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公开(公告)号：US06726984B2
公开(公告)日：2004-04-27
申请号：US10403239
申请日：2003-03-28
IPC分类号： B32B300
CPC分类号： H01L21/486 , H05K1/0306 , H05K3/4061 , H05K3/4614 , H05K3/4629 , H05K2201/09581 , H05K2203/0152 , H05K2203/0156 , Y10T29/49126 , Y10T156/1057 , Y10T428/24917 , Y10T428/24926
摘要： The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.
摘要翻译： 本发明一般涉及一种新的陶瓷结构及其工艺。 基本上，本发明涉及一种用于形成层压结构的结构和方法，更具体地涉及一种使用非常薄的生坯片和/或具有非常致密导电图案的生片在多层陶瓷产品的顶部制造多层陶瓷产品的结构和方法 更强的支撑板。 本发明的结构和方法能够在多层陶瓷封装的制造中筛选，堆叠和处理非常薄的生片和/或具有非常密集金属化图案的生片。 薄的生片被粘合到较厚和更坚固的支撑片上以形成在筛选中具有优异稳定性并能够进一步加工的亚结构。 这些片材以这样的方式锚定或固定，以便随后可以容易地移除支撑片材来处理生片。
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公开(公告)号：US06607780B1
公开(公告)日：2003-08-19
申请号：US09578580
申请日：2000-05-25
IPC分类号： B05D512
CPC分类号： H01L21/486 , H05K1/0306 , H05K3/4061 , H05K3/4614 , H05K3/4629 , H05K2201/09581 , H05K2203/0152 , H05K2203/0156 , Y10T29/49126 , Y10T156/1057 , Y10T428/24917 , Y10T428/24926
摘要： The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.
摘要翻译： 本发明一般涉及一种新的陶瓷结构及其工艺。 基本上，本发明涉及一种用于形成层压结构的结构和方法，更具体地涉及一种使用非常薄的生坯片和/或具有非常致密导电图案的生片在多层陶瓷产品的顶部制造多层陶瓷产品的结构和方法 更强的支撑板。 本发明的结构和方法能够在制造多层陶瓷封装中筛选，堆叠和处理具有非常密集金属化图案的非常薄的生片和/或生片。 薄的生片被粘合到较厚和更坚固的支撑片上以形成在筛选中具有优异稳定性并能够进一步加工的亚结构。 这些片材以这样的方式锚定或固定，以便随后可以容易地移除支撑片材来处理生片。
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公开(公告)号：US06509687B1
公开(公告)日：2003-01-21
申请号：US09450530
申请日：1999-11-30
IPC分类号： H01J2964
CPC分类号： H01J29/467 , H01J31/127
摘要： The present invention relates generally to a new electrode forming metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.
摘要翻译： 本发明一般涉及具有通孔的新型电极形成金属/磁陶瓷层压体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积陶瓷层压体磁体的新方法，用于电子和电子束控制的集成金属板和共烧结电极。 本发明还涉及磁矩阵显示器（MMD）和电子束源，及其制造方法。
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公开(公告)号：US06254925B1
公开(公告)日：2001-07-03
申请号：US09123928
申请日：1998-07-28
IPC分类号： C23C1606
CPC分类号： C23C16/08
摘要： The present invention discloses at least one source metal that is embedded in at least one inert material to form a stand-alone structure and process thereof. It is preferred that the source metal is nickel or alloy thereof, and the inert material is at least one ceramic.
摘要翻译： 本发明公开了至少一种源金属，其嵌入在至少一种惰性材料中以形成独立结构及其工艺。 源金属优选为镍或其合金，惰性材料为至少一种陶瓷。
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公开(公告)号：US06607620B2
公开(公告)日：2003-08-19
申请号：US09757071
申请日：2001-01-08
IPC分类号： B32B3118
CPC分类号： B32B18/00 , B32B37/22 , B32B38/04 , B32B2038/042 , B32B2305/38 , B32B2305/77 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/38 , C04B2237/50 , C04B2237/56 , C04B2237/561 , C04B2237/567 , C04B2237/62 , C04B2237/66 , C04B2237/68 , C04B2237/702 , C04B2237/704 , H01L21/4857 , H05K1/0306 , H05K3/00 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2203/0169 , Y10T156/1052 , Y10T156/1057 , Y10T156/108 , Y10T428/161 , Y10T428/23 , Y10T428/24793 , Y10T428/24926
摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that the frame and greensheet side are substantially coplanar.
摘要翻译： 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其他方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并且被压入毛坯一侧，使得框架和毛坯面基本上共面。
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公开(公告)号：US5541005A
公开(公告)日：1996-07-30
申请号：US438825
申请日：1995-05-11
申请人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katherine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sarah H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
发明人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katherine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sarah H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
IPC分类号： B28B11/02 , H01L21/48 , H01L21/768 , H01L23/15 , H01L23/522 , H05K1/03 , H05K1/14 , H05K3/46 , B22F3/105
CPC分类号： H05K1/142 , H01L21/4807 , H01L23/15 , H05K3/46 , H05K3/4629 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09972 , Y10T428/12049 , Y10T428/12146 , Y10T428/16 , Y10T428/163 , Y10T428/166 , Y10T428/192
摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
摘要翻译： 一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。 还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。
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7.发明授权Discrete magnets in dielectric forming metal/ceramic laminate and process thereof 失效电介质成形金属/陶瓷层压板中的离散磁体及其工艺公开(公告)号：US06974358B2
公开(公告)日：2005-12-13
申请号：US10462275
申请日：2003-06-16
CPC分类号： H01J29/68
摘要： The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.
摘要翻译： 本发明一般涉及一种新的电介质形成金属/陶瓷层叠磁体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积层压磁体，用于电子和电子束控制的集成电介质形成金属板和电极的新方法。 本发明还涉及磁矩阵显示器和电子束源及其制造方法。
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公开(公告)号：US06955777B2
公开(公告)日：2005-10-18
申请号：US10338093
申请日：2003-01-07
申请人： Govindarajan Natarajan , Umar Ahmad , Raschid J. Bezama , James N. Humenik , John U. Knickerbocker , Rao V. Vallabhaneni
发明人： Govindarajan Natarajan , Umar Ahmad , Raschid J. Bezama , James N. Humenik , John U. Knickerbocker , Rao V. Vallabhaneni
CPC分类号： B32B18/00 , B01J2219/00286 , B01J2219/00317 , B01L3/502707 , B01L3/5085 , B01L2200/12 , B01L2300/0816 , B01L2300/0819 , B01L2300/0887 , B01L2300/12 , B81B2203/0338 , B81B2203/0353 , B81C1/00119 , C04B35/645 , C04B2235/6567 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/62 , C04B2237/704
摘要： A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.
摘要翻译： 在制药工业中用于混合和测试材料的板材是通过一种方法形成的，其中通过材料去除工艺形成一组绿叶片中的孔，至少一些孔被填充有在烧结过程中逸出的逃逸材料 。
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公开(公告)号：US06790515B2
公开(公告)日：2004-09-14
申请号：US10411906
申请日：2003-04-11
IPC分类号： B32B300
CPC分类号： B32B18/00 , B32B37/22 , B32B38/04 , B32B2038/042 , B32B2305/38 , B32B2305/77 , C04B2237/341 , C04B2237/343 , C04B2237/366 , C04B2237/38 , C04B2237/50 , C04B2237/56 , C04B2237/561 , C04B2237/567 , C04B2237/62 , C04B2237/66 , C04B2237/68 , C04B2237/702 , C04B2237/704 , H01L21/4857 , H05K1/0306 , H05K3/00 , H05K3/4061 , H05K3/4611 , H05K3/4629 , H05K2203/0169 , Y10T156/1052 , Y10T156/1057 , Y10T156/108 , Y10T428/161 , Y10T428/23 , Y10T428/24793 , Y10T428/24926
摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that the frame and greensheet side are substantially coplanar.
摘要翻译： 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其它方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并且被压入毛坯一侧，使得框架和毛坯面基本上共面。
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公开(公告)号：US06413339B1
公开(公告)日：2002-07-02
申请号：US09470457
申请日：1999-12-22
申请人： Govindarajan Natarajan , Jon A. Casey , Martin E. Klepeis , John U. Knickerbocker , Srinivasa S. N. Reddy , Robert A. Rita , Subhash L. Shinde
发明人： Govindarajan Natarajan , Jon A. Casey , Martin E. Klepeis , John U. Knickerbocker , Srinivasa S. N. Reddy , Robert A. Rita , Subhash L. Shinde
IPC分类号： B32B3116
CPC分类号： C04B35/2683 , C04B35/64 , H01F1/0027 , H01F41/0253 , Y10T156/1056 , Y10T156/1057
摘要： The present invention relates generally to a new metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.
摘要翻译： 本发明一般涉及具有通孔的新的金属/磁陶瓷层压体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积陶瓷层压体磁体的新方法，用于电子和电子束控制的集成金属板和共烧结电极。 本发明还涉及磁矩阵显示器（MMD）和电子束源，及其制造方法。
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