Light emitter array
    71.
    发明授权
    Light emitter array 有权
    发光二极管阵列

    公开(公告)号:US09425172B2

    公开(公告)日:2016-08-23

    申请号:US12288957

    申请日:2008-10-24

    摘要: Lamps, luminaries or solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. The discrete light sources are arranged in an array pursuant to certain guidelines to promote mixing of light from light sources emitting different colors of light. One embodiment solid state lighting component comprises a light emitting diode (LED) component having an array of LED chips having a first group of LED chips and one or more additional groups of LED chips. The array is arranged so that no two LED chips from said first group are directly next to one another in the array, that less than fifty percent (50%) of the LED chips in the first group of LEDs is on the perimeter of the array, and at least three LED chips from the one or more additional groups is adjacent each of the LED chips in the first group.

    摘要翻译: 公开了具有多个离散光源的灯,照明器件或固态照明部件,光源组合以提供期望的发射特性。 离散的光源按照某些原则排列成阵列,以促进来自发射不同颜色光的光源的光的混合。 一个实施例的固态照明部件包括具有LED芯片阵列的发光二极管(LED)部件,其具有第一组LED芯片和一个或多个另外的LED芯片组。 该阵列被布置成使得来自所述第一组的两个LED芯片在阵列中彼此直接相邻,第一组LED中的少于百分之五十(50%)的LED芯片位于阵列的周边上 并且来自一个或多个附加组的至少三个LED芯片与第一组中的每个LED芯片相邻。

    LAMP WITH REMOTE LED LIGHT SOURCE AND HEAT DISSIPATING ELEMENTS
    72.
    发明申请
    LAMP WITH REMOTE LED LIGHT SOURCE AND HEAT DISSIPATING ELEMENTS 有权
    具有远程LED光源和散热元件的灯

    公开(公告)号:US20130113358A1

    公开(公告)日:2013-05-09

    申请号:US13607300

    申请日:2012-09-07

    IPC分类号: F21V29/00

    摘要: LED based lamps and bulbs are disclosed that comprise an elevating element to arrange. LEDs above the lamp or bulb base. The elevating element can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure. A diffuser can be arranged in relation to the LEDs so at least some light from the LEDs passes through the diffuser and is dispersed into the desired emission pattern. Some lamps and bulbs utilize a heat pipe for the elevating elements, with heat from the LEDs conducting through the heat pipe to the heat sink structure where it can dissipate in the ambient. The LED lamps can include other features to aid in thermal management and to produce the desired emission pattern, such as internal optically transmissive and thermally conductive materials, and heat sinks with different heat fin arrangements.

    摘要翻译: 公开了基于LED的灯和灯泡,其包括用于布置的升降元件。 LED或灯泡基座上方的LED。 升降元件可以至少部分地包括导热材料。 包括散热器结构,其中升降元件热耦合到散热器结构。 扩散器可以相对于LED布置,使得来自LED的至少一些光通过扩散器并且被分散到期望的发射图案中。 一些灯泡和灯泡利用用于升降元件的热管,其中来自LED的热量通过热管传导到散热器结构,在那里可以在环境中消散。 LED灯可以包括其他特征以帮助热管理并产生期望的发射图案,例如内部透光和导热材料,以及具有不同散热片布置的散热器。

    LIGHTING DEVICE AND METHOD OF MAKING SAME
    75.
    发明申请
    LIGHTING DEVICE AND METHOD OF MAKING SAME 有权
    照明装置及其制造方法

    公开(公告)号:US20080089053A1

    公开(公告)日:2008-04-17

    申请号:US11870679

    申请日:2007-10-11

    申请人: Gerald Negley

    发明人: Gerald Negley

    IPC分类号: F21V9/16 H01J9/00

    摘要: A lighting device comprising a light emitter chip, a reflective cup and a lumiphor positioned between the chip and the cup. Also, a lighting device comprising a light emitter chip, a wire bonded to a first surface of the chip and a lumiphor which faces a second surface of the chip. Also, a lighting device comprising a light emitter chip, and a lumiphor, a first surface of the chip facing a first region of the lumiphor, a second surface of the chip facing a second region of the lumiphor. Also, a lighting device comprising a light emitter chip and first and second lumiphors, a first surface of the chip facing the second lumiphor, a second surface of the chip facing the first lumiphor. Also, methods of making lighting devices.

    摘要翻译: 一种照明装置,包括发射器芯片,反射杯和定位在芯片和杯之间的发光体。 此外,一种照明装置,包括发光芯片,与芯片的第一表面接合的引线和面向芯片的第二表面的荧光体。 而且,包括发光芯片和发光体的照明装置,芯片的第一表面面对发光体的第一区域,芯片的第二表面面对着荧光体的第二区域。 而且,包括光发射器芯片和第一和第二荧光体的照明装置,芯片的面向第二荧光体的第一表面,芯片的面向第一荧光体的第二表面。 另外,制作照明装置的方法。

    SOLID STATE LIGHT EMITTING DEVICE AND METHOD OF MAKING SAME
    76.
    发明申请
    SOLID STATE LIGHT EMITTING DEVICE AND METHOD OF MAKING SAME 有权
    固态发光装置及其制造方法

    公开(公告)号:US20070280624A1

    公开(公告)日:2007-12-06

    申请号:US11753103

    申请日:2007-05-24

    IPC分类号: G02B6/10

    摘要: There is provided a solid state light emitting device comprising at least one light emitting active layer structure and at least one structure selected from among: (1) a first element having at least a first region which has an index of refraction gradient, (2) a first element, at least a portion of which has an index of refraction which is lower than an index of refraction of a side of the active layer, (3) first and second elements, in which one side of the second element is positioned on a side of the active layer and the first element is positioned on the other side of the second element, and in which at least a portion of the first element has an index of refraction which is lower than the index of refraction of at least a portion of the second element. Also provided are methods of making such devices.

    摘要翻译: 提供一种固态发光器件,其包括至少一种发光有源层结构和至少一种选自以下的结构:(1)具有至少一个具有折射率梯度折射率的第一区域的第一元件,(2) 第一元件,其至少一部分的折射率低于有源层的一侧的折射率,(3)第一元件和第二元件,其中第二元件的一侧位于 有源层和第一元件的一侧位于第二元件的另一侧,并且其中第一元件的至少一部分具有的折射率低于至少一部分的折射率 的第二个元素。 还提供了制造这种装置的方法。

    LIGHTING DEVICE
    77.
    发明申请
    LIGHTING DEVICE 有权
    照明设备

    公开(公告)号:US20070274080A1

    公开(公告)日:2007-11-29

    申请号:US11751982

    申请日:2007-05-22

    IPC分类号: F21V7/00

    摘要: A first lighting device comprises at least one plural cavity element and a plurality of solid state light emitters. A second lighting device comprises at least one plural cavity element, a plurality of solid state light emitters and at least one encapsulant region, at least a portion of the plural cavity element being surrounded by the encapsulant region. Each plural cavity element has at least two optical cavities. Each optical cavity comprises a concave region in the plural cavity element. At least one solid state light emitter is present in each of at least two of the optical cavities.

    摘要翻译: 第一照明装置包括至少一个多个空腔元件和多个固态发光器。 第二照明装置包括至少一个多个腔体元件,多个固态发光器和至少一个密封剂区域,多个腔体元件的至少一部分被密封剂区域包围。 每个多个空腔元件具有至少两个光学腔。 每个光学腔包括多个腔元件中的凹入区域。 在至少两个光学腔中的每一个中存在至少一个固态光发射器。

    LIGHTING DEVICE AND METHOD OF MAKING
    78.
    发明申请
    LIGHTING DEVICE AND METHOD OF MAKING 有权
    照明装置及其制作方法

    公开(公告)号:US20070274063A1

    公开(公告)日:2007-11-29

    申请号:US11751990

    申请日:2007-05-22

    申请人: Gerald Negley

    发明人: Gerald Negley

    IPC分类号: F21V9/16

    摘要: A lighting device comprises a solid state light emitter, first and second electrodes connected to the emitter, an encapsulant region comprising a silicone compound and a supporting region. The encapsulant region extends to an external surface of the lighting device. At least a portion of the first electrode is surrounded by the supporting region. The encapsulant region and the supporting region together define an outer surface which substantially encompasses the emitter. A method of making a lighting device, comprises electrically connecting first and second electrodes to an emitter; inserting the emitter into mold cavity; inserting an encapsulant composition comprising a one silicone compound; and then inserting a second composition to substantially surround at least a portion of the first electrode.

    摘要翻译: 照明装置包括固态光发射器,连接到发射器的第一和第二电极,包含硅氧烷化合物和支撑区域的密封剂区域。 密封剂区域延伸到照明装置的外表面。 第一电极的至少一部分被支撑区域包围。 密封剂区域和支撑区域一起限定基本上包围发射体的外表面。 一种制造照明装置的方法,包括将第一和第二电极电连接到发射器; 将发射器插入模腔; 插入包含一种硅氧烷化合物的密封剂组合物; 然后插入第二组合物以基本上包围第一电极的至少一部分。

    Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
    79.
    发明申请
    Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same 有权
    包括延伸在其中的导电引线的半导体发光器件安装基板及其封装方法

    公开(公告)号:US20060157726A1

    公开(公告)日:2006-07-20

    申请号:US11035716

    申请日:2005-01-14

    IPC分类号: H01L33/00

    摘要: A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.

    摘要翻译: 用于半导体发光器件的安装衬底包括导热安装块。 安装块在其第一面中具有被构造成在其中安装半导体发光器件并且将由其中安装的半导体发光器件发射的光反射离开空腔的空腔。 插入安装块的导电引线延伸到空腔中。 导电引线与安装块电隔离,并且在空腔中具有暴露的接触部分。 导电引线可以是多个导电引线,每个导电引线在空腔中的不同位置具有暴露的接触部分。 也可以提供相关的包装方法。

    Light emitting diode arrays for direct backlighting of liquid crystal displays

    公开(公告)号:US20060139945A1

    公开(公告)日:2006-06-29

    申请号:US11022332

    申请日:2004-12-23

    IPC分类号: F21V7/04

    摘要: A display panel for a flat panel display includes a planar array of LCD devices and a planar array of LED devices that is closely spaced apart from the planar array of LCD devices, at least some of the LED devices being disposed within a periphery of the array of LCD devices such that, in operation, the planar array of LED devices provides backlighting for the planar array of LCD devices. The planar array of LED devices can include at least one solid metal block having first and second opposing metal faces. The first metal face includes therein an array of reflector cavities, and the second metal face includes therein heat sink fins that are exposed at the back face of the flat panel display.