公开(公告)号：US6158351A

公开(公告)日：2000-12-12

申请号：US681138

申请日：1996-07-22

Applicant: Brian Mravic ,  Henry J. Halverson ,  Deepak Mahulikar

Inventor： Brian Mravic ,  Henry J. Halverson ,  Deepak Mahulikar

IPC: B22F1/00 ,  F42B12/74 ,  F42B1/00 ,  F42B8/14

CPC classification number: F42B12/745 ,  B22F1/0003 ,  F42B12/74

Abstract: A lead free ferromagnetic article is disclosed. The article is a compacted composite having a heavy more dense constituent that is preferably ferrotungsten and a less dense second constituent that is either a metal alloy or a polymer. The ferromagnetic constituent is present in an amount sufficient to impart the article with ferromagnetism. The ferromagnetic property allows fragments of the article, such as a projectile, bullet or shaped charge liner to be separated from dirt or other environments.

Abstract translation: 公开了一种无铅铁磁制品。 该制品是具有重的更致密的组分的压实复合材料，其优选是铁钨和不太致密的第二组分，其是金属合金或聚合物。 铁磁组分以足以赋予制品铁磁性的量存在。 铁磁性能允许制品的碎片，例如抛射物，子弹或成形的电荷衬垫与污垢或其它环境分离。

公开(公告)号：US5814759A

公开(公告)日：1998-09-29

申请号：US794286

申请日：1997-02-03

Applicant: Brian Mravic ,  Deepak Mahulikar ,  Gerald Noel Violette ,  Eugene Shapiro ,  Henry J. Halverson

Inventor： Brian Mravic ,  Deepak Mahulikar ,  Gerald Noel Violette ,  Eugene Shapiro ,  Henry J. Halverson

IPC: F42B7/00 ,  B22F1/00 ,  C22C1/05 ,  C22C27/04 ,  C22C29/08 ,  C22C32/00 ,  C22C38/00 ,  C22C38/12 ,  F42B7/04 ,  F42B12/72 ,  F42B12/74 ,  F42B30/02 ,  C22C33/02

CPC classification number: F42B7/046 ,  B22F1/0003 ,  C22C32/0094 ,  F42B12/74 ,  F42B12/745

Abstract: A composite lead-free bullet is disclosed comprising a heavy constituents selected from the group of tungsten, tungsten carbide, carballoy, and ferro-tungsten and a second binder constituent consisting of either a metal alloy or a plastic blend.

Abstract translation: 公开了一种复合无铅子弹，其包括选自钨，碳化钨，碳合金和铁 - 钨的重质组分和由金属合金或塑性共混物组成的第二粘合剂成分。

公开(公告)号：US5741544A

公开(公告)日：1998-04-21

申请号：US521858

申请日：1995-08-31

Applicant: Deepak Mahulikar

Inventor： Deepak Mahulikar

IPC: C23C16/04 ,  C23C16/44 ,  C23C16/455 ,  F28F19/06 ,  B05D7/22

CPC classification number: C23C16/4551 ,  C23C16/045 ,  C23C16/45589 ,  F28F19/06

Abstract: Various types of articles having various deposition coatings applied using a gas vapor deposition process are provided. A system evacuates gases from the article or a deposition chamber prior to depositing a coating. The coating may be applied throughout the inside of an article or may be selectively applied to a portion of the article. The article may be moved relative to the gas jet or the gas may be moved jet relative to the article. Stencils may be used to pattern the coating on the surface of the article. The articles are coated in a pressure of approximately 5 millitorr. Articles may be cylindrically shaped, leadframes on a reel, substrates, or printed circuit boards.

Abstract translation: 提供了使用气相沉积工艺应用各种沉积涂层的各种类型的制品。 在沉积涂层之前，系统从制品或沉积室排出气体。 涂层可以施用在制品的整个内部，或者可以选择性地施加到制品的一部分。 物品可以相对于气体射流移动，或者气体可以相对于物品移动。 模板可用于对制品表面上的涂层进行图案化。 制品以约5毫托的压力涂覆。 制品可以是圆柱形的，卷轴上的引线框架，基板或印刷电路板。

公开(公告)号：US5608267A

公开(公告)日：1997-03-04

申请号：US276381

申请日：1994-07-18

Applicant: Deepak Mahulikar ,  Derek E. Tyler ,  Jeffrey S. Braden ,  James M. Popplewell

Inventor： Deepak Mahulikar ,  Derek E. Tyler ,  Jeffrey S. Braden ,  James M. Popplewell

IPC: H01L23/28 ,  H01L23/12 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433

CPC classification number: H01L24/32 ,  H01L23/315 ,  H01L23/4334 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/86 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/3025

Abstract: There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached.

Abstract translation: 提供了具有改进的热耗散的模制塑料电子封装。 散热器，例如散热器或散热片部分地封装在模制树脂中。 散热器的密度小于铜的密度，并且导热系数恒定或随着封装周边接近而增加。

公开(公告)号：US5477008A

公开(公告)日：1995-12-19

申请号：US33919

申请日：1993-03-19

Applicant: Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Francis S. Jewell ,  Paul R. Hoffman ,  George Brathwaite ,  Richard McNabb ,  German Ramirez

Inventor： Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Francis S. Jewell ,  Paul R. Hoffman ,  George Brathwaite ,  Richard McNabb ,  German Ramirez

IPC: H01L23/04 ,  H01L23/10 ,  H05K5/06

CPC classification number: H01L23/10 ,  H01L23/04 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/16151 ,  H01L2924/16152 ,  Y10T29/49146

Abstract: There are provided polymer plugs for sealing the vent hole of an adhesively sealed electronic package. The polymer vent hole plug is selected to be either an ultraviolet curable polymer or a thermosetting polymer resin. One effective vent hole plug is a cylindrical plug having a diameter under 1.4 millimeters formed from a UV-curable epoxy.

Abstract translation: 提供了用于密封粘合密封电子封装的通气孔的聚合物塞。 聚合物排气孔塞被选择为紫外线固化聚合物或热固性聚合物树脂。 一个有效的通气孔塞是由UV可固化环氧树脂形成的直径小于1.4毫米的圆柱塞。

公开(公告)号：US5399187A

公开(公告)日：1995-03-21

申请号：US125946

申请日：1993-09-23

Applicant: Brian Mravic ,  Deepak Mahulikar ,  Gerald N. Violette ,  Eugene Shapiro ,  Henry J. Halverson

Inventor： Brian Mravic ,  Deepak Mahulikar ,  Gerald N. Violette ,  Eugene Shapiro ,  Henry J. Halverson

IPC: F42B7/00 ,  B22F1/00 ,  C22C1/05 ,  C22C27/04 ,  C22C29/08 ,  C22C32/00 ,  C22C38/00 ,  C22C38/12 ,  F42B7/04 ,  F42B12/72 ,  F42B12/74 ,  F42B30/02 ,  F42B1/00 ,  F42B8/14

CPC classification number: F42B7/046 ,  B22F1/0003 ,  C22C32/0094 ,  F42B12/74 ,  F42B12/745

Abstract: A composite lead-free bullet is disclosed comprising a heavy constituents selected from the group of tungsten, tungsten carbide, carballoy, and ferro-tungsten and a second binder constituent consisting of either a metal alloy or a plastic blend.

Abstract translation: 公开了一种复合无铅子弹，其包括选自钨，碳化钨，碳合金和铁 - 钨的重质成分和由金属合金或塑性共混物组成的第二粘合剂成分。

公开(公告)号：US5315155A

公开(公告)日：1994-05-24

申请号：US912535

申请日：1992-07-13

Applicant: Brian E. O'Donnelly ,  Brian Mravic ,  Jacob Crane ,  Deepak Mahulikar

Inventor： Brian E. O'Donnelly ,  Brian Mravic ,  Jacob Crane ,  Deepak Mahulikar

IPC: H01L21/52 ,  H01L23/00 ,  H01L23/047 ,  H01L23/433 ,  H01L23/02 ,  H01L23/12

CPC classification number: H01L24/32 ,  H01L21/52 ,  H01L23/047 ,  H01L23/433 ,  H01L23/562 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195

Abstract: There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the pedestal is less than that of the buffer, such that the at least a portion of the buffer overhangs the pedestal.

Abstract translation: 提供了一种电子封装组件，其具有接合到金属基底的引线框架和缓冲器。 为了减少由热膨胀失配系数产生的应力，将缓冲器安装在基座上。 基座的横截面面积小于缓冲器的横截面面积，使得缓冲器的至少一部分突出于基座。

公开(公告)号：US5098864A

公开(公告)日：1992-03-24

申请号：US640794

申请日：1991-01-14

Applicant: Deepak Mahulikar

Inventor： Deepak Mahulikar

IPC: H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49139

Abstract: A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and extend through the ordered array of holes. A dielectric polymer sealant bonds a cover component to both the circuit and to the base component. During package assembly, the polymer sealant flows into the holes comprising the ordered array of holes electrically isolating the terminal pins from the base component.

Abstract translation: 提供了一种金属针格栅阵列封装和用于组装封装的工艺。 该封装包括具有有序阵列的孔的金属或金属合金基底部件。 端子引脚电连接到所需的电路并延伸穿过有序阵列的孔。 电介质聚合物密封剂将覆盖组分粘合到电路和基底组分上。 在包装组装过程中，聚合物密封剂流入包括有序排列的孔的孔，使端子销与基座部件电隔离。

公开(公告)号：US5066368A

公开(公告)日：1991-11-19

申请号：US568818

申请日：1990-08-17

Applicant: Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Satish K. Jalota ,  Andrew J. Brock

Inventor： Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Satish K. Jalota ,  Andrew J. Brock

IPC: C25D11/04 ,  C25D11/06 ,  C25D11/14 ,  H01L23/06 ,  H05K3/44

CPC classification number: C25D11/14 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H05K3/44

Abstract: A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and surface finish are achieved by regulation of amperage during anodization. The amperage is rapidly raised to in excess of 70 amps per square foot and then allowed to gradually decrease as a function of oxide growth while the voltage is maintained in excess of 70 volts.

Abstract translation: 公开了一种从铝合金制造电子封装部件的方法。 这些组件通过整体颜色阳极氧化处理具有黑色。 所需的颜色，厚度和表面光洁度是通过在阳极氧化期间调节电流强度来实现的。 电流强度迅速提高到每平方英尺超过70安培，然后随着电压保持在70伏以上，随着氧化物生长而逐渐减小。

公开(公告)号：US4978052A

公开(公告)日：1990-12-18

申请号：US399687

申请日：1989-08-28

Applicant: Julius C. Fister ,  Satyam C. Cherukuri ,  Deepak Mahulikar ,  Brian E. O'Donnelly

Inventor： Julius C. Fister ,  Satyam C. Cherukuri ,  Deepak Mahulikar ,  Brian E. O'Donnelly

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/498

CPC classification number: H01L24/83 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/29 ,  H01L2224/29083 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29288 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/8389 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/157 ,  H01L2924/16152 ,  H01L2924/351 ,  Y10T29/4913

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.

Abstract translation: 提供了一种用于将半导体管芯附接到衬底的半导体管芯附接系统。 金属缓冲部件设置在基板和半导体管芯之间以承受由基板和模具的热循环产生的应力。 金属缓冲部件用一层焊料密封到基板上。 提供焊料层以消散由基板和模具的热循环产生的应力。 模具用银玻璃粘合剂密封到缓冲液。