneumatic singulator ejects the balls one at a time to a target device such as a Ball Grid Array (BGA). The dispenser has a plurality of conduits (331-338) for applying one of air pressure and vacuum to various points of the chambers and the channel. Solder balls are transported through the dispenser and ejected from the dispenser by the programmed application of air pressure and vacuum. The trajectory of each solder ball is stopped before moving to a next position in the pneumatic singulator. No solid object causes solder balls to move within the dispenser or to be ejected from the dispenser.

Abstract translation: 焊球分配器（100）具有馈送单元和头单元室（200,300）和气动分离器（370）。 焊球（101）通过移动空气在腔室中运动。 气动分切机和用于焊球的通道在分配器的头板（142）中形成，加工或模制，并由靠近头板固定的前板（141）和后板（143）封闭。 焊球分配器接收连续供应的无组织焊球并将它们排列在单个堆叠（340）中。 气动分选机一次一个地将球弹出到诸如球栅阵列（BGA）的目标装置。 分配器具有多个用于将气压和真空中的一个施加到腔室和通道的各个点的导管（331-338）。 焊球通过分配器运送并通过编程应用空气压力和真空从分配器喷出。 在移动到气动单片机中的下一个位置之前，停止每个焊球的轨迹。 没有固体物体会使焊球在分配器内移动或从分配器中排出。

公开(公告)号：US20040134967A1

公开(公告)日：2004-07-15

申请号：US10704215

申请日：2003-11-06

Applicant: Conductis, Inc.

Inventor： Brian H. Moeckly ,  Kookrin Char

IPC: B23K001/00

CPC classification number: H01L39/2496

Abstract: A process is provided for fabricating YBa2Cu3O7 thin-film edge junctions in which no deposited barrier is employed. These devices display excellent RSJ-type I-V characteristics with values of Ic and Rn tunable over a useful range for operation of digital circuits.

Abstract translation: 提供了一种用于制造其中不使用沉积的屏障的YBa2Cu3O7薄膜边缘结的方法。 这些器件显示出良好的RSJ型I-V特性，Ic和Rn的值可在数字电路的有用范围内进行调节。

公开(公告)号：US20040112938A1

公开(公告)日：2004-06-17

申请号：US10451589

申请日：2004-01-20

Inventor： Helmut Kahl ,  Bernd Tiburtius

IPC: B23K001/00

CPC classification number: H05K9/0015 ,  Y10S277/919

Abstract: The invention relates to a method for producing an electromagnetic shielding gasket. The task is accomplished, according to the invention, through a method according to claim 1 as well as an electrical apparatus having a corresponding gasket according to claim 6. Advantageous further developments are described in the dependent claims. Method for producing an electromagnetic shielding gasket by means of a shielding substance that contains a silicone plastic mass, electrically-conducting components, and components that are expandable under the influence of heat, in which method the gasket compound is dispensed onto a housing and/or printed circuit board and/or housing parts, and after and/or during the dispensing is treated with heat, thereby obtaining its desired, predetermined expansion and/or shape.

Abstract translation: 本发明涉及一种电磁屏蔽垫片的制造方法。 根据本发明，通过根据权利要求1的方法以及具有根据权利要求6所述的相应垫圈的电气设备完成了该任务。在从属权利要求中描述了有利的进一步发展。 用于通过包含硅树脂塑料块，导电部件和在热影响下可膨胀的部件的屏蔽物质制造电磁屏蔽垫片的方法，其中将垫片复合物分配到壳体和/或 印刷电路板和/或壳体部件，并且在分配之后和/或在分配期间用热处理，从而获得其期望的预定膨胀和/或形状。