公开(公告)号：US20190033575A1

公开(公告)日：2019-01-31

申请号：US16072157

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. OSTER ,  Feras EID ,  Johanna M. SWAN ,  Shawna M. LIFF ,  Aleksandar ALEKSOV ,  Thomas L. SOUNART ,  Baris BICEN ,  Valluri R. RAO

IPC: G02B26/08 ,  H01L41/047 ,  H01L41/27 ,  H01L41/332 ,  H01L41/314

Abstract: Embodiments of the invention include a piezo-electric mirror in an microelectronic package and methods of forming the package. According to an embodiment the microelectronic package may include an organic substrate with a cavity formed in the organic substrate. In some embodiments, an actuator is anchored to the organic substrate and extends over the cavity. For example, the actuator may include a first electrode and a piezo-electric layer formed on the first electrode. A second electrode may be formed on the piezo-electric layer. Additionally, a mirror may be formed on the actuator. Embodiments allow for the piezo-electric layer to be formed on an organic package substrate by using low temperature crystallization processes. For example, the piezo-electric layer may be deposited in an amorphous state. Thereafter, a laser annealing process that includes a pulsed laser may be used to crystallize the piezo-electric layer.

公开(公告)号：US20190032272A1

公开(公告)日：2019-01-31

申请号：US16072165

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Feras EID ,  Aleksandar ALEKSOV ,  Sasha N. OSTER ,  Baris BICEN ,  Thomas L. SOUNART ,  Valluri R. RAO ,  Johanna M. SWAN

IPC: D06M10/06 ,  D06M11/46 ,  D06M11/47 ,  H01L41/29 ,  H01L41/316 ,  H01L41/187 ,  H01L41/047

Abstract: Embodiments of the invention include an active fiber with a piezoelectric layer that has a crystallization temperature that is greater than a melt or draw temperature of the fiber and methods of forming such active fibers. According to an embodiment, a first electrode is formed over an outer surface of a fiber. Embodiments may then include depositing a first amorphous piezoelectric layer over the first electrode. Thereafter, the first amorphous piezoelectric layer may be crystallized with a pulsed laser annealing process to form a first crystallized piezoelectric layer. In an embodiment, the pulsed laser annealing process may include exposing the first amorphous piezoelectric layer to radiation from an excimer laser with an energy density between approximately 10 and 100 mJ/cm2 and pulse width between approximately 10 and 50 nanoseconds. Embodiments may also include forming a second electrode over an outer surface of the crystallized piezoelectric layer.

公开(公告)号：US20190008046A1

公开(公告)日：2019-01-03

申请号：US15639873

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Feras EID ,  Thomas L. SOUNART ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN

IPC: H05K1/16 ,  H01L23/498 ,  H01L21/48 ,  H05K3/12 ,  H05K3/00 ,  H05K3/22 ,  H05K3/46

Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a capacitor that is integrated with a first organic dielectric layer of the plurality of organic dielectric layers. The capacitor includes first and second conductive electrodes and an ultra-high-k dielectric layer that is positioned between the first and second conductive electrodes.

公开(公告)号：US20180286840A1

公开(公告)日：2018-10-04

申请号：US15765992

申请日：2015-11-04

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Adel A. ELSHERBINI ,  Lakshman KRISHNAMURTHY ,  Johanna M. SWAN ,  Alexander ESSAIAN ,  Torrey W. FRANK

IPC: H01L25/16 ,  H01L23/498 ,  H01L25/00 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L25/162 ,  H01L21/568 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/73 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24155 ,  H01L2224/24195 ,  H01L2224/73209 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/18162 ,  H01L2924/19105

Abstract: Embodiments are generally directed to three-dimensional small form factor system in package architecture. An embodiment of an apparatus includes a first package having a first side and an opposite second side, the first package including a plurality of embedded electronic components and one or more embedded via bars, each via bar including a plurality of through vias; and a second package having a first side and an opposite second side, the second package including a plurality of embedded electronic components, wherein a first side of the first package and a second side of second package are coupled together by a plurality of connections, including at least a first connection connecting the second package to a first component of the first package and a second connection connecting the second package to a first via bar of the one or more via bars.

公开(公告)号：US20180097458A1

公开(公告)日：2018-04-05

申请号：US15283117

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Feras EID ,  Adel A. ELSHERBINI ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H02N2/02 ,  H01L41/09 ,  H01L41/187 ,  H01L41/18

CPC classification number: H02N2/023 ,  G01J3/42 ,  H01L27/20 ,  H02N2/025 ,  H02N2/026 ,  H02N2/101

Abstract: Embodiments of the invention include a self-propelled sensor system. In an embodiment, the self-propelled sensor system includes a piezoelectrically actuated motor that is integrated with a substrate. In an embodiment, the self-propelled sensor system may also include a sensor and an integrated circuit electrically coupled to the piezoelectrically actuated motor. Embodiments of the invention may also include self-propelled sensor systems that include plurality of piezoelectrically actuated motors. In an embodiment the piezoelectrically actuated motors may be one or more different types of motors including, but not limited to, stick and slip motors, inchworm stepping motors, standing acoustic wave motors, a plurality of piezoelectrically actuated cantilevers, and a piezoelectrically actuated diaphragm. Additional embodiments of the invention may include a plurality of self-propelled sensor systems that are communicatively coupled to form a sensor mesh.

公开(公告)号：US20180006208A1

公开(公告)日：2018-01-04

申请号：US15199894

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H01L41/113 ,  G06F1/16 ,  H01L41/16

CPC classification number: H01L41/1136 ,  B81B2201/0235 ,  B81B2207/012 ,  B81C1/00476 ,  G06F1/1633 ,  G06F1/1694 ,  G06F2200/1637 ,  H01L41/1132 ,  H01L41/16

Abstract: Embodiments of the invention include a sensing device that includes a base structure having a proof mass that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. The proof mass deflects in response to application of an external force or acceleration and this deflection causes a stress in the piezoelectric material which generates a voltage differential between the first and second electrodes.

公开(公告)号：US20180004357A1

公开(公告)日：2018-01-04

申请号：US15199906

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN ,  Shawna M. LIFF

IPC: G06F3/043 ,  H03H9/25 ,  G06F3/041

CPC classification number: G06F3/0436 ,  G06F3/0416 ,  H01L2924/15311 ,  H01L2924/181 ,  H03H9/25 ,  H01L2924/00012

Abstract: Embodiments of the invention include an acoustic sensing device having a piezoelectric transmit transducer to receive input electrical signals and to generate a surface acoustic wave to be transmitted along a surface of the sensing device which is integrated with an organic substrate. The sensing device also includes a piezoelectric receive transducer to receive the surface acoustic wave and to generate output electrical signals and an input region integrated with the organic substrate. The input region is capable of receiving input which changes an acoustic amplitude of the surface acoustic wave.

公开(公告)号：US20180001640A1

公开(公告)日：2018-01-04

申请号：US15199899

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Shawna M. LIFF ,  Sasha N. OSTER ,  Thomas L. SOUNART ,  Georgios C. DOGIAMIS ,  Adel A. ELSHERBINI ,  Johanna M. SWAN

IPC: B41J2/14

CPC classification number: B41J2/14298 ,  B41J2/14201 ,  B41J2/14233 ,  B41J2002/14266 ,  B41J2202/13

Abstract: Embodiments of the invention include a piezoelectric package integrated jet device. In one example, the jet device includes a vibrating membrane positioned between first and second cavities of an organic substrate, a piezoelectric material coupled to the vibrating membrane which acts as a first electrode, and a second electrode in contact with the piezoelectric material. The vibrating membrane generates fluid flow through an orifice in response to application of an electrical signal between the first and second electrodes.

公开(公告)号：US20170288642A1

公开(公告)日：2017-10-05

申请号：US15088987

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Feras EID ,  Georgios C. DOGIAMIS ,  Valluri R. RAO ,  Adel A. ELSHERBINI ,  Johanna M. SWAN ,  Telesphor KAMGAING ,  Vijay K. NAIR

IPC: H03H9/54 ,  H03H9/05 ,  B01D21/30 ,  H03H9/17

CPC classification number: H03H9/54 ,  H03H9/05 ,  H03H9/0542 ,  H03H9/17 ,  H03H9/173 ,  H03H9/2463 ,  H03H2009/02503 ,  H03H2009/155

Abstract: Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.

公开(公告)号：US20170285695A1

公开(公告)日：2017-10-05

申请号：US15089001

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Feras EID ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Valluri R. RAO ,  Johanna M. SWAN

IPC: G06F1/18 ,  H03H9/54 ,  H03H9/56

CPC classification number: G06F1/18 ,  H03H9/0542 ,  H03H9/0557 ,  H03H9/542 ,  H03H9/545 ,  H03H9/56 ,  H03H9/587

Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.