公开(公告)号：US5707476A

公开(公告)日：1998-01-13

申请号：US530499

申请日：1995-09-19

申请人： Raschid Jose Bezama ,  John Ulrich Knickerbocker ,  Govindarajan Natarajan ,  Joseph Gang Zhou

发明人： Raschid Jose Bezama ,  John Ulrich Knickerbocker ,  Govindarajan Natarajan ,  Joseph Gang Zhou

IPC分类号： H01L21/48 ,  B32B31/04 ,  B32B31/20

CPC分类号： B32B37/26 ,  B32B37/0023 ,  H01L21/4857 ,  H01L21/486 ,  B32B2315/02

摘要： The present invention relates generally to a new apparatus and method for simultaneously laminating a plurality of substrates having at least one cavity. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic). A membrane with or without an opening is placed on the top surface of the unlaminated green sheet having at least one cavity and then standard pressure is applied to laminate the green sheets, while simultaneously a counter pressure is applied in the cavity to prevent the cavity from deforming or collapsing. This is done to simultaneously form a plurality of cavity substrates.

摘要翻译： 本发明一般涉及用于同时层压具有至少一个空腔的多个基板的新装置和方法。 更具体地说，本发明涵盖用于在MLC（多层陶瓷）中制造空腔的装置和方法。 具有或不具有开口的膜被放置在具有至少一个空腔的未层压生片的顶表面上，然后施加标准压力以层压生片，同时在空腔中施加反压力以防止空腔 变形或塌陷。 这样做同时形成多个空腔基板。

公开(公告)号：US5073180A

公开(公告)日：1991-12-17

申请号：US672517

申请日：1991-03-20

申请人： Shaji Farooq ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Richard A. Shelleman ,  Nancy C. Stoffel ,  Rao V. Vallabhaneni

发明人： Shaji Farooq ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Richard A. Shelleman ,  Nancy C. Stoffel ,  Rao V. Vallabhaneni

IPC分类号： C03B32/02 ,  C03C3/064 ,  C03C10/00 ,  C03C17/10 ,  C04B35/622 ,  C04B35/64 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46

CPC分类号： H05K3/4629 ,  H05K3/4611 ,  H05K1/0306 ,  H05K1/092 ,  Y10T29/49126 ,  Y10T29/49163

摘要： A method for forming a co-fired glass ceramic structure including the steps of:forming at least one green sheet of a first crystallizable glass in a thermally decomposable binder;metallizing the green sheet with a pattern of conductive paste including conductive metal, a second crystallizable glass and a thermally decomposable binder, the pattern including at least one via;firing the green sheet according to the following firing cycle steps:a. preheating the green sheet to a first temperature in a furnace with a neutral or reducing ambient so as to effect pyrolysis of the thermally decomposable binders, wherein the first temperature is insufficient to coalesce the first crystallizable glass or the conductive paste;b. introducing a steam ambient into the furnace and then heating the green sheet in the furnace at the first temperature to burn off the pyrolyzed binders;c. replacing the steam ambient with a neutral or reducing ambient and raising the temperature to a second temperature to effect densification and crystallization of the first and second glasses;d. maintaining the second temperature for a predetermined time to effect sealing of the at least one via wherein for a first portion of the predetermined time, the ambient in said furnace is a neutral or reducing ambient and for a second portion of the predetermined time, the neutral or reducing ambient is replaced with a steam ambient; ande. cooling the structure.

公开(公告)号：US4971738A

公开(公告)日：1990-11-20

申请号：US220192

申请日：1988-07-18

申请人： Lester W. Herron ,  Sarah H. Knickerbocker ,  Ananda Hosakere Kumar ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy

发明人： Lester W. Herron ,  Sarah H. Knickerbocker ,  Ananda Hosakere Kumar ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy

IPC分类号： C04B35/64 ,  B32B18/00 ,  C04B35/634 ,  C04B35/638 ,  H01L21/48 ,  H05K3/46

CPC分类号： C04B35/6342 ,  B32B18/00 ,  C04B35/634 ,  C04B35/638 ,  C04B35/645 ,  H01L21/4857 ,  C04B2235/6582 ,  C04B2235/6588 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/363 ,  C04B2237/68 ,  C04B2237/704

摘要： There is disclosed the enhancement of the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.

公开(公告)号：US20100200197A1

公开(公告)日：2010-08-12

申请号：US12698430

申请日：2010-02-02

申请人： Raschid J. Bezama ,  David C. Long ,  Govindarajan Natarajan ,  Thomas Weiss

发明人： Raschid J. Bezama ,  David C. Long ,  Govindarajan Natarajan ,  Thomas Weiss

IPC分类号： H01L23/473 ,  F28D15/00 ,  F28D11/06 ,  H01L23/433

CPC分类号： H01L23/4735 ,  F28D15/00 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/3733 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

摘要翻译： 本发明提供一种散热器及其使用方法，用于冷却集成电路（IC）芯片。 散热器包括歧管块，充满液体的冷却系统和固定到歧管块的柔性箔，并且由闭环冷却系统中的液体支撑。 由箔片后面的液体提供的压力导致箔片弯曲并符合IC芯片表面中的非平面性，从而减少了气隙并增加了IC芯片与散热片之间的热耦合。

公开(公告)号：US20070227173A1

公开(公告)日：2007-10-04

申请号：US11308504

申请日：2006-03-30

申请人： Raschid Bezama ,  Govindarajan Natarajan

发明人： Raschid Bezama ,  Govindarajan Natarajan

IPC分类号： F28D5/00 ,  F25D23/12

CPC分类号： H01L23/4735 ,  F28F3/12 ,  F28F13/02 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.

摘要翻译： 一种用于热控制的分配设备，系统和方法，其中歧管组件的板具有定位在其表面上的特定位置上的预定表面特征，以增强组件的冷却能力。 板的预定表面特征延迟了撞击板表面的流体的速度衰减，同时还增加了暴露于冲击液体的板的表面积，这进而使整体的可靠性和热性能最大化 热系统在给定的最大工作压力。

公开(公告)号：US06974358B2

公开(公告)日：2005-12-13

申请号：US10462275

申请日：2003-06-16

申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： H01F1/09 ,  H01F41/02 ,  H01J1/62 ,  H01J29/64 ,  H01J29/68

CPC分类号： H01J29/68

摘要： The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.

摘要翻译： 本发明一般涉及一种新的电介质形成金属/陶瓷层叠磁体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积层压磁体，用于电子和电子束控制的集成电介质形成金属板和电极的新方法。 本发明还涉及磁矩阵显示器和电子束源及其制造方法。

公开(公告)号：US20050214508A1

公开(公告)日：2005-09-29

申请号：US11137957

申请日：2005-05-26

申请人： Govindarajan Natarajan

发明人： Govindarajan Natarajan

IPC分类号： H01L21/48 ,  H05K1/03 ,  H05K3/00 ,  B32B3/10

CPC分类号： H01L21/481 ,  H01L21/486 ,  H05K1/0306 ,  H05K3/005 ,  H05K2201/2018 ,  H05K2203/0156 ,  Y10T83/0481 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/1062 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24347

摘要： Methods for forming and the intermediate greensheet products formed are provided by attaching a removable support film to a first surface of a greensheet and a frame to a second surface of the greensheet. The support film is preferably a peelable support film cast to the first surface of the greensheet for providing strength thereto. A plurality of openings are formed in the greensheet by punching into the support film, through the support film and then through the greensheet. During this process, the support film provides added strength to the greensheet therein significantly reducing embossing and deformation of such greensheet. A second support film may be attached to the removable support film using an adhesive layer, which, is extruded into the openings upon attachment. The support film(s) may be peeled off the greensheet with little or no impact on via locations as a metal frame continues to support the greensheet.

公开(公告)号：US06790515B2

公开(公告)日：2004-09-14

申请号：US10411906

申请日：2003-04-11

申请人： John U. Knickerbocker ,  Govindarajan Natarajan

发明人： John U. Knickerbocker ,  Govindarajan Natarajan

IPC分类号： B32B300

CPC分类号： B32B18/00 ,  B32B37/22 ,  B32B38/04 ,  B32B2038/042 ,  B32B2305/38 ,  B32B2305/77 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/38 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/567 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0169 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T428/161 ,  Y10T428/23 ,  Y10T428/24793 ,  Y10T428/24926

摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that the frame and greensheet side are substantially coplanar.

摘要翻译： 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其它方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并且被压入毛坯一侧，使得框架和毛坯面基本上共面。

公开(公告)号：US06607780B1

公开(公告)日：2003-08-19

申请号：US09578580

申请日：2000-05-25

申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Robert W. Pasco

发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Robert W. Pasco

IPC分类号： B05D512

CPC分类号： H01L21/486 ,  H05K1/0306 ,  H05K3/4061 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/09581 ,  H05K2203/0152 ,  H05K2203/0156 ,  Y10T29/49126 ,  Y10T156/1057 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.

摘要翻译： 本发明一般涉及一种新的陶瓷结构及其工艺。 基本上，本发明涉及一种用于形成层压结构的结构和方法，更具体地涉及一种使用非常薄的生坯片和/或具有非常致密导电图案的生片在多层陶瓷产品的顶部制造多层陶瓷产品的结构和方法 更强的支撑板。 本发明的结构和方法能够在制造多层陶瓷封装中筛选，堆叠和处理具有非常密集金属化图案的非常薄的生片和/或生片。 薄的生片被粘合到较厚和更坚固的支撑片上以形成在筛选中具有优异稳定性并能够进一步加工的亚结构。 这些片材以这样的方式锚定或固定，以便随后可以容易地移除支撑片材来处理生片。

公开(公告)号：US06423174B1

公开(公告)日：2002-07-23

申请号：US08668291

申请日：1996-06-21

申请人： Jon A. Casey ,  Govindarajan Natarajan ,  Robert W. Pasco ,  Vincent P. Peterson

发明人： Jon A. Casey ,  Govindarajan Natarajan ,  Robert W. Pasco ,  Vincent P. Peterson

IPC分类号： B32B3120

CPC分类号： B32B18/00 ,  B32B37/0023 ,  B32B2038/042 ,  B32B2309/12 ,  B32B2315/02 ,  C04B35/10 ,  C04B35/581 ,  C04B35/6455 ,  C04B2235/658 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/62 ,  C04B2237/64 ,  H01L21/4807

摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a coated membrane sheet is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the coated membrane is conveniently removed without causing damage to the cavity shelves or paste pull-outs.

摘要翻译： 本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。 更具体地，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将涂覆的膜片放置在空腔上方并使其符合空腔的轮廓，从而防止凹陷或损坏， 层压过程中的腔架。 在层压处理之后，方便地去除涂覆的膜，而不会损坏腔架或糊状物拉出。