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    Semiconductor devices with multiple substrates and die stacks
    71.
    发明授权
    Semiconductor devices with multiple substrates and die stacks 有权

    公开(公告)号：US11562987B2

    公开(公告)日：2023-01-24

    申请号：US17232333

    申请日：2021-04-16

    Applicant: Micron Technology, Inc.

    Inventor： Chin Hui Chong ,  Hong Wan Ng ,  Hem P. Takiar ,  Seng Kim Ye ,  Kelvin Tan Aik Boo

    IPC: H01L25/065 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31

    Abstract: Semiconductor devices having multiple substrates and die stacks, and associated systems and methods, are disclosed herein. In some embodiments, a semiconductor device includes a package substrate, and a first die stack mounted on the package substrate and including a plurality of first memory dies. The device can include a substrate mounted on the first die stack, the substrate including a plurality of routing elements. The device can also include a second die stack mounted on the substrate, the second die stack including a plurality of second memory dies. The device can further include a controller die mounted on the substrate. The controller die can be configured to communicate with the second die stack via the routing elements of the substrate. The device can include a mold material encapsulating the first die stack, the second die stack, the substrate, and the controller die.

    OVERLAPPING DIE STACKS FOR NAND PACKAGE ARCHITECTURE
    72.
    发明申请
    OVERLAPPING DIE STACKS FOR NAND PACKAGE ARCHITECTURE 有权

    公开(公告)号：US20220271007A1

    公开(公告)日：2022-08-25

    申请号：US17723386

    申请日：2022-04-18

    Applicant: Micron Technology, Inc.

    Inventor： Enyong Tai ,  Hem P. Takiar ,  Li Wang ,  Hong Wan Ng

    IPC: H01L25/065 ,  H01L23/00 ,  H01L25/18 ,  H01L25/00

    Abstract: A semiconductor device assembly includes a substrate, a first stack of semiconductor dies disposed directly over a first location on the substrate, and a second stack of semiconductor dies disposed directly over a second location on the substrate and electrically coupled to a second subset of the plurality of external connections. A portion of the semiconductor dies of the second stack overlaps a portion of the semiconductor dies of the first stack. The semiconductor device assembly further includes an encapsulant at least partially encapsulating the substrate, the first stack and the second stack.

    Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
    75.
    发明授权
    Semiconductor device assemblies including multiple shingled stacks of semiconductor dies 有权

    公开(公告)号：US11094670B2

    公开(公告)日：2021-08-17

    申请号：US16578592

    申请日：2019-09-23

    Applicant: Micron Technology, Inc.

    Inventor： Hong Wan Ng ,  Akshay N. Singh

    IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/50 ,  G11C5/04

    Abstract: A semiconductor device assembly includes a substrate having a plurality of external connections, a first shingled stack of semiconductor dies disposed directly over a first location on the substrate and electrically coupled to a first subset of the plurality of external connections, and a second shingled stack of semiconductor dies disposed directly over a second location on the substrate and electrically coupled to a second subset of the plurality of external connections. The semiconductor device assembly further includes an encapsulant at least partially encapsulating the substrate, the first shingled stack and the second shingled stack.

    Methods of operating microelectronic devices including a controller
    76.
    发明授权
    Methods of operating microelectronic devices including a controller 有权

    公开(公告)号：US10811387B2

    公开(公告)日：2020-10-20

    申请号：US16194888

    申请日：2018-11-19

    Applicant: Micron Technology, Inc.

    Inventor： Seng Kim Dalson Ye ,  Hong Wan Ng

    IPC: H01L25/065 ,  H01L23/49 ,  H01L25/00 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50

    Abstract: Semiconductor device packages include a stack of semiconductor memory devices positioned over an interposer substrate, a controller element, and a redistribution substrate positioned laterally adjacent to the controller element. At least a portion of the controller element is positioned directly between the stack and the interposer substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate. Methods of manufacturing a semiconductor device package include positioning a redistribution substrate laterally adjacent to a controller element and attaching the redistribution substrate and the controller element to an interposer substrate. A stack of semiconductor memory devices is positioned over the controller element and the redistribution substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate.

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