公开(公告)号：US11101247B2

公开(公告)日：2021-08-24

申请号：US15288501

申请日：2016-10-07

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  G02F1/13357 ,  H01L33/46 ,  F21V7/00 ,  F21V9/08 ,  F21V23/00 ,  H01L33/58 ,  H01L33/56 ,  G02F1/1335 ,  F21Y115/10

Abstract: A light-emitting device includes a base including a conductive wiring; a light-emitting element mounted on the base and configured to emit light; a light reflective film provided on an upper surface of the light-emitting element; and a encapsulant covering the light-emitting element and the light reflective film. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5.

公开(公告)号：US11073256B2

公开(公告)日：2021-07-27

申请号：US16903774

申请日：2020-06-17

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: H01L33/50 ,  F21V7/00 ,  H01L33/56 ,  H01L33/46 ,  H01L33/00 ,  H01L25/075 ,  H01L33/60 ,  F21Y105/10 ,  F21Y115/10

Abstract: A light-emitting device includes a base member, a plurality of light sources on or above an upper surface of the base member, and a reflector that comprises a plurality of surrounding portions. Each of the plurality of surrounding portions surrounds a respective one of the plurality of light sources in a plan view. Each of the plurality of surrounding portions has inclined lateral surfaces widened upward. Intervals between adjacent ones of the plurality of light sources are constant in the plan view. Upper peripheries of the inclined lateral surfaces of each of the plurality of surrounding portions define an opening having a substantially rectangular shape. The plurality of surrounding portions include a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the plurality of first surrounding portions. An area of the opening of each of the plurality of second surrounding portions is smaller than an area of the opening of each of the plurality of first surrounding portions.

公开(公告)号：US11015784B2

公开(公告)日：2021-05-25

申请号：US16288586

申请日：2019-02-28

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: F21V3/00 ,  F21V13/14 ,  F21V19/00 ,  F21V7/00 ,  F21V9/08 ,  F21V5/04 ,  F21V15/01 ,  F21V3/10 ,  F21V3/12 ,  F21V9/30 ,  F21V1/17 ,  F21V3/08 ,  F21V7/28 ,  F21Y115/10 ,  F21Y113/13

Abstract: A light emitting device includes a base, light sources, wall portions, and a half mirror. The base has a light reflecting surface and has a first side on which the light reflecting surface is provided. The light sources are mounted on the first side of the base. Each of the wall portions surrounds each of the plurality of light sources. The half mirror is to reflect a part of incident light and to transmit another part of the incident light. The half mirror is disposed opposite to the base such that the light sources are provided between the half mirror and the base.

公开(公告)号：US10993296B2

公开(公告)日：2021-04-27

申请号：US16731236

申请日：2019-12-31

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: H05B33/02 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/46 ,  H01L33/60 ,  H01L33/44 ,  H01L33/58

Abstract: A light-emitting module includes: a base body including electrical conductor wirings; a light-emitting element disposed on the base body and electrically connected to the electrical conductor wirings; a light reflection film disposed on an upper surface of the light-emitting element; and a half mirror disposed on a light extraction surface side of the light-emitting element and spaced apart from the light-emitting element. A spectral reflectance of the half mirror under perpendicular incidence at a wavelength longer than a peak emission wavelength of a light emitted from the light-emitting element is greater than a spectral reflectance of the half mirror under perpendicular incidence at the peak emission wavelength.

公开(公告)号：US10920960B2

公开(公告)日：2021-02-16

申请号：US16784616

申请日：2020-02-07

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: F21V7/00 ,  F21V3/00 ,  H01L33/62 ,  H01L33/54 ,  H01L33/50 ,  F21K9/68 ,  H01L25/075 ,  H01L33/60 ,  F21Y115/10

Abstract: A light-emitting device includes: a base member that comprises conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.

公开(公告)号：US10593833B2

公开(公告)日：2020-03-17

申请号：US16458664

申请日：2019-07-01

Applicant: Nichia Corporation

Inventor： Isamu Niki ,  Motokazu Yamada ,  Masahiko Sano ,  Shuji Shioji

IPC: H01L33/16 ,  H01L33/00 ,  H01L33/20 ,  H01L33/22 ,  H01L21/02 ,  H01L33/26 ,  H01L33/32 ,  H01L33/24

Abstract: A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate.

公开(公告)号：US10319888B2

公开(公告)日：2019-06-11

申请号：US15350330

申请日：2016-11-14

Applicant: NICHIA CORPORATION

Inventor： Mototaka Inobe ,  Motokazu Yamada ,  Kazuhiro Kamada

IPC: H01L21/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/52 ,  H01L33/20 ,  H01L33/56 ,  H01L33/32 ,  H01L33/62 ,  H01L25/075

Abstract: A method of manufacturing a light emitting device including providing a light emitting element mounted on a substrate. The light emitting element is provided within a first cavity of the light emitting device. The method further includes covering continuously, with insulating material, at least side surfaces of the light emitting element. Light reflective resin is provided over the insulating material at a position surrounding the light emitting element to reflect light from the light emitting element.

公开(公告)号：US10230034B2

公开(公告)日：2019-03-12

申请号：US15845714

申请日：2017-12-18

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Ryota Seno ,  Kazuhiro Kamada

IPC: H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L23/00 ,  H01L33/00 ,  H01L25/16 ,  H01L33/52 ,  H01L25/075 ,  H01L33/48 ,  H01L33/54

Abstract: A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).

公开(公告)号：US09768365B2

公开(公告)日：2017-09-19

申请号：US15067631

申请日：2016-03-11

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: H01L29/18 ,  H01L33/00 ,  H01L33/56 ,  H01L33/44 ,  H01L33/62 ,  H01L25/075 ,  H05K1/18 ,  H05K3/00 ,  F21V21/08 ,  F21S4/24 ,  H01L33/08 ,  H01L33/54 ,  F21Y103/10 ,  F21Y115/10

CPC classification number: H01L33/56 ,  F21S4/24 ,  F21V21/0808 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A light emitting device includes a flexible substrate, at least one light emitting element, a sealing resin and an adhesion layer. The flexible substrate includes a flexible base member and a plurality of wiring portions disposed on one surface of the base member. At least one light emitting element is arranged on a first surface of the flexible substrate and electrically connected to the wiring portions. The sealing resin seals the light emitting element. The adhesion layer is arranged on a second surface of the flexible substrate different from the first surface of the flexible substrate. The adhesion layer has a non-adhesive region corresponding at least to a region on the first surface where the at least one light emitting element is arranged. The non-adhesive region is covered with a non-adhesive layer.

公开(公告)号：US09525115B2

公开(公告)日：2016-12-20

申请号：US14517965

申请日：2014-10-20

Applicant: NICHIA CORPORATION

Inventor： Mototaka Inobe ,  Motokazu Yamada ,  Kazuhiro Kamada

IPC: H01L21/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/52 ,  H01L33/20 ,  H01L33/56 ,  H01L25/075

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/32 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light emitting device includes a substrate, metallization, a light emitting element, conducting wire, light reflective resin, and insulating material. The metallization is provided on a surface of the substrate that is made of insulating substance. The light emitting element is mounted on the substrate. The conducting wire electrically connects the metallization and the light emitting element. The light reflective resin is provided on the substrate to reflect light from the light emitting element. The insulating material covers at least part of metallization surfaces. The insulating material is established to come in contact with a side of the light emitting element.

Abstract translation: 发光装置包括基板，金属化，发光元件，导线，光反射树脂和绝缘材料。 金属化被设置在由绝缘物质制成的基板的表面上。 发光元件安装在基板上。 导线将金属化和发光元件电连接。 光反射树脂设置在基板上以反射来自发光元件的光。 绝缘材料覆盖至少部分金属化表面。 建立绝缘材料以与发光元件的一侧接触。