公开(公告)号：US20190047118A1

公开(公告)日：2019-02-14

申请号：US16059344

申请日：2018-08-09

申请人： Tokyo Electron Limited

发明人： Yoshiki Okamoto ,  Yasushi Takiguchi ,  Akihiro Kubo ,  Hayato Hosaka ,  Ryuto Ozasa

IPC分类号： B24B53/017 ,  B24B37/20 ,  B24B37/04

摘要： A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.

公开(公告)号：US20190009385A1

公开(公告)日：2019-01-10

申请号：US16025515

申请日：2018-07-02

申请人： EBARA CORPORATION

发明人： Yasumasa HIROO ,  Keita YAGI

IPC分类号： B24B53/017 ,  B24B37/005

CPC分类号： B24B53/017 ,  B24B37/005 ,  B24B37/013 ,  B24B37/107 ,  B24B49/105 ,  B24B49/12

摘要： A polishing apparatus comprises a dresser that can adjust swing speed in the scanning areas set on a polishing member along a swing direction, a height detection section that measures a surface height of the polishing member in a plurality of monitoring areas set on the polishing member along the swing direction of the dresser, a dress model matrix creation section that creates a dress model matrix defined from a plurality of monitoring areas, scanning areas and a dress model, an evaluation index creation section that calculates a height profile predicted value using the dress model, the swing speed in each scanning area or a staying time and sets evaluation index based on a difference from a target value of height profile of the polishing member and a moving speed calculation section that calculates the swing speed in each scanning area of the dresser based on the evaluation index.

公开(公告)号：US10166653B2

公开(公告)日：2019-01-01

申请号：US14233489

申请日：2012-07-16

申请人： Seh Kwang Lee ,  Joo Han Lee

发明人： Seh Kwang Lee ,  Joo Han Lee

IPC分类号： B24B53/017 ,  B24B53/12

摘要： The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.

公开(公告)号：US20180229343A1

公开(公告)日：2018-08-16

申请号：US15679355

申请日：2017-08-17

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Ho-joong KIM ,  Jun-yong KIM ,  Tae-sung KIM ,  Seok-jun HONG

IPC分类号： B24B37/005 ,  B24B53/017 ,  G01B21/30 ,  H01L21/67 ,  H01L21/687

CPC分类号： B24B37/005 ,  B24B53/017 ,  G01B11/303 ,  G01B21/30 ,  H01L21/30625 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/68714 ,  H01L22/20

摘要： A chemical mechanical polishing (CMP) device includes a rotatable CMP pad located on a polishing platen, a rotatable wafer carrier located on an upper portion of the CMP pad and including a wafer, and a surface-roughness measuring device which is located apart from a surface of the CMP pad in a vertical direction and measures surface roughness of the CMP pad, wherein the surface-roughness measuring device includes a sensor array having a plurality of sensors, and the sensor array is horizontally movable over the upper portion of the CMP pad.

公开(公告)号：US20180222007A1

公开(公告)日：2018-08-09

申请号：US15946843

申请日：2018-04-06

申请人： EBARA CORPORATION

发明人： Yasuyuki MOTOSHIMA ,  Toru MARUYAMA ,  Hisanori MATSUO

IPC分类号： B24B37/015 ,  B24B53/017 ,  B24B49/14 ,  B24B55/02 ,  B24B37/34

CPC分类号： B24B37/015 ,  B24B37/34 ,  B24B49/14 ,  B24B53/017 ,  B24B55/02

摘要： A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

公开(公告)号：US20180169830A1

公开(公告)日：2018-06-21

申请号：US15386941

申请日：2016-12-21

申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.

发明人： Charles J. Benedict ,  Aaron E. Lorin ,  Ryan Bortner

IPC分类号： B24B53/017 ,  B24B37/04 ,  B08B1/00 ,  B08B1/02 ,  B08B5/02 ,  B08B5/04 ,  B08B7/04

CPC分类号： B24B53/017 ,  B08B1/002 ,  B08B1/02 ,  B08B5/023 ,  B08B5/043 ,  B08B7/04 ,  B24B37/042

摘要： The present invention provides methods for cleaning the surface of CMP polishing pads comprising blowing a stream or curtain of forced air or gas from a source onto the surface of a CMP polishing pad substrate at a pressure of from 170 kPa (24.66 psig) to 600 kPa (87 psig), towards a vacuum source, the forced air or gas blowing at an angle of from 6 to 15° from a vertical plane which lies normal to the surface of the substrate, traverses the entire width of the surface of the substrate, and passes through the source of the forced air or gas, while, at the same time conveying along a horizontal plane the CMP polishing pad so that the entire surface of the CMP polishing pad surface is exposed to the forced air or gas at least one time; and, vacuuming the surface of the CMP polishing pad at a point on the surface which is downstream from a point at which the stream curtain of forced air or gas contacts the surface of the CMP polishing pad.

公开(公告)号：US20180147691A1

公开(公告)日：2018-05-31

申请号：US15659219

申请日：2017-07-25

申请人： LG SILTRON INCORPORATED

发明人： Chan Min JUNG

IPC分类号： B24B53/017 ,  H01L21/67 ,  B24B37/16 ,  B01L9/00 ,  B08B3/02

摘要： Disclosed is a surface plate cleaning apparatus which cleans the surfaces of surface plates having grooves. The surface plate cleaning apparatus includes an injection unit including an injection head, and at least one first injection nozzle and at least one second injection nozzle, and a moving unit configured to move the injection unit, the at least one first injection nozzle includes a first injection hole to inject a first cleaning solution, the at least one second injection nozzle includes a second injection hole to inject a second cleaning solution, a first separation distance from the upper surface of the injection head to the first injection hole and a second separation distance from the upper surface of the injection head to the second injection hole are different, and a first injection angle of the first cleaning solution and a second injection angle of the second cleaning solution are different.

公开(公告)号：US09969046B2

公开(公告)日：2018-05-15

申请号：US14696908

申请日：2015-04-27

申请人： EBARA CORPORATION

发明人： Yasuyuki Motoshima ,  Toru Maruyama ,  Hisanori Matsuo

IPC分类号： B24B37/015 ,  B24B55/02 ,  B24B37/34 ,  B24B49/14 ,  B24B53/017

CPC分类号： B24B37/015 ,  B24B37/34 ,  B24B49/14 ,  B24B53/017 ,  B24B55/02

摘要： A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

公开(公告)号：US20180085888A1

公开(公告)日：2018-03-29

申请号：US15279689

申请日：2016-09-29

申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.

发明人： Jeffrey James Hendron ,  Jeffrey Robert Stack

IPC分类号： B24B37/26 ,  B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24B53/017

CPC分类号： B24B37/26 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24B53/017

摘要： The present invention provides pre-conditioned chemical mechanical (CMP) polishing pads comprising a polymer, preferably, a porous polymer having a pad surface microtexture effective for polishing having a series of visibly intersecting arcs on the polishing layer surface, the intersecting arcs having a radius of curvature equal to or greater than half of the radius of curvature of the pad and extending all the way around the surface of the pad in radial symmetry around the center point of the pad wherein the resulting CMP polishing pad has a surface roughness of from 0.01 μm to 25 μm, Sq. The CMP polishing pads may be made by methods comprising grinding the surface of a CMP polishing pad with a rotary grinder to form the surface microtexture.

公开(公告)号：US20180056482A1

公开(公告)日：2018-03-01

申请号：US15429542

申请日：2017-02-10

申请人： TOSHIBA MEMORY CORPORATION

发明人： Takahiko KAWASAKI ,  Yukiteru MATSUI ,  Akifumi GAWASE

IPC分类号： B24B53/017 ,  H01L21/306

CPC分类号： B24B53/017 ,  H01L21/30625

摘要： According to one embodiment, a dresser includes a base metal plate, and a plurality of chip portions that are provided on the base metal plate. Each chip portion includes a Si substrate having a projection at an upper portion thereof and a diamond layer provided on the projection of the Si substrate.