Abstract:
A delay apparatus of a semiconductor integrated circuit includes a control signal generating unit configured to generate a block control signal and a unit control signal in response to a delay control signal; a plurality of delay blocks, connected in series to each other, and configured to generate a delay clock signal by delaying an input clock signal, wherein each of the delay blocks includes a predetermined number of unit delayers, and the plurality of the delay blocks are configured to be selectively activated in response to the block control signal; and a minute delay unit including a predetermined number of unit delayers and configured to generate an output clock signal by delaying the delay clock signal by adjusting an activation number of the provided unit delayers in response to the unit control signal.
Abstract:
The buffer circuit includes a differential amplifier differentially amplifying a reference node corresponding to a reference voltage and an input node corresponding to the input signal by sensing a potential difference of the reference voltage and the input signal. A coupling unit couples the input signal to the reference node, making it possible to improve the operating speed of the buffer circuit and operate normally when a level of the input signal or the reference voltage becomes low.
Abstract:
An internal voltage generator of a semiconductor memory device is capable of changing driving abilities between standby and active modes, to respond faster in the active mode and prevent a leakage current in the standby mode. The internal voltage generator of a semiconductor memory device comprises a driving controller for generating drive control signals having information about standby and active modes, a first voltage generator enabled by the drive control signals for comparing an internal voltage with a reference voltage in the standby and active modes, a first driver for generating the internal voltage according to a comparison performed by the first voltage generator, a second voltage generator enabled by the drive control signal for comparing the internal voltage with the reference voltage in the active mode, and a second driver for generating the internal voltage according to a comparison performed by the second voltage generator.
Abstract:
Disclosed is a precharge circuit of a semiconductor apparatus. The precharge circuit of a semiconductor memory apparatus includes a first precharge unit and a second precharge unit. The first precharge unit applies a first core voltage to a pair of local input/output lines, in response to a first precharge signal, to precharge the pair of local input/output lines. The second precharge unit applies a clamp voltage, which is generated using a first supply voltage, to the pair of local input/output lines, in response to the first precharge signal, to precharge the pair of local input/output lines.
Abstract:
There is provided a reference voltage generator that generates a constant reference voltage regardless of a change in temperature. The reference voltage generator includes a temperature-compensated current generating part for reducing a supply current provided to an output terminal in response to an increase of temperature, and a diode for receiving the supply current through the output terminal.
Abstract:
A semiconductor apparatus may include a master chip, first to nth slave chips, first to nth slave chip ID generating units, and a master chip ID generating unit. The first to nth slave chip ID generating units are disposed respectively in the first to nth slave chips and connected in series to each other. Each of the first to nth slave chip ID generating units is configured to add a predetermined code value to an mth operation code to generate an (m+1)th operation code. The master chip ID generating unit is disposed in the master chip to generate a variable first operation code in response to a select signal. Here, ‘n’ is an integer that is equal to or greater than 2, and ‘m’ is an integer that is equal to or greater than 1 and equal to or smaller than ‘n’.
Abstract:
In a semiconductor apparatus, a plurality of semiconductor chips including through-silicon vias are stacked in a vertical direction, wherein the through-silicon via formed in each semiconductor chip protrudes beyond heights of each semiconductor chip.
Abstract:
A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region surrounding the device formation region and formed between the device formation region and the scribe line region. The chip boundary region includes a guard ring structure which physically separates the device formation region from the scribe line region. The guard ring structure includes a signal transfer element which transfers an electric signal between the device formation region and the scribe line region.
Abstract:
A temperature detection circuit of a semiconductor memory apparatus includes a fixed period oscillator, a temperature variable signal generating unit and a counting unit. The oscillator is configured to generate a fixed period oscillator signal when an enable signal is enabled. The temperature variable signal generating unit is configured to generate a temperature variable signal whose enable interval varies based on temperature variations, when the enable signal is enabled. The counting unit is configured to count the oscillator signal during the enable interval of the temperature variable signal to generate a temperature information signal.
Abstract:
A circuit for shifting an address includes a shift cell block configured to sequentially shift address signals in response to shift control signals and a control cell block configured to generate the shift control signals for activating the shift cell block in a column unit using sequentially shifted read commands or write commands.