公开(公告)号：US20030150113A1

公开(公告)日：2003-08-14

申请号：US10357150

申请日：2003-02-03

申请人： KONICA CORPORATION

发明人： Takeshi Ito ,  Hiroyuki Nomori

IPC分类号： B21D053/76 ,  H05K003/10 ,  B41J002/045

CPC分类号： B41J2/1632 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2/1631 ,  B41J2/1637 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1645 ,  Y10T29/49155 ,  Y10T29/49401

摘要： A manufacturing method of an inkjet head, which jets, by shear deformation of a partition wall, an ink in an ink flow path, having the steps of: forming a metal electrode on a surface of the partition wall; coating an adhesive agent on the cover board; superposing the cover board onto an upper end surface of the partition wall under the state satisfying the following condition 1, so that the ink flow path is formed with the partition wall and the cover plate; and pressing the channel board and the cover board under the state satisfying the following condition 1 all the time, and experiencing the following condition 2. (Condition 1): Hardness of the adhesive agent is not less than 105 dyne/cm2. (Condition 2): Hardness of the adhesive agent is not less than 105 dyne/cm2 and not greater than 109 dyne/cm2.

摘要翻译： 一种喷墨头的制造方法，其通过分隔壁的剪切变形喷射墨水流路中的油墨，具有以下步骤：在分隔壁的表面上形成金属电极; 在盖板上涂覆粘合剂; 在满足以下条件1的状态下将盖板叠置在分隔壁的上端表面上，使得墨流动路径形成有分隔壁和盖板; 并且一直满足以下条件1的状态下按压通道板和盖板，并且经历以下条件2.（条件1）：粘合剂的硬度不小于105达因/厘米2。 （条件2）：粘合剂的硬度不低于105达因/厘米2，不大于109达因/厘米2。

公开(公告)号：US20030145458A1

公开(公告)日：2003-08-07

申请号：US10279980

申请日：2002-10-25

申请人： FUJITSU LIMITED

发明人： Motoaki Tani ,  Nobuyuki Hayashi ,  Tomoyuki Abe

IPC分类号： H05K003/36 ,  H05K003/02 ,  H05K003/10

CPC分类号： H05K3/4661 ,  H05K3/108 ,  H05K3/38 ,  H05K3/389 ,  H05K2201/0175 ,  H05K2203/0315 ,  H05K2203/066 ,  H05K2203/1152 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method is provided for manufacturing a multilayer wiring board wherein good adhesion is achieved between an insulating layer and a wiring pattern. The multilayer wiring board has a laminar structure which includes insulating layers and a wiring pattern. The method includes at least the steps of sticking a support whose surface has been treated with a coupling agent onto an insulating layer with a coupling agent interposed therebetween, and transferring the coupling agent to the insulating layer by removing the support while leaving the coupling agent on the insulating layer.

摘要翻译： 提供一种用于制造多层布线板的方法，其中在绝缘层和布线图案之间实现良好的粘合。 多层布线基板具有包括绝缘层和布线图案的层状结构。 该方法至少包括以下步骤：将其表面已经用偶联剂处理的载体粘附到绝缘层上，其间插入有偶联剂，并且通过在离开偶联剂的同时除去载体将偶联剂转移到绝缘层上 绝缘层。

公开(公告)号：US20030089521A1

公开(公告)日：2003-05-15

申请号：US10291606

申请日：2002-11-12

申请人： LG Electronics Inc.

发明人： Sung-Gue Lee ,  Yong-Il Kim

IPC分类号： H05K001/09 ,  H05K003/10

CPC分类号： H05K3/243 ,  H05K3/28 ,  H05K2201/09881 ,  H05K2203/0597 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

摘要： Bonding pad(s) formed on a printed circuit board with circuit patterns. The bonding pad(s) include a plurality of copper patterns formed on the PCB and electrically connected to the circuit patterns, a filler filled between the copper patterns such that an upper surface of the copper pattern is exposed, and a plating layer applied at an upper surface of the copper patterns. An interval between wire bonding pad(s) is reduced by preventing a nickel plating layer and a gold plating layer from protruding at a lower portion of a copper pattern when they are formed on the copper patterns.

摘要翻译： 在印刷电路板上形成的具有电路图案的接合焊盘。 焊盘包括形成在PCB上并电连接到电路图案的多个铜图案，填充在铜图案之间的填充物，使得铜图案的上表面暴露，并且镀覆层 铜图案的上表面。 通过防止镀镍层和镀金层在铜图案上形成时在铜图案的下部突出，从而降低引线接合焊盘之间的间隔。

公开(公告)号：US20030088978A1

公开(公告)日：2003-05-15

申请号：US10291468

申请日：2002-11-12

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Akihito Takano ,  Akira Fujisawa ,  Akio Rokugawa

IPC分类号： H05K003/02 ,  H05K003/10

CPC分类号： H05K1/162 ,  H01L21/4857 ,  H05K3/048 ,  H05K3/388 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2203/0315 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A process is provided for manufacturing a multiple layer wiring board incorporated therein a thin-film capacitor. The process comprising the following steps of: covering a first conductor pattern formed on an insulating layer, except for a lower electrode forming region of a thin film capacitor, with a first resist film; forming a metallic film layer consisting of a barrier metal layer and tantalum metal layer, in this order, on an entire face of the first conductor pattern covered with the first resist film; removing the first resist film to remove the metallic film layer, except for the lower electrode forming region, from a face of the first conductive pattern; covering a face of the first conductor pattern, except for a lower electrode forming region of the first conductor pattern, with a second resist film; forming an anodic oxidation film on the metallic film layer exposed from the second resist film; removing the second resist film and attaching an adherence layer and a metal seed layer, in this order, on the anodic oxidation film and on the conductor pattern; and forming a second conductor pattern, which becomes an upper electrode, on the anodic oxidation film.

摘要翻译： 提供了一种制造并入薄膜电容器的多层布线板的工艺。 该方法包括以下步骤：用第一抗蚀剂膜覆盖形成在绝缘层上的除了薄膜电容器的下电极形成区域之外的第一导体图案; 在覆盖有第一抗蚀剂膜的第一导体图案的整个表面上依次形成由阻挡金属层和钽金属层构成的金属膜层; 从第一导电图案的表面除去第一抗蚀剂膜以除去除了下电极形成区域之外的金属膜层; 用第二抗蚀剂膜覆盖第一导体图案的除了第一导体图案的下电极形成区域的面; 在从第二抗蚀剂膜露出的金属膜层上形成阳极氧化膜; 去除第二抗蚀剂膜并依次附着在阳极氧化膜上和导体图案上的附着层和金属种子层; 并在阳极氧化膜上形成成为上电极的第二导体图案。

公开(公告)号：US20030088976A1

公开(公告)日：2003-05-15

申请号：US10328476

申请日：2002-12-24

发明人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

IPC分类号： H05K003/30 ,  H05K003/10

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/5137 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method and device for providing a gate blocking material. Specifically, a method for molding a substrate having known good and bad sites thereon, by blocking the gate area of the bad sites during the molding process. A blocking material or an injection pin are used to interrupt the flow of molding compound through an injection molding system, and thereby prevent molding compound from flowing onto the known bad substrate sites.

公开(公告)号：US20030051340A1

公开(公告)日：2003-03-20

申请号：US10179552

申请日：2002-06-24

申请人： Honeywell International , Inc.

发明人： David A. Nelson ,  Tuan N. Nguyen ,  Chris L. Joseph ,  Glen M. Whiting

IPC分类号： H05K005/00 ,  H05K005/04 ,  H05K005/06 ,  H05K003/02 ,  H05K003/10

CPC分类号： H05K9/0039 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/325 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10166 ,  H05K2201/10409 ,  Y10T29/49155

摘要： A circuit on a printed circuit board transmits radio frequency (RF) signals. A modulator operatively coupled to the printed circuit board modulates a signal to be transmitted by modulating an information signal onto a carrier signal. A ground plane attaches to edges and to first and second surfaces of the printed circuit board. The ground plane electrically connects to components of the modulator. A power transistor physically attaches to the printed circuit board and electrically connects to the ground plane through a slot in the printed circuit board. The ground plane provides a suitable ground reference potential for both the modulator and the power transistor without individually constructed circuit boards for each. A ground isolation barrier formed on the ground plane may prevent nullcross talknull between the modulator and the power transistor.

摘要翻译： 印刷电路板上的电路传输射频（RF）信号。 可操作地耦合到印刷电路板的调制器通过将信息信号调制到载波信号上来调制要发送的信号。 接地平面连接到印刷电路板的边缘和第一和第二表面。 接地平面电连接到调制器的组件。 功率晶体管物理地连接到印刷电路板，并通过印刷电路板中的槽电连接到接地平面。 接地平面为调制器和功率晶体管提供合适的接地参考电位，而不需要为每个电路板提供单独的电路板。 在接地平面上形成的接地隔离屏障可以防止调制器和功率晶体管之间的“串扰”。

公开(公告)号：US20030042045A1

公开(公告)日：2003-03-06

申请号：US09941058

申请日：2001-08-28

发明人： David C. Koskenmaki ,  Michael N. Miller ,  Naiyong Jing

IPC分类号： H05K001/11 ,  H01R012/04 ,  H05K003/10

CPC分类号： H05B3/86 ,  G02F1/13439 ,  G02F1/155 ,  H05B3/286 ,  H05B2203/017 ,  H05K3/102 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0133 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/09827 ,  H05K2203/0278 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A method for making a fine electrically conductive grid embedded in a polymer substrate. The method includes the steps of providing a polymer substrate, forming a pattern of grooves in the substrate, filling the grooves with electrically conductive powder, and then applying heat and/or pressure to the substrate. The application of heat and/or pressure to the substrate causes the grooves to collapse inward against the conductive powder. Collapsing the grooves compacts the conductive powder within the groove, thereby establishing a continuously conductive grid line or circuit. The narrow grid lines that result allow more light to transmit through the substrate. The method allows grid lines to be made with higher aspect ratios (ratio of line depth to line width) than is possible by previous methods.

摘要翻译： 一种制造嵌入聚合物基板中的精细导电栅格的方法。 该方法包括以下步骤：提供聚合物基材，在基材中形成凹槽图案，用导电粉末填充凹槽，然后向基材施加热和/或压力。 向衬底施加热和/或压力导致沟槽相对于导电粉末向内折叠。 折叠凹槽压缩凹槽内的导电粉末，从而建立连续导电的栅格线或电路。 导致的窄栅格线允许更多的光透过基板。 该方法允许以比以前的方法可能的更高的纵横比（线深度与线宽的比率）制成网格线。

公开(公告)号：US20030041443A1

公开(公告)日：2003-03-06

申请号：US09942339

申请日：2001-08-30

申请人： NOVATECH ELECTROLUMINESCENT, INC.

发明人： William C. Stevenson ,  James L. Lau

IPC分类号： H05B033/10 ,  H05K003/10 ,  H01B013/00

CPC分类号： H01H13/83 ,  H01H2219/018 ,  H01H2219/037 ,  H01H2229/004 ,  H01H2229/016 ,  H01H2229/02 ,  H01H2229/038 ,  H01H2239/01 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A method for manufacturing low cost electroluminescent (EL) illuminated membrane switches is disclosed. The method includes the first step of die cutting, embossing or chemically etching the metal foil surface of a metal foil bonded, light transmitting flexible electrical insulation to simultaneously form one or more front capacitive electrodes, membrane switch contacts and electrical shunt, electrical distribution means and electrical terminations that together comprise a flexible printed circuit panel. This continuous flexible printed circuit substrate is then coupled to a precisely positioned indexing system. Next, the front metal foil capacitive electrodes are coated with a light transmissive electrically conductive layer. Then, a layer of electroluminescent phosphor is applied to the electrically conductive layer, a layer of capacitive dielectric is applied insulating the phosphor layer, a rear capacitive electrode is then applied over the capacitive dielectric layer, thus forming an electroluminescent lamp portion. Next, a transparent dielectric coating is applied to the entire surface of the lamp and substrate with open portions exposing electrical terminations, switch contacts and shunt. A spacer is applied to surround the switch shunt, providing an isolation barrier. An intermediary material is applied to the surface of the isolated rear EL electrode thus forming a switch actuator. Finally, the illuminated switch pattern is die-cut from the substrate material, and is then folded into three layers forming the final illuminated membrane switch.

摘要翻译： 公开了制造低成本电致发光（EL）照明薄膜开关的方法。 该方法包括对金属箔接合的金属箔表面进行模切，压花或化学蚀刻的第一步骤，透光柔性电绝缘体，以同时形成一个或多个前电容电极，薄膜开关触点和电分流，分配装置和 一起组成柔性印刷电路板的电气端子。 然后将该连续柔性印刷电路基板耦合到精确定位的分度系统。 接下来，前金属箔电容电极涂覆有透光导电层。 然后，将一层电致发光磷光体施加到导电层上，施加一层电容电介质，使磷光体层绝缘，然后将一个后电容电极施加在电容电介质层上，从而形成电致发光灯部分。 接下来，将透明电介质涂层施加到灯和基板的整个表面上，其中敞开的部分露出电终端，开关触点和分路。 应用间隔件来围绕开关分流器，提供隔离屏障。 将中间材料施加到隔离的后EL电极的表面，从而形成开关致动器。 最后，将照明的开关图案从基板材料上切下，然后折叠成三层，形成最终的照明薄膜开关。

公开(公告)号：US20020187317A1

公开(公告)日：2002-12-12

申请号：US09937962

申请日：2001-09-28

发明人： Hiroshi Tsuyuki ,  Osamu Hirose

IPC分类号： H05K003/10

CPC分类号： H01G4/0085 ,  H05K1/092 ,  Y10T29/49155 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The present invention provides a conductive pattern that has low electric resistivity, is superior in adhesion to a substrate and does not cause substrate cracking during plating, a multilayered substrate incorporating such a conductive pattern, and a fabricating method for a multilayered substrate. At first, a conductive composition including a metal powder containing not less than 95 mass % of Ag, a sintering restrainer containing Cr and/or Cr compound, a dielectric loss conditioner containing Mn and/or Mn compound, and a vehicle is prepared. Next, electrodes made of the conductive composition are formed on a plurality of green sheets. The plurality of green sheets formed with the electrodes are then laminated to form a laminated product, whereafter the laminated product is sintered.

摘要翻译： 本发明提供一种具有低电阻率的导电图案，在与基板的密合性方面优异，并且不会在电镀期间引起基板裂纹，包含这种导电图案的多层基板以及多层基板的制造方法。 首先，制备包含不少于95质量％Ag的金属粉末，含有Cr和/或Cr化合物的烧结抑制剂，含有Mn和/或Mn化合物的介电损耗调节剂和载体的导电组合物。 接着，在多个生片上形成由导电性组合物构成的电极。 然后将形成有电极的多个生片层叠以形成层压产品，之后将层压产品烧结。

公开(公告)号：US20020171528A1

公开(公告)日：2002-11-21

申请号：US09396277

申请日：1999-09-15

发明人： SHINYA UCHIBORI ,  TAKAAKI MIZUKAWA ,  YOSHINORI HATANAKA

IPC分类号： H05K003/10 ,  H05K003/02 ,  B23P019/00

CPC分类号： G08B13/242 ,  B32B2425/00 ,  B32B2519/02 ,  G06K19/07718 ,  G06K19/07749 ,  G08B13/2431 ,  G08B13/2437 ,  G08B13/244 ,  H01F5/003 ,  H01F41/041 ,  H05K3/041 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49073 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/532 ,  Y10T428/24917 ,  Y10T428/2817 ,  Y10T428/31681

摘要： A process for producing a resonant tag, wherein a metal foil having a thermal adhesion adhesive applied to at least one face thereof is stamped out into a circuit-like shape and is adhered to a base sheet, the process comprising: stamping out the metal foil into a predetermined shaped metal foil portion (4c) while being passed through a die roll (1) having thereon a stamping blade with a predetermined shape and a transfer roll (2) in contact with the die roll (1) which functions also as a die back-up roll; holding this metal foil portion obtained by the stamping-out operation onto the surface of the transfer roll by suction holes formed in the transfer roll; and thermally adhering the stamped metal foil portion to the base sheet (7) in contact with the transfer roll (2) at its another face by an adhesive roll (3) in contact with the transfer roll through the base sheet. The present invention has such advantages as no damage to the base sheet since the stamping-out operation for the metal foil and the thermal adhesion operation thereof to the base sheet are carried out in separate positions, and no requirement of carrier sheet because the resultant metal foil portion obtained by the stamping-out operation is sucked and held onto the surface of the transfer roll.

摘要翻译： 一种用于制造谐振标签的方法，其中将具有涂覆在其至少一个表面上的热粘合粘合剂的金属箔冲压成电路状形状并粘附到基片上，该方法包括：冲压出金属箔 在通过其上具有预定形状的冲压刀片的模具辊（1）和与模具辊（1）接触的转印辊（2）的同时，进入预定形状的金属箔片部分（4c） 后备卷 将通过冲压操作获得的该金属箔部分通过形成在转印辊中的吸孔保持在转印辊的表面上; 并且通过与转印辊通过基片接触的粘合辊（3）将冲压的金属箔部分热粘合到与转印辊（2）接触的基片（7）。 本发明具有这样的优点，因为金属箔的冲压操作和对基片的热粘合操作对基片的损伤是在分开的位置进行的，并且不需要载体片，因为所得的金属 通过冲压操作获得的箔片部分被吸引并保持在转印辊的表面上。